|
Total properties:
11
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/12/2013
|
Application #:
|
11917737
|
Filing Dt:
|
04/28/2008
|
|
Publication #:
|
|
Pub Dt:
|
08/28/2008
| | | | |
|
Title:
|
METHOD FOR MANUFACTURING A CIRCUIT BOARD STRUCTURE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/24/2015
|
Application #:
|
12293412
|
Filing Dt:
|
09/17/2008
|
|
Publication #:
|
|
Pub Dt:
|
05/28/2009
| | | | |
|
Title:
|
MANUFACTURE OF A CIRCUIT BOARD CONTAINING A COMPONENT
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/25/2014
|
Application #:
|
12506519
|
Filing Dt:
|
07/21/2009
|
|
Publication #:
|
|
Pub Dt:
|
03/04/2010
| | | | |
|
Title:
|
MULTI-CHIP PACKAGE AND MANUFACTURING METHOD
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/23/2016
|
Application #:
|
12652399
|
Filing Dt:
|
01/05/2010
|
|
Publication #:
|
|
Pub Dt:
|
07/08/2010
| | | | |
|
Title:
|
RIGID-FLEX MODULE AND MANUFACTURING METHOD
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/24/2015
|
Application #:
|
12700812
|
Filing Dt:
|
02/05/2010
|
|
Publication #:
|
|
Pub Dt:
|
08/12/2010
| | | | |
|
Title:
|
ELECTRONIC MODULE WITH EMI PROTECTION
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/27/2014
|
Application #:
|
12842055
|
Filing Dt:
|
07/23/2010
|
|
Publication #:
|
|
Pub Dt:
|
01/26/2012
| | | | |
|
Title:
|
ELECTRONIC MODULE WITH EMBEDDED JUMPER CONDUCTOR
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/16/2016
|
Application #:
|
12872538
|
Filing Dt:
|
08/31/2010
|
|
Publication #:
|
|
Pub Dt:
|
03/01/2012
| | | | |
|
Title:
|
METHOD FOR CONTROLLING WARPAGE WITHIN ELECTRONIC PRODUCTS AND AN ELECTRONIC PRODUCT
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/15/2014
|
Application #:
|
12990785
|
Filing Dt:
|
11/03/2010
|
|
Publication #:
|
|
Pub Dt:
|
03/17/2011
| | | | |
|
Title:
|
CIRCUIT MODULE AND METHOD OF MANUFACTURING THE SAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/22/2014
|
Application #:
|
13118650
|
Filing Dt:
|
05/31/2011
|
|
Publication #:
|
|
Pub Dt:
|
12/01/2011
| | | | |
|
Title:
|
METHOD FOR MANUFACTURING AN ELECTRONIC MODULE AND AN ELECTRONIC MODULE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/29/2016
|
Application #:
|
13698670
|
Filing Dt:
|
03/25/2013
|
|
Publication #:
|
|
Pub Dt:
|
07/11/2013
| | | | |
|
Title:
|
MANUFACTURING METHOD AND ELECTRONIC MODULE WITH NEW ROUTING POSSIBILITIES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/11/2017
|
Application #:
|
14076292
|
Filing Dt:
|
11/11/2013
|
|
Publication #:
|
|
Pub Dt:
|
03/06/2014
| | | | |
|
Title:
|
Method for Manufacturing a Circuit Board Structure
|
|
