Total properties:
46
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Patent #:
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Issue Dt:
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06/15/2004
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Application #:
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10094512
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Filing Dt:
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03/07/2002
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Publication #:
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Pub Dt:
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09/11/2003
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Title:
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ARRANGEMENT OF INTEGRATED CIRUITS IN A MEMORY MODULE
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Patent #:
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Issue Dt:
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08/16/2005
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Application #:
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10765420
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Filing Dt:
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01/27/2004
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Publication #:
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Pub Dt:
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09/23/2004
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Title:
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ARRANGEMENT OF INTEGRATED CIRCUITS IN A MEMORY MODULE
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Patent #:
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Issue Dt:
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08/16/2005
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Application #:
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10765488
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Filing Dt:
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01/27/2004
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Publication #:
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Pub Dt:
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09/23/2004
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Title:
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ARRANGEMENT OF INTEGRATED CIRCUITS IN A MEMORY MODULE
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Patent #:
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Issue Dt:
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03/29/2005
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Application #:
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10768534
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Filing Dt:
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01/30/2004
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Publication #:
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Pub Dt:
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09/23/2004
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Title:
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ARRANGEMENT OF INTEGRATED CIRCUITS IN A MEMORY MODULE
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Patent #:
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Issue Dt:
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10/23/2007
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Application #:
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11075395
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Filing Dt:
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03/07/2005
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Publication #:
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Pub Dt:
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12/22/2005
| | | | |
Title:
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HIGH-DENSITY MEMORY MODULE UTILIZING LOW-DENSITY MEMORY COMPONENTS
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Patent #:
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Issue Dt:
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08/07/2007
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Application #:
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11101155
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Filing Dt:
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04/07/2005
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Publication #:
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Pub Dt:
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03/02/2006
| | | | |
Title:
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HIGH DENSITY MEMORY MODULE USING STACKED PRINTED CIRCUIT BOARDS
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Patent #:
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Issue Dt:
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10/30/2007
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Application #:
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11173175
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Filing Dt:
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07/01/2005
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Publication #:
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Pub Dt:
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03/23/2006
| | | | |
Title:
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MEMORY MODULE DECODER
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Patent #:
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Issue Dt:
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05/12/2009
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Application #:
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11335875
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Filing Dt:
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01/19/2006
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Publication #:
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Pub Dt:
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11/23/2006
| | | | |
Title:
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MEMORY MODULE WITH A CIRCUIT PROVIDING LOAD ISOLATION AND MEMORY DOMAIN TRANSLATION
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Patent #:
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Issue Dt:
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10/28/2008
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Application #:
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11511523
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Filing Dt:
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08/28/2006
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Title:
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CIRCUIT CARD WITH FLEXIBLE CONNECTION FOR MEMORY MODULE WITH HEAT SPREADER
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Patent #:
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Issue Dt:
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11/17/2009
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Application #:
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11707625
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Filing Dt:
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02/16/2007
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Title:
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HEAT SPREADER FOR ELECTRONIC MODULES
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Patent #:
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Issue Dt:
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05/20/2008
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Application #:
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11775125
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Filing Dt:
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07/09/2007
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Publication #:
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Pub Dt:
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01/10/2008
| | | | |
Title:
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HIGH DENSITY MEMORY MODULE USING STACKED PRINTED CIRCUIT BOARDS
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Patent #:
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Issue Dt:
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11/17/2009
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Application #:
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11862931
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Filing Dt:
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09/27/2007
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Publication #:
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Pub Dt:
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03/20/2008
| | | | |
Title:
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MEMORY MODULE DECODER
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Patent #:
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Issue Dt:
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12/08/2009
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Application #:
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12052678
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Filing Dt:
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03/20/2008
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Publication #:
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Pub Dt:
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12/25/2008
| | | | |
Title:
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HIGH DENSITY MODULE HAVING AT LEAST TWO SUBSTRATES AND AT LEAST ONE THERMALLY CONDUCTIVE LAYER THEREBETWEEN
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Patent #:
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Issue Dt:
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10/12/2010
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Application #:
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12237162
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Filing Dt:
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09/24/2008
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Title:
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CIRCUIT WITH FLEXIBLE PORTION
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Patent #:
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|
Issue Dt:
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12/22/2009
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Application #:
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12408652
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Filing Dt:
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03/20/2009
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Publication #:
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Pub Dt:
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08/13/2009
| | | | |
Title:
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MEMORY MODULE WITH A CIRCUIT PROVIDING LOAD ISOLATION AND MEMORY DOMAIN TRANSLATION
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Patent #:
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|
Issue Dt:
|
04/10/2012
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Application #:
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12422853
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Filing Dt:
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04/13/2009
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Title:
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CIRCUIT PROVIDING LOAD ISOLATION AND NOISE REDUCTION
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Patent #:
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Issue Dt:
|
08/16/2011
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Application #:
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12422925
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Filing Dt:
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04/13/2009
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Title:
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MEMORY BOARD WITH SELF-TESTING CAPABILITY
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|
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Patent #:
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Issue Dt:
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09/13/2011
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Application #:
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12432591
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Filing Dt:
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04/29/2009
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Title:
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HEAT DISSIPATION FOR ELECTRONIC MODULES
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Patent #:
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Issue Dt:
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04/09/2013
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Application #:
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12504131
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Filing Dt:
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07/16/2009
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Publication #:
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Pub Dt:
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01/20/2011
| | | | |
Title:
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SYSTEM AND METHOD OF INCREASING ADDRESSABLE MEMORY SPACE ON A MEMORY BOARD
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|
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Patent #:
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|
Issue Dt:
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01/04/2011
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Application #:
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12577682
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Filing Dt:
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10/12/2009
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Publication #:
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|
Pub Dt:
|
04/15/2010
| | | | |
Title:
|
MEMORY MODULE DECODER
|
|
|
Patent #:
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|
Issue Dt:
|
11/23/2010
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Application #:
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12606136
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Filing Dt:
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10/26/2009
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Publication #:
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Pub Dt:
|
05/06/2010
| | | | |
Title:
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MODULE HAVING AT LEAST TWO SURFACES AND AT LEAST ONE THERMALLY CONDUCTIVE LAYER THEREBETWEEN
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|
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Patent #:
|
|
Issue Dt:
|
11/23/2010
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Application #:
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12617665
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Filing Dt:
|
11/12/2009
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Title:
|
HEAT SPREADER FOR MEMORY MODULES
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|
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Patent #:
|
|
Issue Dt:
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02/01/2011
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Application #:
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12629827
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Filing Dt:
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12/02/2009
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Publication #:
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Pub Dt:
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05/27/2010
| | | | |
Title:
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CIRCUIT PROVIDING LOAD ISOLATION AND MEMORY DOMAIN TRANSLATION FOR MEMORY MODULE
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|
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Patent #:
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|
Issue Dt:
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08/20/2013
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Application #:
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12761179
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Filing Dt:
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04/15/2010
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Publication #:
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Pub Dt:
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01/20/2011
| | | | |
Title:
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SYSTEM AND METHOD UTILIZING DISTRIBUTED BYTE-WISE BUFFERS ON A MEMORY MODULE
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|
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Patent #:
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|
Issue Dt:
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09/11/2012
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Application #:
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12774632
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Filing Dt:
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05/05/2010
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Title:
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SYSTEMS AND METHODS FOR REFRESHING A MEMORY MODULE
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|
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Patent #:
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|
Issue Dt:
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07/16/2013
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Application #:
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12815339
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Filing Dt:
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06/14/2010
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Title:
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SYSTEMS AND METHODS FOR HANDSHAKING WITH A MEMORY MODULE
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|
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Patent #:
|
|
Issue Dt:
|
10/11/2011
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Application #:
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12874900
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Filing Dt:
|
09/02/2010
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Title:
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CIRCUIT WITH FLEXIBLE PORTION
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|
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Patent #:
|
|
Issue Dt:
|
07/16/2013
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Application #:
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12916945
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Filing Dt:
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11/01/2010
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Title:
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MEMORY MODULE HAVING THERMAL CONDUITS
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|
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Patent #:
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|
Issue Dt:
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01/01/2013
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Application #:
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12939915
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Filing Dt:
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11/04/2010
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Publication #:
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|
Pub Dt:
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05/12/2011
| | | | |
Title:
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MODULE HAVING AT LEAST TWO SURFACES AND AT LEAST ONE THERMALLY CONDUCTIVE LAYER THEREBETWEEN
|
|
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Patent #:
|
|
Issue Dt:
|
12/20/2011
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Application #:
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12954492
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Filing Dt:
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11/24/2010
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Publication #:
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Pub Dt:
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04/21/2011
| | | | |
Title:
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CIRCUIT FOR PROVIDING CHIP-SELECT SIGNALS TO A PLURALITY OF RANKS OF A DDR MEMORY MODULE
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|
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Patent #:
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|
Issue Dt:
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03/29/2011
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Application #:
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12955711
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Filing Dt:
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11/29/2010
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Publication #:
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Pub Dt:
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04/14/2011
| | | | |
Title:
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CIRCUIT PROVIDING LOAD ISOLATION AND MEMORY DOMAIN TRANSLATION FOR MEMORY MODULE
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|
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Patent #:
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|
Issue Dt:
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12/06/2011
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Application #:
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12981380
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Filing Dt:
|
12/29/2010
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Title:
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CIRCUIT PROVIDING LOAD ISOLATION AND MEMORY DOMAIN TRANSLATION FOR MEMORY MODULE
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|
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Patent #:
|
|
Issue Dt:
|
12/20/2011
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Application #:
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13032470
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Filing Dt:
|
02/22/2011
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Title:
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CIRCUIT FOR MEMORY MODULE
|
|
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Patent #:
|
|
Issue Dt:
|
12/20/2011
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Application #:
|
13154172
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Filing Dt:
|
06/06/2011
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Title:
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CIRCUIT FOR PROVIDING CHIP-SELECT SIGNALS TO A PLURALITY OF RANKS OF A DDR MEMORY MODULE
|
|
|
Patent #:
|
|
Issue Dt:
|
01/22/2013
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Application #:
|
13183253
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Filing Dt:
|
07/14/2011
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Title:
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MEMORY BOARD WITH SELF-TESTING CAPABILITY
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|
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Patent #:
|
|
Issue Dt:
|
04/22/2014
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Application #:
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13205477
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Filing Dt:
|
08/08/2011
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Title:
|
HEAT DISSIPATION FOR ELECTRONIC MODULES
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|
|
Patent #:
|
|
Issue Dt:
|
10/16/2012
|
Application #:
|
13231870
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Filing Dt:
|
09/13/2011
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Title:
|
CIRCUIT WITH FLEXIBLE PORTION
|
|
|
Patent #:
|
|
Issue Dt:
|
06/17/2014
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Application #:
|
13287042
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Filing Dt:
|
11/01/2011
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Title:
|
MULTIRANK DDR MEMORY MODUAL WITH LOAD REDUCTION
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|
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Patent #:
|
|
Issue Dt:
|
08/20/2013
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Application #:
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13287081
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Filing Dt:
|
11/01/2011
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Title:
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CIRCUIT FOR MEMORY MODULE
|
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Patent #:
|
|
Issue Dt:
|
07/22/2014
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Application #:
|
13288850
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Filing Dt:
|
11/03/2011
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Publication #:
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Pub Dt:
|
05/03/2012
| | | | |
Title:
|
METHOD AND APPARATUS FOR OPTIMIZING DRIVER LOAD IN A MEMORY PACKAGE
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|
|
Patent #:
|
NONE
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Issue Dt:
|
|
Application #:
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13411344
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Filing Dt:
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03/02/2012
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Publication #:
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|
Pub Dt:
|
09/20/2012
| | | | |
Title:
|
METHOD AND SYSTEM FOR RESOLVING INTEROPERABILITY OF MULTIPLE TYPES OF DUAL IN-LINE MEMORY MODULES
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Patent #:
|
|
Issue Dt:
|
07/15/2014
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Application #:
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13412243
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Filing Dt:
|
03/05/2012
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Publication #:
|
|
Pub Dt:
|
10/04/2012
| | | | |
Title:
|
CIRCUIT PROVIDING LOAD ISOLATION AND NOISE REDUCTION
|
|
|
Patent #:
|
|
Issue Dt:
|
12/03/2013
|
Application #:
|
13584679
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Filing Dt:
|
08/13/2012
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Title:
|
CIRCUIT AND METHOD FOR REFRESHING A MEMORY MODULE
|
|
|
Patent #:
|
|
Issue Dt:
|
10/21/2014
|
Application #:
|
13653254
|
Filing Dt:
|
10/16/2012
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Title:
|
ELECTRONIC MODULE WITH FLEXIBLE PORTION
|
|
|
Patent #:
|
|
Issue Dt:
|
03/03/2015
|
Application #:
|
13731014
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Filing Dt:
|
12/30/2012
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Title:
|
MODULE HAVING AT LEAST ONE THERMALLY CONDUCTIVE LAYER BETWEEN PRINTED CIRCUIT BOARDS
|
|
|
Patent #:
|
|
Issue Dt:
|
04/01/2014
|
Application #:
|
13745790
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Filing Dt:
|
01/19/2013
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Title:
|
Apparatus and Method for Self-Test in a Multi-Rank Memory Module
|
|