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Reel/Frame:030962/0142   Pages: 25
Recorded: 06/27/2013
Attorney Dkt #:6757-38500
Conveyance: CORRECTIVE ASSIGNMENT TO CORRECT THE STATE OF INCORPORATION WITHIN THE ASSIGNMENT DOCUMENT PREVIOUSLY RECORDED ON REEL 011177, FRAME 0921.ASSIGNORS HEREBY CONFIRMS THE STATE OF INCORPORATION IS TEXAS.
Total properties: 57
1
Patent #:
5221642
Issue Dt:
06/22/1993
Application #:
07746268
Filing Dt:
08/15/1991
Title:
LEAD-ON-CHIP INTEGRATED CIRCUIT FABRICATION METHOD
2
Patent #:
5448450
Issue Dt:
09/05/1995
Application #:
07783737
Filing Dt:
10/28/1991
Title:
LEAD-ON-CHIP INTEGRATED CIRCUIT APPARATUS
3
Patent #:
5337077
Issue Dt:
08/09/1994
Application #:
07855063
Filing Dt:
03/20/1992
Title:
ELECTROMAGNETIC SHUTTER
4
Patent #:
5371866
Issue Dt:
12/06/1994
Application #:
07891609
Filing Dt:
06/01/1992
Title:
SIMULCAST STANDARD MULTICHIP MEMORY ADDRESSING SYSTEM
5
Patent #:
5236117
Issue Dt:
08/17/1993
Application #:
07903056
Filing Dt:
06/22/1992
Title:
IMPACT SOLDER METHOD AND APPARATUS
6
Patent #:
5484959
Issue Dt:
01/16/1996
Application #:
07990334
Filing Dt:
12/11/1992
Title:
HIGH DENSITY LEAD-ON-PACKAGE FABRICATION METHOD AND APPARATUS
7
Patent #:
5369056
Issue Dt:
11/29/1994
Application #:
08037830
Filing Dt:
03/29/1993
Title:
WARP-RESISTENT ULTRA-THIN INTEGRATED CIRCUIT PACKAGE FABRICATION METHOD
8
Patent #:
5367766
Issue Dt:
11/29/1994
Application #:
08043196
Filing Dt:
04/05/1993
Title:
ULTRA HIGH DENSITY INTEGRATED CIRCUIT PACKAGES METHOD
9
Patent #:
5279029
Issue Dt:
01/18/1994
Application #:
08059401
Filing Dt:
05/11/1993
Title:
ULTRA HIGH DENSITY INTEGRATED CIRCUIT PACKAGES METHOD
10
Patent #:
5446620
Issue Dt:
08/29/1995
Application #:
08133395
Filing Dt:
10/08/1993
Title:
ULTRA HIGH DENSITY INTEGRATED CIRCUIT PACKAGES METHOD AND APPARATUS
11
Patent #:
5420751
Issue Dt:
05/30/1995
Application #:
08133397
Filing Dt:
10/08/1993
Title:
ULTRA HIGH DENSITY MODULAR INTEGRATED CIRCUIT PACKAGE
12
Patent #:
5498906
Issue Dt:
03/12/1996
Application #:
08153511
Filing Dt:
11/17/1993
Title:
CAPACITIVE COUPLING CONFIGURATION FOR AN INTEGRATED CIRCUIT PACKAGE
13
Patent #:
5369058
Issue Dt:
11/29/1994
Application #:
08206301
Filing Dt:
03/04/1994
Title:
WARP-RESISTENT ULTRA-THIN INTEGRATED CIRCUIT PACKAGE FABRICATION METHOD
14
Patent #:
5475920
Issue Dt:
12/19/1995
Application #:
08206311
Filing Dt:
03/04/1994
Title:
METHOD OF ASSEMBLING ULTRA HIGH DENSITY INTEGRATED CIRCUIT PACKAGES
15
Patent #:
5455740
Issue Dt:
10/03/1995
Application #:
08206829
Filing Dt:
03/07/1994
Title:
BUS COMMUNICATION SYSTEM FOR STACKED HIGH DENSITY INTEGRATED CIRCUIT PACKAGES
16
Patent #:
5581121
Issue Dt:
12/03/1996
Application #:
08280968
Filing Dt:
07/27/1994
Title:
WARP-RESISTANT ULTRA-THIN INTEGRATED CIRCUIT PACKAGE
17
Patent #:
5561591
Issue Dt:
10/01/1996
Application #:
08289468
Filing Dt:
08/12/1994
Title:
MULTI-SIGNAL RAIL ASSEMBLY WITH IMPEDANCE CONTROL FOR A THREE-DIMENSIONAL HIGH DENSITY INTEGRATED CIRCUIT PACKAGE
18
Patent #:
5566051
Issue Dt:
10/15/1996
Application #:
08298544
Filing Dt:
08/30/1994
Title:
ULTRA HIGH DENSITY INTEGRATED CIRCUIT PACKAGES METHOD AND APPARATUS
19
Patent #:
5702985
Issue Dt:
12/30/1997
Application #:
08325719
Filing Dt:
10/19/1994
Title:
HERMETICALLY SEALED CERAMIC INTEGRATED CIRCUIT HEAT DISSIPATING PACKAGE FABRICATION METHOD
20
Patent #:
5572065
Issue Dt:
11/05/1996
Application #:
08328338
Filing Dt:
10/24/1994
Title:
HERMETICALLY SEALED CERAMIC INTEGRATED CIRCUIT HEAT DISSIPATING PACKAGE
21
Patent #:
5543664
Issue Dt:
08/06/1996
Application #:
08375747
Filing Dt:
01/20/1995
Title:
ULTRA HIGH DENSITY INTEGRATED CIRCUIT PACKAGE
22
Patent #:
5528075
Issue Dt:
06/18/1996
Application #:
08375874
Filing Dt:
01/20/1995
Title:
LEAD-ON-CHIP INTEGRATED CIRCUIT APPARATUS
23
Patent #:
5592364
Issue Dt:
01/07/1997
Application #:
08377578
Filing Dt:
01/24/1995
Title:
HIGH DENSITY INTEGRATED CIRCUIT MODULE WITH COMPLEX ELECTRICAL INTERCONNECT RAILS
24
Patent #:
5804870
Issue Dt:
09/08/1998
Application #:
08380541
Filing Dt:
01/30/1995
Title:
HERMETICALLY SEALED INTEGRATED CIRCUIT LEAD-ON PACKAGE CONFIGURATION
25
Patent #:
5499160
Issue Dt:
03/12/1996
Application #:
08380543
Filing Dt:
01/30/1995
Title:
HIGH DENSITY INTEGRATED CIRCUIT MODULE WITH SNAP-ON RAIL ASSEMBLIES
26
Patent #:
5550711
Issue Dt:
08/27/1996
Application #:
08436902
Filing Dt:
05/08/1995
Title:
ULTRA HIGH DENSITY INTEGRATED CIRCUIT PACKAGES
27
Patent #:
5479318
Issue Dt:
12/26/1995
Application #:
08440500
Filing Dt:
05/12/1995
Title:
BUS COMMUNICATION SYSTEM FOR STACKED HIGH DENSITY INTEGRATED CIRCUIT PACKAGES WITH TRIFURCATED DISTAL LEAD ENDS
28
Patent #:
5493476
Issue Dt:
02/20/1996
Application #:
08445848
Filing Dt:
05/22/1995
Title:
BUS COMMUNICATION SYSTEM FOR STACKED HIGH DENSITY INTEGRATED CIRCUIT PACKAGES WITH BIFURCATED DISTAL LEAD ENDS
29
Patent #:
5605592
Issue Dt:
02/25/1997
Application #:
08445895
Filing Dt:
05/22/1995
Title:
METHOD OF MANUFACTURING A BUS COMMUNICATION SYSTEM FOR STACKED HIGH DENSITY INTEGRATED CIRCUIT PACKAGES
30
Patent #:
5644161
Issue Dt:
07/01/1997
Application #:
08473593
Filing Dt:
06/07/1995
Title:
ULTRA-HIGH DENSITY WARP-RESISTANT MEMORY MODULE
31
Patent #:
5631193
Issue Dt:
05/20/1997
Application #:
08497565
Filing Dt:
06/30/1995
Title:
HIGH DENSITY LEAD-ON-PACKAGE FABRICATION METHOD AND APPARATUS
32
Patent #:
5552963
Issue Dt:
09/03/1996
Application #:
08506309
Filing Dt:
07/24/1995
Title:
BUS COMMUNICATION SYSTEM FOR STACKED HIGH DENSITY INTEGRATED CIRCUIT PACKAGES
33
Patent #:
RE36229
Issue Dt:
06/15/1999
Application #:
08510729
Filing Dt:
11/20/1995
Title:
SIMULCAST STANDARD MULTICHIP MEMORY ADDRESSING SYSTEM
34
Patent #:
5801437
Issue Dt:
09/01/1998
Application #:
08514294
Filing Dt:
08/11/1995
Title:
THREE-DIMENSIONAL WARP-RESISTANT INTEGRATED CIRCUIT MODULE METHOD AND APPARATUS
35
Patent #:
5654877
Issue Dt:
08/05/1997
Application #:
08516848
Filing Dt:
08/18/1995
Title:
LEAD-ON-CHIP INTEGRATED CIRCUIT APPARATUS
36
Patent #:
5615475
Issue Dt:
04/01/1997
Application #:
08517485
Filing Dt:
08/21/1995
Title:
METHOD OF MANUFACTURING AN INTEGRATED PACKAGE HAVING A PAIR OF DIE ON A COMMON LEAD FRAME
37
Patent #:
5588205
Issue Dt:
12/31/1996
Application #:
08523201
Filing Dt:
09/05/1995
Title:
METHOD OF MANUFACTURING A HIGH DENSITY INTEGRATED CIRCUIT MODULE HAVING COMPLEX ELECTRICAL INTERCONNECT RAILS
38
Patent #:
5541812
Issue Dt:
07/30/1996
Application #:
08526470
Filing Dt:
09/11/1995
Title:
BUS COMMUNICATION SYSTEM FOR STACKED HIGH DENSITY INTEGRATED CIRCUIT PACKAGES HAVING AN INTERMEDIATE LEAD FRAME
39
Patent #:
5585668
Issue Dt:
12/17/1996
Application #:
08601880
Filing Dt:
02/15/1996
Title:
INTEGRATED CIRCUIT PACKAGE WITH OVERLAPPED DIE ON A COMMON LEAD FRAME
40
Patent #:
5586009
Issue Dt:
12/17/1996
Application #:
08630083
Filing Dt:
04/09/1996
Title:
BUS COMMUNICATION SYSTEM FOR STACKED HIGH DENSITY INTEGRATED CIRCUIT PACKAGES
41
Patent #:
5864175
Issue Dt:
01/26/1999
Application #:
08644491
Filing Dt:
05/10/1996
Title:
WARP-RESISTENT ULTRA-THIN INTEGRATED CIRCUIT PACKAGE FABRICATION METHOD
42
Patent #:
5978227
Issue Dt:
11/02/1999
Application #:
08645319
Filing Dt:
05/13/1996
Title:
INTEGRATED CIRCUIT PACKAGES HAVING AN EXTERNALLY MOUNTED LEAD FRAME HAVING BIFURCATED DISTAL LEAD ENDS
43
Patent #:
5778522
Issue Dt:
07/14/1998
Application #:
08650721
Filing Dt:
05/20/1996
Title:
METHOD OF MANUFACTURING A HIGH DENSITY INTEGRATED CIRCUIT MODULE WITH COMPLEX ELECTRICAL INTERCONNECT RAILS HAVING ELECTRICAL INTERCONNECT STRAIN RELIEF
44
Patent #:
5843807
Issue Dt:
12/01/1998
Application #:
08686985
Filing Dt:
07/25/1996
Title:
METHOD OF MANUFACTURING AN UKTRA-HIGH DENSITY WARP-RESISTANT MEMORY MODULE
45
Patent #:
5828125
Issue Dt:
10/27/1998
Application #:
08758839
Filing Dt:
12/02/1996
Title:
ULTRA-HIGH DENSITY WARP-RESISTANT MEMORY MODULE
46
Patent #:
5783464
Issue Dt:
07/21/1998
Application #:
08798556
Filing Dt:
02/11/1997
Title:
METHOD OF FORMING A HERMETICALLY SEALED CIRCUIT LEAD-ON PACKAGE
47
Patent #:
5945732
Issue Dt:
08/31/1999
Application #:
08815537
Filing Dt:
03/12/1997
Title:
APPARATUS AND METHOD OF MANUFACTURING A WARP RESISTANT THERMALLY CONDUCTIVE INTEGRATED CIRCUIT PACKAGE
48
Patent #:
5895232
Issue Dt:
04/20/1999
Application #:
08888850
Filing Dt:
07/07/1997
Title:
THREE-DIMENSIONAL WARP-RESISTANT INTEGRATED CIRCUIT MODULE METHOD AND APPARATUS
49
Patent #:
6049123
Issue Dt:
04/11/2000
Application #:
08935380
Filing Dt:
09/22/1997
Title:
ULTRA HIGH DENSITY INTEGRATED CIRCUIT PACKAGES
50
Patent #:
6025642
Issue Dt:
02/15/2000
Application #:
08937200
Filing Dt:
09/22/1997
Title:
ULTRA HIGH DENSITY INTEGRATED CIRCUIT PACKAGES
51
Patent #:
5960539
Issue Dt:
10/05/1999
Application #:
09021744
Filing Dt:
02/11/1998
Title:
METHOD OF MAKING HIGH DENSITY CIRCUIT MODULE
52
Patent #:
6190939
Issue Dt:
02/20/2001
Application #:
09115293
Filing Dt:
07/14/1998
Title:
METHOD OF MANUFACTURING A WARP RESISTANT THERMALLY CONDUCTIVE CIRCUIT PACKAGE
53
Patent #:
6282210
Issue Dt:
08/28/2001
Application #:
09133297
Filing Dt:
08/12/1998
Title:
CLOCK DRIVER WITH INSTANTANEOUSLY SELECTABLE PHASE AND METHOD FOR USE IN DATA COMMUNICATION SYSTEM
54
Patent #:
6310392
Issue Dt:
10/30/2001
Application #:
09221350
Filing Dt:
12/28/1998
Title:
STACKED MICRO BALL GRID ARRAY PACKAGES
55
Patent #:
6205654
Issue Dt:
03/27/2001
Application #:
09222263
Filing Dt:
12/28/1998
Title:
METHOD OF MANUFACTURING A SURFACE MOUNT PACKAGE
56
Patent #:
6288907
Issue Dt:
09/11/2001
Application #:
09343432
Filing Dt:
06/30/1999
Title:
HIGH DENSITY INTEGRATED CIRCUIT MODULE WITH COMPLEX ELECTRICAL INTERCONNECT RAILS HAVING ELECTRICAL INTERCONNECT STRAIN RELIEF
57
Patent #:
6404662
Issue Dt:
06/11/2002
Application #:
09646724
Filing Dt:
03/07/2001
Title:
RAMBUS STAKPAK
Assignor
1
STAKTEK CORPORATION
Exec Dt:
09/27/2000
Assignee
1
STAKTEK GROUP L.P.
8900 SHOAL CREEK
AUSTIN, TEXAS 78758
Correspondence name and address
DAWN DELUCA
1120 SOUTH CAPITAL OF TEXAS HIGHWAY
BUILDING 2, SUITE 300
AUSTIN, TEXAS 78746

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