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Reel/Frame:036288/0748   Pages: 247
Recorded: 08/06/2015
Attorney Dkt #:70341.00400
Conveyance: SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1836
Page 1 of 19
Pages: 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19
1
Patent #:
6168975
Issue Dt:
01/02/2001
Application #:
09104031
Filing Dt:
06/24/1998
Title:
METHOD OF FORMING EXTENDED LEAD PACKAGE
2
Patent #:
6103550
Issue Dt:
08/15/2000
Application #:
09161408
Filing Dt:
09/28/1998
Title:
MOLDED TAPE SUPPORT FOR A MOLDED CIRCUIT PACKAGE PRIOR TO DICING
3
Patent #:
6271658
Issue Dt:
08/07/2001
Application #:
09174620
Filing Dt:
10/19/1998
Title:
UNIVERSAL DOCKING SYSTEM
4
Patent #:
6300781
Issue Dt:
10/09/2001
Application #:
09182762
Filing Dt:
10/30/1998
Title:
RELIABLE METHOD AND APPARATUS FOR INTERFACING BETWEEN A BALL GRID ARRAY HANDLER AND A BALL GRID ARRAY TESTING SYSTEM
5
Patent #:
6355199
Issue Dt:
03/12/2002
Application #:
09249251
Filing Dt:
02/12/1999
Title:
METHOD OF MOLDING FLEXIBLE CIRCUIT WITH MOLDED STIFFENER
6
Patent #:
6404212
Issue Dt:
06/11/2002
Application #:
09252629
Filing Dt:
02/18/1999
Title:
TESTING OF BGA AND OTHER CSP PACKAGES USING PROBING TECHNIQUES
7
Patent #:
6176066
Issue Dt:
01/23/2001
Application #:
09307838
Filing Dt:
05/10/1999
Title:
VELCRO STRAPPING FOR SEMICONDUCTOR CARRYING TRAYS
8
Patent #:
6184047
Issue Dt:
02/06/2001
Application #:
09320752
Filing Dt:
05/27/1999
Title:
CONTACTOR SLEEVE ASSEMBLY FOR A PICK AND PLACE SEMICONDUCTOR DEVICE HANDLER
9
Patent #:
6255143
Issue Dt:
07/03/2001
Application #:
09366752
Filing Dt:
08/04/1999
Title:
FLIP CHIP THERMALLY ENHANCED BALL GRID ARRAY
10
Patent #:
6420779
Issue Dt:
07/16/2002
Application #:
09395923
Filing Dt:
09/14/1999
Title:
LEADFRAME BASED CHIP SCALE PACKAGE AND METHOD OF PRODUCING THE SAME
11
Patent #:
6242933
Issue Dt:
06/05/2001
Application #:
09412631
Filing Dt:
10/04/1999
Title:
DEVICE PROBE SOCKET FORMING PART OF A TEST HEAD, INTERFACING BETWEEN TEST HEAD AND A PROBE HANDLER, USED FOR DEVICE STRIP TESTING
12
Patent #:
6319418
Issue Dt:
11/20/2001
Application #:
09467119
Filing Dt:
12/20/1999
Title:
ZIG-ZAGGED PLATING BUS LINES
13
Patent #:
6543127
Issue Dt:
04/08/2003
Application #:
09614011
Filing Dt:
07/11/2000
Title:
COPLANARITY INSPECTION AT THE SINGULATION PROCESS
14
Patent #:
6468361
Issue Dt:
10/22/2002
Application #:
09635582
Filing Dt:
08/09/2000
Title:
PBGA SINGULATED SUBSTRATE FOR MODEL MELAMINE CLEANING
15
Patent #:
6284572
Issue Dt:
09/04/2001
Application #:
09638749
Filing Dt:
08/14/2000
Title:
Boat and assembly method for ball grid array packages
16
Patent #:
6403401
Issue Dt:
06/11/2002
Application #:
09639679
Filing Dt:
08/14/2000
Title:
HEAT SPREADER HOLE PIN 1 IDENTIFIER
17
Patent #:
6660565
Issue Dt:
12/09/2003
Application #:
09640534
Filing Dt:
08/17/2000
Title:
FLIP CHIP MOLDED/EXPOSED DIE PROCESS AND PACKAGE STRUCTURE
18
Patent #:
6432742
Issue Dt:
08/13/2002
Application #:
09640546
Filing Dt:
08/17/2000
Title:
METHODS OF FORMING DROP-IN HEAT SPREADER PLASTIC BALL GRID ARRAY (PBGA) PACKAGES
19
Patent #:
6597188
Issue Dt:
07/22/2003
Application #:
09658890
Filing Dt:
09/11/2000
Title:
GROUND LAND FOR SINGULATED BALL GRID ARRAY
20
Patent #:
6525553
Issue Dt:
02/25/2003
Application #:
09659729
Filing Dt:
09/11/2000
Title:
GROUND PIN CONCEPT FOR SINGULATED BALL GRID ARRAY
21
Patent #:
6278613
Issue Dt:
08/21/2001
Application #:
09670380
Filing Dt:
09/27/2000
Title:
Copper pads for heat spreader attach
22
Patent #:
6483177
Issue Dt:
11/19/2002
Application #:
09705251
Filing Dt:
11/02/2000
Title:
LEADED SEMICONDUCTOR PACKAGES AND METHOD OF TRIMMING AND SINGULATING SUCH PACKAGES
23
Patent #:
6544812
Issue Dt:
04/08/2003
Application #:
09706220
Filing Dt:
11/06/2000
Title:
SINGLE UNIT AUTOMATED ASSEMBLY OF FLEX ENHANCED BALL GRID ARRAY PACKAGES
24
Patent #:
6426460
Issue Dt:
07/30/2002
Application #:
09713800
Filing Dt:
11/16/2000
Title:
VELCRO STRAPPING FOR SEMICONDUCTOR CARRYING TRAYS
25
Patent #:
6581278
Issue Dt:
06/24/2003
Application #:
09759904
Filing Dt:
01/16/2001
Publication #:
US20020093080
Pub Dt:
07/18/2002
Title:
PROCESS AND SUPPORT CARRIER FOR FLEXIBLE SUBSTRATES
26
Patent #:
6828220
Issue Dt:
12/07/2004
Application #:
09802443
Filing Dt:
03/09/2001
Publication #:
US20020031902
Pub Dt:
03/14/2002
Title:
FLIP CHIP-IN-LEADFRAME PACKAGE AND PROCESS
27
Patent #:
6815252
Issue Dt:
11/09/2004
Application #:
09802664
Filing Dt:
03/09/2001
Publication #:
US20010055835
Pub Dt:
12/27/2001
Title:
A METHOD OF FORMING A FLIP CHIP INTERCONNECTION STRUCTURE
28
Patent #:
6586925
Issue Dt:
07/01/2003
Application #:
09828677
Filing Dt:
04/09/2001
Publication #:
US20020145438
Pub Dt:
10/10/2002
Title:
METHOD AND APPARATUS FOR ESTABLISHING QUICK AND RELIABLE CONNECTION BETWEEN A SEMICONDUCTOR DEVICE HANDLER PLATE AND A SEMICONDUCTOR DEVICE TEST HEAD PLATE
29
Patent #:
6537857
Issue Dt:
03/25/2003
Application #:
09849671
Filing Dt:
05/07/2001
Publication #:
US20020163064
Pub Dt:
11/07/2002
Title:
ENHANCED BGA GROUNDED HEATSINK
30
Patent #:
6537848
Issue Dt:
03/25/2003
Application #:
09867095
Filing Dt:
05/30/2001
Publication #:
US20020180040
Pub Dt:
12/05/2002
Title:
SUPER THIN/SUPER THERMAL BALL GRID ARRAY PACKAGE
31
Patent #:
6479903
Issue Dt:
11/12/2002
Application #:
09877324
Filing Dt:
06/11/2001
Publication #:
US20010026955
Pub Dt:
10/04/2001
Title:
FLIP CHIP THERMALLY ENHANCED BALL GRID ARRAY
32
Patent #:
6614123
Issue Dt:
09/02/2003
Application #:
09919763
Filing Dt:
07/31/2001
Publication #:
US20030025215
Pub Dt:
02/06/2003
Title:
PLASTIC BALL GRID ARRAY PACKAGE WITH INTEGRAL HEATSINK
33
Patent #:
6380048
Issue Dt:
04/30/2002
Application #:
09920599
Filing Dt:
08/02/2001
Title:
DIE PADDLE ENHANCEMENT FOR EXPOSED PAD IN SEMICONDUCTOR PACKAGING
34
Patent #:
6599779
Issue Dt:
07/29/2003
Application #:
09961555
Filing Dt:
09/24/2001
Publication #:
US20030057545
Pub Dt:
03/27/2003
Title:
PBGA SUBSTRATE FOR ANCHORING HEAT SINK
35
Patent #:
6617525
Issue Dt:
09/09/2003
Application #:
10043603
Filing Dt:
01/14/2002
Publication #:
US20020056570
Pub Dt:
05/16/2002
Title:
MOLDED STIFFENER FOR FLEXIBLE CIRCUIT MOLDING
36
Patent #:
6737298
Issue Dt:
05/18/2004
Application #:
10055094
Filing Dt:
01/23/2002
Publication #:
US20030138994
Pub Dt:
07/24/2003
Title:
HEAT SPREADER ANCHORING & GROUNDING METHOD & THERMALLY ENHANCED PBGA PACKAGE USING THE SAME
37
Patent #:
6940178
Issue Dt:
09/06/2005
Application #:
10080384
Filing Dt:
02/22/2002
Publication #:
US20020151228
Pub Dt:
10/17/2002
Title:
SELF-COPLANARITY BUMPING SHAPE FOR FLIP CHIP
38
Patent #:
6780682
Issue Dt:
08/24/2004
Application #:
10081425
Filing Dt:
02/22/2002
Publication #:
US20020123173
Pub Dt:
09/05/2002
Title:
APPARATUS AND PROCESS FOR PRECISE ENCAPSULATION OF FLIP CHIP INTERCONNNECTS
39
Patent #:
6661083
Issue Dt:
12/09/2003
Application #:
10081490
Filing Dt:
02/22/2002
Publication #:
US20020163015
Pub Dt:
11/07/2002
Title:
PLASTIC SEMICONDUCTOR PACKAGE
40
Patent #:
6737295
Issue Dt:
05/18/2004
Application #:
10081491
Filing Dt:
02/22/2002
Publication #:
US20020151189
Pub Dt:
10/17/2002
Title:
CHIP SCALE PACKAGE WITH FLIP CHIP INTERCONNECT
41
Patent #:
6549413
Issue Dt:
04/15/2003
Application #:
10082914
Filing Dt:
02/26/2002
Publication #:
US20020127778
Pub Dt:
09/12/2002
Title:
TAPE BALL GRID ARRAY SEMICONDUCTOR PACKAGE STRUCTURE AND ASSEMBLY PROCESS
42
Patent #:
6630373
Issue Dt:
10/07/2003
Application #:
10083993
Filing Dt:
02/26/2002
Publication #:
US20030160309
Pub Dt:
08/28/2003
Title:
GROUND PLANE FOR EXPOSED PACKAGE
43
Patent #:
6750534
Issue Dt:
06/15/2004
Application #:
10099284
Filing Dt:
03/15/2002
Publication #:
US20020093095
Pub Dt:
07/18/2002
Title:
HEAT SPREADER HOLE PIN 1 IDENTIFIER
44
Patent #:
6534859
Issue Dt:
03/18/2003
Application #:
10116983
Filing Dt:
04/05/2002
Title:
SEMICONDUCTOR PACKAGE HAVING HEAT SINK ATTACHED TO PRE-MOLDED CAVITIES AND METHOD FOR CREATING THE PACKAGE
45
Patent #:
6706563
Issue Dt:
03/16/2004
Application #:
10119920
Filing Dt:
04/10/2002
Publication #:
US20030197195
Pub Dt:
10/23/2003
Title:
HEAT SPREADER INTERCONNECT METHODOLOGY FOR THERMALLY ENHANCED PBGA PACKAGES
46
Patent #:
6535004
Issue Dt:
03/18/2003
Application #:
10140572
Filing Dt:
05/08/2002
Publication #:
US20020125908
Pub Dt:
09/12/2002
Title:
TESTING OF BGA AND OTHER CSP PACKAGES USING PROBING TECHNIQUES
47
Patent #:
6791346
Issue Dt:
09/14/2004
Application #:
10140573
Filing Dt:
05/08/2002
Publication #:
US20020125909
Pub Dt:
09/12/2002
Title:
TESTING OF BGA AND OTHER CSP PACKAGES USING PROBING TECHNIQUES
48
Patent #:
6740577
Issue Dt:
05/25/2004
Application #:
10151977
Filing Dt:
05/21/2002
Publication #:
US20030219966
Pub Dt:
11/27/2003
Title:
A METHOD OF FORMING A SMALL PITCH TORCH BUMP FOR MOUNTING HIGH-PERFORMANCE FLIP-FLOP DEVICES
49
Patent #:
6774640
Issue Dt:
08/10/2004
Application #:
10224151
Filing Dt:
08/20/2002
Publication #:
US20040036068
Pub Dt:
02/26/2004
Title:
TEST COUPON PATTERN DESIGN TO CONTROL MULTILAYER SAW SINGULATED PLASTIC BALL GRID ARRAY SUBSTRATE MIS-REGISTRATION
50
Patent #:
6834658
Issue Dt:
12/28/2004
Application #:
10236579
Filing Dt:
09/06/2002
Publication #:
US20030024548
Pub Dt:
02/06/2003
Title:
PBGA SINGULATED SUBSTRATE FOR MODEL MELAMINE CLEANING
51
Patent #:
6686258
Issue Dt:
02/03/2004
Application #:
10236650
Filing Dt:
09/06/2002
Publication #:
US20030011006
Pub Dt:
01/16/2003
Title:
METHOD OF TRIMMING AND SINGULATING LEADED SEMICONDUCTOR PACKAGES
52
Patent #:
6855573
Issue Dt:
02/15/2005
Application #:
10251231
Filing Dt:
09/19/2002
Publication #:
US20040058477
Pub Dt:
03/25/2004
Title:
INTEGRATED CIRCUIT PACKAGE AND MANUFACTURING METHOD THEREFOR
53
Patent #:
6841858
Issue Dt:
01/11/2005
Application #:
10256407
Filing Dt:
09/27/2002
Publication #:
US20040061202
Pub Dt:
04/01/2004
Title:
LEADFRAME FOR DIE STACKING APPLICATIONS AND RELATED DIE STACKING CONCEPTS
54
Patent #:
6802445
Issue Dt:
10/12/2004
Application #:
10279900
Filing Dt:
10/24/2002
Publication #:
US20040079788
Pub Dt:
04/29/2004
Title:
COST EFFECTIVE SUBSTRATE FABRICATION FOR FLIP-CHIP PACKAGES
55
Patent #:
6825067
Issue Dt:
11/30/2004
Application #:
10315533
Filing Dt:
12/10/2002
Publication #:
US20040108601
Pub Dt:
06/10/2004
Title:
MOLD CAP ANCHORING METHOD FOR MOLDED FLEX BGA PACKAGES
56
Patent #:
6828671
Issue Dt:
12/07/2004
Application #:
10323447
Filing Dt:
12/19/2002
Publication #:
US20030085462
Pub Dt:
05/08/2003
Title:
ENHANCED BGA GROUNDED HEATSINK
57
Patent #:
6744125
Issue Dt:
06/01/2004
Application #:
10339158
Filing Dt:
01/09/2003
Publication #:
US20030143777
Pub Dt:
07/31/2003
Title:
SUPER THIN/SUPER THERMAL BALL GRID ARRAY PACKAGE
58
Patent #:
6627990
Issue Dt:
09/30/2003
Application #:
10359407
Filing Dt:
02/06/2003
Title:
THERMALLY ENHANCED STACKED DIE PACKAGE
59
Patent #:
6759752
Issue Dt:
07/06/2004
Application #:
10371515
Filing Dt:
02/20/2003
Publication #:
US20030151148
Pub Dt:
08/14/2003
Title:
SINGLE UNIT AUTOMATED ASSEMBLY OF FLEX ENHANCED BALL GRID ARRAY PACKAGES
60
Patent #:
6775140
Issue Dt:
08/10/2004
Application #:
10434256
Filing Dt:
05/07/2003
Publication #:
US20040075987
Pub Dt:
04/22/2004
Title:
HEAT SPREADERS, HEAT SPREADER PACKAGES, AND FABRICATION METHODS FOR USE WITH FLIP CHIP SEMICONDUCTOR DEVICES
61
Patent #:
7064420
Issue Dt:
06/20/2006
Application #:
10444849
Filing Dt:
05/23/2003
Publication #:
US20040061204
Pub Dt:
04/01/2004
Title:
INTEGRATED CIRCUIT LEADFRAME WITH GROUND PLANE
62
Patent #:
7135760
Issue Dt:
11/14/2006
Application #:
10446275
Filing Dt:
05/23/2003
Publication #:
US20040061205
Pub Dt:
04/01/2004
Title:
MOISTURE RESISTANT INTEGRATED CIRCUIT LEADFRAME PACKAGE
63
Patent #:
6876069
Issue Dt:
04/05/2005
Application #:
10462264
Filing Dt:
06/16/2003
Publication #:
US20040070055
Pub Dt:
04/15/2004
Title:
GROUND PLANE FOR EXPOSED PACKAGE
64
Patent #:
7446408
Issue Dt:
11/04/2008
Application #:
10462288
Filing Dt:
06/16/2003
Publication #:
US20030216024
Pub Dt:
11/20/2003
Title:
SEMICONDUCTOR PACKAGE WITH HEAT SINK
65
Patent #:
6833287
Issue Dt:
12/21/2004
Application #:
10463007
Filing Dt:
06/16/2003
Publication #:
US20040251526
Pub Dt:
12/16/2004
Title:
SYSTEM FOR SEMICONDUCTOR PACKAGE WITH STACKED DIES
66
Patent #:
6927479
Issue Dt:
08/09/2005
Application #:
10606429
Filing Dt:
06/25/2003
Publication #:
US20040262718
Pub Dt:
12/30/2004
Title:
METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE FOR A DIE LARGER THAN A DIE PAD
67
Patent #:
6967126
Issue Dt:
11/22/2005
Application #:
10608843
Filing Dt:
06/27/2003
Publication #:
US20040043539
Pub Dt:
03/04/2004
Title:
METHOD FOR MANUFACTURING PLASTIC BALL GRID ARRAY WITH INTEGRAL HEATSINK
68
Patent #:
7034387
Issue Dt:
04/25/2006
Application #:
10618933
Filing Dt:
07/14/2003
Publication #:
US20040195667
Pub Dt:
10/07/2004
Title:
SEMICONDUCTOR MULTIPACKAGE MODULE INCLUDING PROCESSOR AND MEMORY PACKAGE ASSEMBLIES
69
Patent #:
7064426
Issue Dt:
06/20/2006
Application #:
10632549
Filing Dt:
08/02/2003
Publication #:
US20040061212
Pub Dt:
04/01/2004
Title:
SEMICONDUCTOR MULTI-PACKAGE MODULE HAVING WIRE BOND INTERCONNECT BETWEEN STACKED PACKAGES
70
Patent #:
6972481
Issue Dt:
12/06/2005
Application #:
10632550
Filing Dt:
08/02/2003
Publication #:
US20040056277
Pub Dt:
03/25/2004
Title:
SEMICONDUCTOR MULTI-PACKAGE MODULE INCLUDING STACKED-DIE PACKAGE AND HAVING WIRE BOND INTERCONNECT BETWEEN STACKED PACKAGES
71
Patent #:
6838761
Issue Dt:
01/04/2005
Application #:
10632551
Filing Dt:
08/02/2003
Publication #:
US20040065963
Pub Dt:
04/08/2004
Title:
SEMICONDUCTOR MULTI-PACKAGE MODULE HAVING WIRE BOND INTERCONNECT BETWEEN STACKED PACKAGES AND HAVING ELECTRICAL SHIELD
72
Patent #:
7053476
Issue Dt:
05/30/2006
Application #:
10632553
Filing Dt:
08/02/2003
Publication #:
US20040063246
Pub Dt:
04/01/2004
Title:
SEMICONDUCTOR MULTI-PACKAGE MODULE HAVING PACKAGE STACKED OVER DIE-DOWN FLIP CHIP BALL GRID ARRAY PACKAGE AND HAVING WIRE BOND INTERCONNECT BETWEEN STACKED PACKAGES
73
Patent #:
7205647
Issue Dt:
04/17/2007
Application #:
10632568
Filing Dt:
08/02/2003
Publication #:
US20040063242
Pub Dt:
04/01/2004
Title:
SEMICONDUCTOR MULTI-PACKAGE MODULE HAVING PACKAGE STACKED OVER BALL GRID ARRAY PACKAGE AND HAVING WIRE BOND INTERCONNECT BETWEEN STACKED PACKAGES
74
Patent #:
6861288
Issue Dt:
03/01/2005
Application #:
10676736
Filing Dt:
09/30/2003
Publication #:
US20040145039
Pub Dt:
07/29/2004
Title:
STACKED SEMICONDUCTOR PACKAGES AND METHOD FOR THE FABRICATION THEREOF
75
Patent #:
7061088
Issue Dt:
06/13/2006
Application #:
10681572
Filing Dt:
10/08/2003
Publication #:
US20040113253
Pub Dt:
06/17/2004
Title:
SEMICONDUCTOR STACKED MULTI-PACKAGE MODULE HAVING INVERTED SECOND PACKAGE
76
Patent #:
7045887
Issue Dt:
05/16/2006
Application #:
10681583
Filing Dt:
10/08/2003
Publication #:
US20040113254
Pub Dt:
06/17/2004
Title:
SEMICONDUCTOR MULTI-PACKAGE MODULE HAVING INVERTED SECOND PACKAGE STACKED OVER DIE-UP FLIP-CHIP BALL GRID ARRAY (BGA) PACKAGE
77
Patent #:
7049691
Issue Dt:
05/23/2006
Application #:
10681584
Filing Dt:
10/08/2003
Publication #:
US20040113255
Pub Dt:
06/17/2004
Title:
SEMICONDUCTOR MULTI-PACKAGE MODULE HAVING INVERTED SECOND PACKAGE AND INCLUDING ADDITIONAL DIE OR STACKED PACKAGE ON SECOND PACKAGE
78
Patent #:
7053477
Issue Dt:
05/30/2006
Application #:
10681734
Filing Dt:
10/08/2003
Publication #:
US20040119152
Pub Dt:
06/24/2004
Title:
SEMICONDUCTOR MULTI-PACKAGE MODULE HAVING INVERTED BUMP CHIP CARRIER SECOND PACKAGE
79
Patent #:
7057269
Issue Dt:
06/06/2006
Application #:
10681735
Filing Dt:
10/08/2003
Publication #:
US20040119153
Pub Dt:
06/24/2004
Title:
SEMICONDUCTOR MULTI-PACKAGE MODULE HAVING INVERTED LAND GRID ARRAY (LGA) PACKAGE STACKED OVER BALL GRID ARRAY (BGA) PACKAGE
80
Patent #:
6906416
Issue Dt:
06/14/2005
Application #:
10681747
Filing Dt:
10/08/2003
Publication #:
US20040113275
Pub Dt:
06/17/2004
Title:
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08/23/2005
Application #:
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Filing Dt:
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Publication #:
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Pub Dt:
07/01/2004
Title:
SEMICONDUCTOR STACKED MULTI-PACKAGE MODULE HAVING INVERTED SECOND PACKAGE AND ELECTRICALLY SHIELDED FIRST PACKAGE
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02/22/2005
Application #:
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Filing Dt:
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Title:
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07/25/2006
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Filing Dt:
10/24/2003
Publication #:
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Pub Dt:
05/06/2004
Title:
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07/18/2006
Application #:
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12/22/2003
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Pub Dt:
07/15/2004
Title:
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11/16/2004
Application #:
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Filing Dt:
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Publication #:
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Pub Dt:
08/12/2004
Title:
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12/26/2006
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01/27/2004
Publication #:
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Pub Dt:
07/28/2005
Title:
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02/28/2006
Application #:
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Filing Dt:
02/05/2004
Publication #:
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Pub Dt:
08/11/2005
Title:
SEMICONDUCTOR PACKAGE WITH PASSIVE DEVICE INTEGRATION
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09/06/2005
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03/01/2004
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Pub Dt:
09/16/2004
Title:
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04/05/2005
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03/18/2004
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Pub Dt:
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Title:
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Title:
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04/17/2007
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04/16/2004
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Title:
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Title:
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04/30/2004
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Title:
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06/13/2006
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05/13/2004
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Title:
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05/13/2004
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Title:
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05/20/2004
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10/28/2004
Title:
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Title:
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06/10/2004
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Pub Dt:
12/15/2005
Title:
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Assignors
1
STATS CHIPPAC, INC.
Exec Dt:
08/06/2015
2
STATS CHIPPAC LTD.
Exec Dt:
08/06/2015
Assignee
1
CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
39TH FLOOR, CITIBANK TOWER, CITIBANK PLAZA, 3 GARDEN ROAD
ATTENTION: AGENCY AND TRUST
CENTRAL, HONG KONG
Correspondence name and address
LAWRENCE KASS
28 LIBERTY STREET
C/O LAWRENCE KASS
NEW YORK, NY 10005

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