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Patent #:
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Issue Dt:
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04/25/2006
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Application #:
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10008466
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Filing Dt:
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11/09/2001
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Publication #:
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Pub Dt:
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10/24/2002
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Title:
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METHODS OF POSITIONING COMPONENTS USING LIQUID PRIME MOVERS AND RELATED STRUCTURES
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Patent #:
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Issue Dt:
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11/01/2005
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Application #:
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10601938
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Filing Dt:
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06/23/2003
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Publication #:
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Pub Dt:
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03/18/2004
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Title:
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ELECTRONIC STRUCTURES INCLUDING CONDUCTIVE SHUNT LAYERS
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Patent #:
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Issue Dt:
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02/24/2009
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Application #:
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10689976
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Filing Dt:
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10/21/2003
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Publication #:
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Pub Dt:
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07/01/2004
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Title:
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STACKED ELECTRONIC STRUCTURES INCLUDING OFFSET SUBSTRATES
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Patent #:
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Issue Dt:
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07/25/2006
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Application #:
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10780529
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Filing Dt:
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02/17/2004
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Publication #:
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Pub Dt:
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10/21/2004
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Title:
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METHODS OF SELECTIVELY BUMPING INTEGRATED CIRCUIT SUBSTRATES AND RELATED STRUCTURES
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Patent #:
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Issue Dt:
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01/02/2007
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Application #:
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10790967
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Filing Dt:
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03/02/2004
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Publication #:
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Pub Dt:
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09/02/2004
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Title:
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LOW TEMPERATURE METHODS OF BONDING COMPONENTS AND RELATED STRUCTURES
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Patent #:
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Issue Dt:
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02/23/2010
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Application #:
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10837830
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Filing Dt:
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05/03/2004
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Publication #:
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Pub Dt:
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10/21/2004
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Title:
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ELECTRONIC DEVICES INCLUDING METALLURGY STRUCTURES FOR WIRE AND SOLDER BONDING
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Patent #:
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Issue Dt:
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07/17/2007
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Application #:
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10879411
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Filing Dt:
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06/29/2004
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Publication #:
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Pub Dt:
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01/27/2005
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Title:
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METHODS OF FORMING CONDUCTIVE STRUCTURES INCLUDING TITANIUM-TUNGSTEN BASE LAYERS AND RELATED STRUCTURES
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Patent #:
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Issue Dt:
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05/23/2006
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Application #:
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10965640
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Filing Dt:
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10/13/2004
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Publication #:
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Pub Dt:
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06/23/2005
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Title:
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METHODS OF PROVIDING SOLDER STRUCTURES FOR OUT PLANE CONNECTIONS
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Patent #:
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Issue Dt:
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09/23/2008
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Application #:
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11075474
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Filing Dt:
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03/09/2005
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Publication #:
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Pub Dt:
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09/29/2005
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Title:
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METHODS OF FORMING BUMPS USING BARRIER LAYERS AS ETCH MASKS
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Patent #:
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Issue Dt:
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06/16/2009
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Application #:
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11170220
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Filing Dt:
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06/29/2005
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Publication #:
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Pub Dt:
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02/09/2006
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Title:
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METHODS OF FORMING LEAD FREE SOLDER BUMPS
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Patent #:
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Issue Dt:
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05/08/2007
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Application #:
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11213414
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Filing Dt:
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08/26/2005
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Publication #:
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Pub Dt:
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12/22/2005
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Title:
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OPTICAL STRUCTURES INCLUDING LIQUID BUMPS AND RELATED METHODS
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Patent #:
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Issue Dt:
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11/20/2007
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Application #:
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11226569
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Filing Dt:
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09/14/2005
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Publication #:
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Pub Dt:
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01/12/2006
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Title:
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METHODS OF FORMING ELECTRONIC STRUCTURES INCLUDING CONDUCTIVE SHUNT LAYERS AND RELATED STRUCTURES
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Patent #:
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Issue Dt:
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05/12/2009
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Application #:
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11270366
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Filing Dt:
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11/09/2005
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Publication #:
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Pub Dt:
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04/13/2006
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Title:
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NON-CIRCULAR VIA HOLES FOR BUMPING PADS AND RELATED STRUCTURES
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Patent #:
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Issue Dt:
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02/09/2010
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Application #:
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11362964
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Filing Dt:
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02/27/2006
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Publication #:
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Pub Dt:
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06/29/2006
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Title:
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SOLDER STRUCTURES FOR OUT OF PLANE CONNECTIONS
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Patent #:
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Issue Dt:
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08/25/2009
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Application #:
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11446341
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Filing Dt:
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06/02/2006
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Publication #:
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Pub Dt:
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10/19/2006
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Title:
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ELECTRONIC DEVICES INCLUDING OFFSET CONDUCTIVE BUMPS
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Patent #:
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Issue Dt:
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06/23/2009
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Application #:
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11765648
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Filing Dt:
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06/20/2007
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Publication #:
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Pub Dt:
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10/18/2007
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Title:
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CONDUCTIVE STRUCTURES INCLUDING TITANIUM-TUNGSTEN BASE LAYERS
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Patent #:
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Issue Dt:
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02/01/2011
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Application #:
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11868785
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Filing Dt:
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10/08/2007
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Publication #:
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Pub Dt:
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01/31/2008
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Title:
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METHODS OF FORMING ELECTRONIC STRUCTURES INCLUDING CONDUCTIVE SHUNT LAYERS AND RELATED STRUCTURES
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Patent #:
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Issue Dt:
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09/16/2014
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Application #:
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12183778
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Filing Dt:
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07/31/2008
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Title:
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STACKED INVERTED FLIP CHIP PACKAGE AND FABRICATION METHOD
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Patent #:
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Issue Dt:
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11/16/2010
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Application #:
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12194999
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Filing Dt:
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08/20/2008
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Publication #:
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Pub Dt:
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12/18/2008
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Title:
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ELECTRONIC STRUCTURES INCLUDING BARRIER LAYERS DEFINING LIPS
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Patent #:
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Issue Dt:
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01/01/2013
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Application #:
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12387691
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Filing Dt:
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05/05/2009
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Title:
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BUILDUP DIELECTRIC LAYER HAVING METALLIZATION PATTERN SEMICONDUCTOR PACKAGE FABRICATION METHOD
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Patent #:
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Issue Dt:
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11/23/2010
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Application #:
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12437632
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Filing Dt:
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05/08/2009
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Publication #:
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Pub Dt:
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08/27/2009
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Title:
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SOLDER STRUCTURES INCLUDING BARRIER LAYERS WITH NICKEL AND/OR COPPER
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Patent #:
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Issue Dt:
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01/07/2014
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Application #:
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12474009
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Filing Dt:
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05/28/2009
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Title:
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STACKABLE PROTRUDING VIA PACKAGE AND METHOD
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Patent #:
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Issue Dt:
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10/21/2014
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Application #:
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12481512
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Filing Dt:
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06/09/2009
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Title:
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FRAME INTERCONNECT FOR CONCENTRATED PHOTOVOLTAIC MODULE
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Patent #:
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Issue Dt:
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07/17/2012
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Application #:
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12483913
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Filing Dt:
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06/12/2009
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Title:
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STACKABLE VIA PACKAGE AND METHOD
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Patent #:
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Issue Dt:
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06/25/2013
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Application #:
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12537048
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Filing Dt:
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08/06/2009
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Title:
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STACKABLE VARIABLE HEIGHT VIA PACKAGE AND METHOD
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Patent #:
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Issue Dt:
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05/14/2013
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Application #:
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12540593
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Filing Dt:
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08/13/2009
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Title:
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SEMICONDUCTOR DEVICE WITH METAL DAM AND FABRICATING METHOD
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Patent #:
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Issue Dt:
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01/29/2013
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Application #:
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12548354
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Filing Dt:
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08/26/2009
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Publication #:
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Pub Dt:
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03/03/2011
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Title:
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SEMICONDUCTOR DEVICE WITH ELECTROMAGNETIC INTERFERENCE SHIELDING
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Patent #:
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Issue Dt:
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05/21/2013
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Application #:
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12562387
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Filing Dt:
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09/18/2009
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Publication #:
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Pub Dt:
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03/24/2011
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Title:
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STACKABLE WAFER LEVEL PACKAGE AND FABRICATING METHOD THEREOF
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Patent #:
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Issue Dt:
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10/08/2013
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Application #:
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12568041
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Filing Dt:
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09/28/2009
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Title:
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ROUTABLE SINGLE LAYER SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING SAME
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Patent #:
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Issue Dt:
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04/30/2013
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Application #:
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12569300
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Filing Dt:
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09/29/2009
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Title:
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SHIELDED EMBEDDED ELECTRONIC COMPONENT SUBSTRATE FABRICATION METHOD AND STRUCTURE
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Patent #:
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Issue Dt:
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08/05/2014
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Application #:
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12573466
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Filing Dt:
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10/05/2009
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Title:
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FAN OUT BUILD UP SUBSTRATE STACKABLE PACKAGE AND METHOD
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Patent #:
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Issue Dt:
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09/23/2014
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Application #:
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12577064
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Filing Dt:
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10/09/2009
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Title:
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CONCENTRATED PHOTOVOLTAIC RECEIVER PACKAGE WITH BUILT-IN CONNECTOR
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Patent #:
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Issue Dt:
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01/29/2013
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Application #:
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12589500
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Filing Dt:
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10/23/2009
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Title:
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SHIELDED PACKAGE HAVING SHIELD LID
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Patent #:
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Issue Dt:
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10/21/2014
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Application #:
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12626512
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Filing Dt:
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11/25/2009
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Title:
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THROUGH WAFER VIA STRUCTURES FOR CONCENTRATED PHOTOVOLTAIC CELLS
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Patent #:
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Issue Dt:
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02/05/2013
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Application #:
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12627484
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Filing Dt:
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11/30/2009
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Title:
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BEND TEST METHOD AND APPARATUS FOR FLIP CHIP DEVICES
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Patent #:
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Issue Dt:
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01/20/2015
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Application #:
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12630586
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Filing Dt:
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12/03/2009
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Title:
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THIN STACKABLE PACKAGE AND METHOD
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Patent #:
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Issue Dt:
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06/27/2017
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Application #:
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12632170
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Filing Dt:
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12/07/2009
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Title:
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METHOD OF FORMING A PLURALITY OF ELECTRONIC COMPONENT PACKAGES
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Patent #:
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Issue Dt:
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01/05/2016
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Application #:
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12690741
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Filing Dt:
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01/20/2010
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Title:
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TRACE STACKING STRUCTURE AND METHOD
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Patent #:
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Issue Dt:
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09/17/2013
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Application #:
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12692397
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Filing Dt:
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01/22/2010
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Title:
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FLEX CIRCUIT PACKAGE AND METHOD
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Patent #:
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Issue Dt:
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07/10/2012
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Application #:
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12692522
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Filing Dt:
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01/22/2010
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Title:
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EDGE MOUNT SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
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06/12/2012
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Application #:
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12708033
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Filing Dt:
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02/18/2010
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Title:
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TOP FEATURE PACKAGE AND METHOD
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Patent #:
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Issue Dt:
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08/07/2012
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Application #:
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12708385
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Filing Dt:
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02/18/2010
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Title:
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POGO PIN INSERTING DEVICE FOR TESTING SEMICONDUCTOR DEVICES AND METHOD THEREFOR
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Patent #:
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Issue Dt:
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12/10/2013
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Application #:
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12708432
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Filing Dt:
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02/18/2010
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Title:
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SEMICONDUCTOR DEVICE HAVING CONDUCTIVE PADS TO PREVENT SOLDER REFLOW
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Patent #:
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Issue Dt:
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12/31/2013
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Application #:
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12727608
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Filing Dt:
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03/19/2010
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Title:
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SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF
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Patent #:
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Issue Dt:
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01/29/2013
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Application #:
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12728119
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Filing Dt:
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03/19/2010
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Title:
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SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
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Patent #:
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Issue Dt:
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10/22/2013
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Application #:
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12730062
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Filing Dt:
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03/23/2010
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Title:
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SEMICONDUCTOR PACKAGE THERMAL TAPE WINDOW FRAME FOR HEAT SINK ATTACHMENT
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Patent #:
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Issue Dt:
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10/23/2012
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Application #:
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12751842
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Filing Dt:
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03/31/2010
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Title:
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SEMICONDUCTOR DEVICE FOR IMPROVING ELECTRICAL AND MECHANICAL CONNECTIVITY OF CONDUCTIVE PILLERS AND METHOD THEREFOR
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Patent #:
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Issue Dt:
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12/04/2012
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Application #:
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12754837
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Filing Dt:
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04/06/2010
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Title:
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THROUGH VIA NUB REVEAL METHOD AND STRUCTURE
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Patent #:
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Issue Dt:
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02/03/2015
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Application #:
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12779784
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Filing Dt:
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05/13/2010
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Title:
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SHIELDED ELECTRONIC COMPONENT PACKAGE AND METHOD
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Patent #:
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Issue Dt:
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10/30/2012
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Application #:
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12787238
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Filing Dt:
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05/25/2010
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Title:
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STACKABLE TREATED VIA PACKAGE AND METHOD
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Patent #:
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Issue Dt:
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10/23/2012
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Application #:
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12788845
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Filing Dt:
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05/27/2010
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Title:
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SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF
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Patent #:
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Issue Dt:
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01/15/2013
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Application #:
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12791472
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Filing Dt:
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06/01/2010
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Title:
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CONDUCTIVE POLYMER LID FOR A SENSOR PACKAGE AND METHOD THEREFOR
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Patent #:
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Issue Dt:
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03/18/2014
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Application #:
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12800757
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Filing Dt:
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05/21/2010
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Title:
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BLIND VIA CAPTURE PAD STRUCTURE FABRICATION METHOD
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Patent #:
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Issue Dt:
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06/07/2016
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Application #:
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12815260
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Filing Dt:
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06/14/2010
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Title:
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CONCENTRATED PHOTOVOLTAIC RECEIVER MODULE WITH IMPROVED OPTICAL LIGHT GUIDE ASSEMBLY
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Patent #:
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Issue Dt:
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08/13/2013
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Application #:
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12817923
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Filing Dt:
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06/17/2010
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Title:
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SYSTEM AND METHOD FOR LOWERING CONTACT RESISTANCE OF THE RADIO FREQUENCY (RF) SHIELD TO GROUND
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Patent #:
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Issue Dt:
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08/19/2014
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Application #:
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12830138
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Filing Dt:
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07/02/2010
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Title:
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MOLDED LIGHT GUIDE FOR CONCENTRATED PHOTOVOLTAIC RECEIVER MODULE
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Patent #:
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Issue Dt:
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11/27/2012
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Application #:
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12832202
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Filing Dt:
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07/08/2010
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Title:
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THIN STACKED INTERPOSER PACKAGE
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Patent #:
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Issue Dt:
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11/27/2012
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Application #:
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12832202
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Filing Dt:
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07/08/2010
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Title:
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THIN STACKED INTERPOSER PACKAGE
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Patent #:
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Issue Dt:
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08/16/2016
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Application #:
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12834682
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Filing Dt:
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07/12/2010
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Title:
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TOP PORT MEMS MICROPHONE PACKAGE AND METHOD
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Patent #:
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Issue Dt:
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12/25/2012
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Application #:
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12846973
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Filing Dt:
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07/30/2010
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Title:
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STACKABLE PLASMA CLEANED VIA PACKAGE AND METHOD
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Patent #:
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Issue Dt:
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05/14/2013
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Application #:
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12848820
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Filing Dt:
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08/02/2010
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Title:
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THROUGH VIA CONNECTED BACKSIDE EMBEDDED CIRCUIT FEATURES STRUCTURE AND METHOD
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Patent #:
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Issue Dt:
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05/06/2014
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Application #:
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12848833
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Filing Dt:
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08/02/2010
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Title:
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FINGERPRINT SENSOR PACKAGE AND METHOD
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Patent #:
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Issue Dt:
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10/08/2013
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Application #:
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12881905
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Filing Dt:
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09/14/2010
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Title:
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CONDUCTIVE PASTE AND MOLD FOR ELECTRICAL CONNECTION OF PHOTOVOLTAIC DIE TO SUBSTRATE
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Patent #:
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Issue Dt:
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07/16/2013
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Application #:
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12898192
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Filing Dt:
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10/05/2010
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Title:
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SEMICONDUCTOR DEVICE HAVING THROUGH ELECTRODES PROTRUDING FROM DIELECTRIC LAYER
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Patent #:
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Issue Dt:
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07/16/2013
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Application #:
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12907430
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Filing Dt:
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10/19/2010
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Publication #:
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Pub Dt:
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02/17/2011
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Title:
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ELECTRONIC STRUCTURES INCLUDING BARRIER LAYERS AND/OR OXIDATION BARRIERS DEFINING LIPS AND RELATED METHODS
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Patent #:
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Issue Dt:
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10/30/2012
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Application #:
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12912490
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Filing Dt:
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10/26/2010
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Title:
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SEMICONDUCTOR DEVICE INCLUDING LEADFRAME WITH INCREASED I/O
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Patent #:
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Issue Dt:
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12/25/2012
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Application #:
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12913325
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Filing Dt:
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10/27/2010
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Title:
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MECHANICAL TAPE SEPARATION PACKAGE AND METHOD
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Patent #:
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Issue Dt:
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03/03/2015
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Application #:
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12913376
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Filing Dt:
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10/27/2010
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Title:
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LOW STRESS SUBSTRATE AND FORMATION METHOD
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Patent #:
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Issue Dt:
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07/09/2013
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Application #:
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12917185
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Filing Dt:
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11/01/2010
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Title:
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STACKABLE PACKAGE AND METHOD
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Patent #:
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Issue Dt:
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06/19/2012
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Application #:
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12924493
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Filing Dt:
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09/27/2010
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Title:
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STACKED REDISTRIBUTION LAYER (RDL) DIE ASSEMBLY PACKAGE
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Patent #:
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Issue Dt:
|
06/16/2015
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Application #:
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12924918
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Filing Dt:
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10/08/2010
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Title:
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SHIELDED TRACE STRUCTURE AND FABRICATION METHOD
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Patent #:
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Issue Dt:
|
07/24/2012
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Application #:
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12931325
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Filing Dt:
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01/27/2011
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Title:
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STACKABLE SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
|
06/26/2012
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Application #:
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12931326
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Filing Dt:
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01/27/2011
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Title:
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EXPOSED DIE OVERMOLDED FLIP CHIP PACKAGE METHOD
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Patent #:
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Issue Dt:
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08/29/2017
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Application #:
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12939588
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Filing Dt:
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11/04/2010
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Title:
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WAFER LEVEL FAN OUT SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
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Patent #:
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Issue Dt:
|
09/03/2013
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Application #:
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12943540
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Filing Dt:
|
11/10/2010
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|
Title:
|
SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF
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Patent #:
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Issue Dt:
|
12/10/2013
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Application #:
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12945464
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Filing Dt:
|
11/12/2010
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Title:
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ELECTRONIC ASSEMBLY HAVING INCREASED STANDOFF HEIGHT
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Patent #:
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Issue Dt:
|
11/04/2014
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Application #:
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12955509
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Filing Dt:
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11/29/2010
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Publication #:
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Pub Dt:
|
05/31/2012
| | | | |
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Title:
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MAGNETIC FIELD SIMULATOR FOR TESTING SINGULATED OR MULTI-SITE STRIP SEMICONDUCTOR DEVICE AND METHOD THEREFOR
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Patent #:
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Issue Dt:
|
07/29/2014
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Application #:
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12959851
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Filing Dt:
|
12/03/2010
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Title:
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INTEGRATED PASSIVE DEVICE STRUCTURE AND METHOD
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Patent #:
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Issue Dt:
|
10/15/2013
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Application #:
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12959911
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Filing Dt:
|
12/03/2010
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Title:
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SEMICONDUCTOR DEVICE HAVING OVERLAPPED VIA APERTURES
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Patent #:
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Issue Dt:
|
10/23/2012
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Application #:
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12963005
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Filing Dt:
|
12/08/2010
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Publication #:
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Pub Dt:
|
04/14/2011
| | | | |
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Title:
|
ELECTRONIC STRUCTURES INCLUDING CONDUCTIVE LAYERS COMPRISING COPPER AND HAVING A THICKNESS OF AT LEAST 0.5 MICROMETERS
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Patent #:
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Issue Dt:
|
03/18/2014
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Application #:
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12963431
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Filing Dt:
|
12/08/2010
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|
Title:
|
SEMICONDUCTOR DEVICE INCLUDING LEADFRAME WITH DOWNSETS
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Patent #:
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Issue Dt:
|
09/17/2013
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Application #:
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12964397
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Filing Dt:
|
12/09/2010
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|
Title:
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LIGHT EMITTING DIODE (LED) PACKAGE AND METHOD
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Patent #:
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Issue Dt:
|
10/09/2012
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Application #:
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12964453
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Filing Dt:
|
12/09/2010
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Title:
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DUAL LAMINATE PACKAGE STRUCTURE WITH EMBEDDED ELEMENTS
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Patent #:
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Issue Dt:
|
08/06/2013
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Application #:
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12964468
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Filing Dt:
|
12/09/2010
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Title:
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CONCENTRATED PHOTOVOLTAIC RECEIVER PACKAGE WITH STACKED INTERNAL SUPPORT FEATURES
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Patent #:
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Issue Dt:
|
02/04/2014
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Application #:
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12968794
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Filing Dt:
|
12/15/2010
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|
Publication #:
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Pub Dt:
|
04/07/2011
| | | | |
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Title:
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WAFERS INCLUDING PATTERNED BACK SIDE LAYERS THEREON
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|
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Patent #:
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Issue Dt:
|
03/05/2013
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Application #:
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12985888
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Filing Dt:
|
01/06/2011
|
|
Title:
|
THROUGH VIA RECESSED REVEAL STRUCTURE AND METHOD
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|
|
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Patent #:
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|
Issue Dt:
|
11/27/2012
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Application #:
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13009690
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Filing Dt:
|
01/19/2011
|
|
Title:
|
INTEGRATED CIRCUIT PACKAGE AND METHOD OF MAKING THE SAME
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|
|
|
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Patent #:
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|
Issue Dt:
|
02/11/2014
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Application #:
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13015071
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Filing Dt:
|
01/27/2011
|
|
Title:
|
SEMICONDUCTOR DEVICE INCLUDING LEADFRAME WITH A COMBINATION OF LEADS AND LANDS
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|
|
|
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Patent #:
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|
Issue Dt:
|
10/13/2015
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Application #:
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13015445
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Filing Dt:
|
01/27/2011
|
|
Title:
|
SEMICONDUCTOR DEVICE
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/31/2013
|
Application #:
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13016343
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Filing Dt:
|
01/28/2011
|
|
Title:
|
TOP PORT WITH INTERPOSER MEMS MICROPHONE PACKAGE AND METHOD
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|
|
|
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Patent #:
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|
Issue Dt:
|
12/30/2014
|
Application #:
|
13034517
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Filing Dt:
|
02/24/2011
|
|
Title:
|
SEMICONDUCTOR DEVICE WITH MICRO ELECTROMECHANICAL SYSTEM DIE
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|
|
|
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Patent #:
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|
Issue Dt:
|
04/21/2015
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Application #:
|
13046071
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Filing Dt:
|
03/11/2011
|
|
Title:
|
STACKED AND STAGGERED DIE MEMS PACKAGE AND METHOD
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|
|
|
|
Patent #:
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|
Issue Dt:
|
07/23/2013
|
Application #:
|
13049647
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Filing Dt:
|
03/16/2011
|
|
Title:
|
SEMICONDUCTOR DEVICE CAPABLE OF PREVENTING DIELECTRIC LAYER FROM CRACKING
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|
|
|
|
Patent #:
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|
Issue Dt:
|
03/05/2013
|
Application #:
|
13065298
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Filing Dt:
|
03/18/2011
|
|
Title:
|
FLIP CHIP BUMP STRUCTURE AND FABRICATION METHOD
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/26/2013
|
Application #:
|
13066137
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Filing Dt:
|
04/06/2011
|
|
Title:
|
METAL ETCH STOP FABRICATION METHOD AND STRUCTURE
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/20/2014
|
Application #:
|
13094728
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Filing Dt:
|
04/26/2011
|
|
Title:
|
Semiconductor Package with Patterning layer and Method of Making Same
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/17/2013
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Application #:
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13096359
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Filing Dt:
|
04/28/2011
|
|
Title:
|
METAL MESH LID MEMS PACKAGE AND METHOD
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/20/2014
|
Application #:
|
13099680
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Filing Dt:
|
05/03/2011
|
|
Title:
|
CONFORMAL SHIELD ON PUNCH QFN SEMICONDUCTOR PACKAGE
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/21/2013
|
Application #:
|
13100004
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Filing Dt:
|
05/03/2011
|
|
Publication #:
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|
Pub Dt:
|
08/25/2011
| | | | |
|
Title:
|
Micro-Optical Device Packaging System
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/14/2013
|
Application #:
|
13109845
|
Filing Dt:
|
05/17/2011
|
|
Title:
|
SIDE LEADED, BOTTOM EXPOSED PAD AND BOTTOM EXPOSED LEAD FUSION QUAD FLAT SEMICONDUCTOR PACKAGE
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|
