skip navigationU S P T O SealUnited States Patent and Trademark Office AOTW logo
Home|Site Index|Search|Guides|Contacts|eBusiness|eBiz alerts|News|Help
Assignments on the Web > Patent Query
Patent Assignment Details
NOTE:Results display only for issued patents and published applications. For pending or abandoned applications please consult USPTO staff.

Reel/Frame:037373/0481   Pages: 17
Recorded: 12/27/2015
Conveyance: MERGER (SEE DOCUMENT FOR DETAILS).
Total properties: 103
Page 1 of 2
Pages: 1 2
1
Patent #:
5371866
Issue Dt:
12/06/1994
Application #:
07891609
Filing Dt:
06/01/1992
Title:
SIMULCAST STANDARD MULTICHIP MEMORY ADDRESSING SYSTEM
2
Patent #:
5804870
Issue Dt:
09/08/1998
Application #:
08380541
Filing Dt:
01/30/1995
Title:
HERMETICALLY SEALED INTEGRATED CIRCUIT LEAD-ON PACKAGE CONFIGURATION
3
Patent #:
RE36229
Issue Dt:
06/15/1999
Application #:
08510729
Filing Dt:
11/20/1995
Title:
SIMULCAST STANDARD MULTICHIP MEMORY ADDRESSING SYSTEM
4
Patent #:
5778522
Issue Dt:
07/14/1998
Application #:
08650721
Filing Dt:
05/20/1996
Title:
METHOD OF MANUFACTURING A HIGH DENSITY INTEGRATED CIRCUIT MODULE WITH COMPLEX ELECTRICAL INTERCONNECT RAILS HAVING ELECTRICAL INTERCONNECT STRAIN RELIEF
5
Patent #:
5869353
Issue Dt:
02/09/1999
Application #:
08971499
Filing Dt:
11/17/1997
Title:
MODULAR PANEL STACKING PROCESS
6
Patent #:
6190939
Issue Dt:
02/20/2001
Application #:
09115293
Filing Dt:
07/14/1998
Title:
METHOD OF MANUFACTURING A WARP RESISTANT THERMALLY CONDUCTIVE CIRCUIT PACKAGE
7
Patent #:
6282210
Issue Dt:
08/28/2001
Application #:
09133297
Filing Dt:
08/12/1998
Title:
CLOCK DRIVER WITH INSTANTANEOUSLY SELECTABLE PHASE AND METHOD FOR USE IN DATA COMMUNICATION SYSTEM
8
Patent #:
6310392
Issue Dt:
10/30/2001
Application #:
09221350
Filing Dt:
12/28/1998
Title:
STACKED MICRO BALL GRID ARRAY PACKAGES
9
Patent #:
6222737
Issue Dt:
04/24/2001
Application #:
09298664
Filing Dt:
04/23/1999
Title:
UNIVERSAL PACKAGE AND METHOD OF FORMING THE SAME
10
Patent #:
6323060
Issue Dt:
11/27/2001
Application #:
09305584
Filing Dt:
05/05/1999
Title:
STACKABLE FLEX CIRCUIT IC PACKAGE AND METHOD OF MAKING SAME
11
Patent #:
6288907
Issue Dt:
09/11/2001
Application #:
09343432
Filing Dt:
06/30/1999
Title:
HIGH DENSITY INTEGRATED CIRCUIT MODULE WITH COMPLEX ELECTRICAL INTERCONNECT RAILS HAVING ELECTRICAL INTERCONNECT STRAIN RELIEF
12
Patent #:
6262895
Issue Dt:
07/17/2001
Application #:
09482294
Filing Dt:
01/13/2000
Title:
STACKABLE CHIP PACKAGE WITH FLEX CARRIER
13
Patent #:
6437433
Issue Dt:
08/20/2002
Application #:
09535641
Filing Dt:
03/24/2000
Title:
CSP STACKING TECHNOLOGY USING RIGID/FLEX CONSTRUCTION
14
Patent #:
6351029
Issue Dt:
02/26/2002
Application #:
09574321
Filing Dt:
05/19/2000
Title:
Stackable flex circuit chip package and method of making same
15
Patent #:
6236565
Issue Dt:
05/22/2001
Application #:
09594363
Filing Dt:
06/15/2000
Title:
Chip stack with active cooling system
16
Patent #:
6404043
Issue Dt:
06/11/2002
Application #:
09598343
Filing Dt:
06/21/2000
Title:
PANEL STACKING OF BGA DEVICES TO FORM THREE-DIMENSIONAL MODULES
17
Patent #:
6608763
Issue Dt:
08/19/2003
Application #:
09663753
Filing Dt:
09/15/2000
Title:
STACKING SYSTEM AND METHOD
18
Patent #:
6360433
Issue Dt:
03/26/2002
Application #:
09664938
Filing Dt:
09/19/2000
Title:
method of forming universal package
19
Patent #:
6426549
Issue Dt:
07/30/2002
Application #:
09706015
Filing Dt:
11/03/2000
Title:
STACKABLE FLEX CIRCUIT IC PACKAGE AND METHOD OF MAKING SAME
20
Patent #:
6462408
Issue Dt:
10/08/2002
Application #:
09819171
Filing Dt:
03/27/2001
Publication #:
US20020140074
Pub Dt:
10/03/2002
Title:
CONTACT MEMBER STACKING SYSTEM AND METHOD
21
Patent #:
6472735
Issue Dt:
10/29/2002
Application #:
09826621
Filing Dt:
04/05/2001
Publication #:
US20010054758
Pub Dt:
12/27/2001
Title:
THREE-DIMENSIONAL MEMORY STACKING USING ANISOTROPIC EPOXY INTERCONNECTIONS
22
Patent #:
6473308
Issue Dt:
10/29/2002
Application #:
09838773
Filing Dt:
04/19/2001
Publication #:
US20010015487
Pub Dt:
08/23/2001
Title:
STACKABLE CHIP PACKAGE WITH FLEX CARRIER
23
Patent #:
6426240
Issue Dt:
07/30/2002
Application #:
09888785
Filing Dt:
06/25/2001
Publication #:
US20010035572
Pub Dt:
11/01/2001
Title:
STACKABLE FLEX CIRCUIT CHIP PACKAGE AND METHOD OF MAKING SAME
24
Patent #:
6514793
Issue Dt:
02/04/2003
Application #:
09888792
Filing Dt:
06/25/2001
Publication #:
US20020048849
Pub Dt:
04/25/2002
Title:
STACKABLE FLEX CIRCUIT IC PACKAGE AND METHOD OF MAKING SAME
25
Patent #:
6627984
Issue Dt:
09/30/2003
Application #:
09912010
Filing Dt:
07/24/2001
Publication #:
US20030020153
Pub Dt:
01/30/2003
Title:
CHIP STACK WITH DIFFERING CHIP PACKAGE TYPES
26
Patent #:
6618257
Issue Dt:
09/09/2003
Application #:
09916625
Filing Dt:
07/27/2001
Title:
WIDE DATA PATH STACKING SYSTEM AND METHOD
27
Patent #:
6544815
Issue Dt:
04/08/2003
Application #:
09922977
Filing Dt:
08/06/2001
Publication #:
US20010054770
Pub Dt:
12/27/2001
Title:
PANEL STACKING OF BGA DEVICES TO FORM THREE-DIMENSIONAL MODULES
28
Patent #:
6573460
Issue Dt:
06/03/2003
Application #:
09957190
Filing Dt:
09/20/2001
Publication #:
US20030051906
Pub Dt:
03/20/2003
Title:
POST IN RING INTERCONNECT USING FOR 3-D STACKING
29
Patent #:
6576992
Issue Dt:
06/10/2003
Application #:
10005581
Filing Dt:
10/26/2001
Title:
CHIP SCALE STACKING SYSTEM AND METHOD
30
Patent #:
7081373
Issue Dt:
07/25/2006
Application #:
10016939
Filing Dt:
12/14/2001
Publication #:
US20030111736
Pub Dt:
06/19/2003
Title:
CSP CHIP STACK WITH FLEX CIRCUIT
31
Patent #:
6566746
Issue Dt:
05/20/2003
Application #:
10017553
Filing Dt:
12/14/2001
Publication #:
US20020053728
Pub Dt:
05/09/2002
Title:
PANEL STACKING OF BGA DEVICES TO FORM THREE-DIMENSIONAL MODULES
32
Patent #:
6806120
Issue Dt:
10/19/2004
Application #:
10092104
Filing Dt:
03/06/2002
Publication #:
US20020142515
Pub Dt:
10/03/2002
Title:
CONTACT MEMBER STACKING SYSTEM AND METHOD
33
Patent #:
6572387
Issue Dt:
06/03/2003
Application #:
10101039
Filing Dt:
03/19/2002
Publication #:
US20020102870
Pub Dt:
08/01/2002
Title:
FLEXIBLE CIRCUIT CONNECTOR FOR STACKED CHIP MODULE
34
Patent #:
6940729
Issue Dt:
09/06/2005
Application #:
10136890
Filing Dt:
05/02/2002
Publication #:
US20030081392
Pub Dt:
05/01/2003
Title:
INTEGRATED CIRCUIT STACKING SYSTEM AND METHOD
35
Patent #:
6908792
Issue Dt:
06/21/2005
Application #:
10263859
Filing Dt:
10/03/2002
Publication #:
US20030025211
Pub Dt:
02/06/2003
Title:
CHIP STACK WITH DIFFERING CHIP PACKAGE TYPES
36
Patent #:
6878571
Issue Dt:
04/12/2005
Application #:
10316566
Filing Dt:
12/11/2002
Publication #:
US20030127746
Pub Dt:
07/10/2003
Title:
PANEL STACKING OF BGA DEVICES TO FORM THREE-DIMENSIONAL MODULES
37
Patent #:
7485951
Issue Dt:
02/03/2009
Application #:
10435192
Filing Dt:
05/09/2003
Publication #:
US20040000707
Pub Dt:
01/01/2004
Title:
MODULARIZED DIE STACKING SYSTEM AND METHOD
38
Patent #:
7066741
Issue Dt:
06/27/2006
Application #:
10449242
Filing Dt:
05/30/2003
Publication #:
US20030203663
Pub Dt:
10/30/2003
Title:
FLEXIBLE CIRCUIT CONNECTOR FOR STACKED CHIP MODULE
39
Patent #:
6914324
Issue Dt:
07/05/2005
Application #:
10453398
Filing Dt:
06/03/2003
Publication #:
US20040000708
Pub Dt:
01/01/2004
Title:
MEMORY EXPANSION AND CHIP SCALE STACKING SYSTEM AND METHOD
40
Patent #:
6856010
Issue Dt:
02/15/2005
Application #:
10620157
Filing Dt:
07/14/2003
Publication #:
US20040108584
Pub Dt:
06/10/2004
Title:
THIN SCALE OUTLINE PACKAGE
41
Patent #:
6955945
Issue Dt:
10/18/2005
Application #:
10709732
Filing Dt:
05/25/2004
Publication #:
US20040197956
Pub Dt:
10/07/2004
Title:
MEMORY EXPANSION AND CHIP SCALE STACKING SYSTEM AND METHOD
42
Patent #:
6992501
Issue Dt:
01/31/2006
Application #:
10800816
Filing Dt:
03/15/2004
Publication #:
US20050200380
Pub Dt:
09/15/2005
Title:
REFLECTION-CONTROL SYSTEM AND METHOD
43
Patent #:
7542304
Issue Dt:
06/02/2009
Application #:
10804452
Filing Dt:
03/19/2004
Publication #:
US20050057911
Pub Dt:
03/17/2005
Title:
MEMORY EXPANSION AND INTEGRATED CIRCUIT STACKING SYSTEM AND METHOD
44
Patent #:
6893899
Issue Dt:
05/17/2005
Application #:
10814531
Filing Dt:
03/31/2004
Publication #:
US20040183206
Pub Dt:
09/23/2004
Title:
CONTACT MEMBER STACKING SYSTEM AND METHOD
45
Patent #:
6956284
Issue Dt:
10/18/2005
Application #:
10814532
Filing Dt:
03/31/2004
Publication #:
US20040183183
Pub Dt:
09/23/2004
Title:
INTEGRATED CIRCUIT STACKING SYSTEM AND METHOD
46
Patent #:
7371609
Issue Dt:
05/13/2008
Application #:
10836855
Filing Dt:
04/30/2004
Publication #:
US20040201091
Pub Dt:
10/14/2004
Title:
STACKED MODULE SYSTEMS AND METHODS
47
Patent #:
7094632
Issue Dt:
08/22/2006
Application #:
10873847
Filing Dt:
06/22/2004
Publication #:
US20040229402
Pub Dt:
11/18/2004
Title:
LOW PROFILE CHIP SCALE STACKING SYSTEM AND METHOD
48
Patent #:
RE39628
Issue Dt:
05/15/2007
Application #:
10900073
Filing Dt:
07/27/2004
Title:
STACKABLE FLEX CIRCUIT IC PACKAGE AND METHOD OF MAKING SAME
49
Patent #:
7053478
Issue Dt:
05/30/2006
Application #:
10914483
Filing Dt:
08/09/2004
Publication #:
US20050018412
Pub Dt:
01/27/2005
Title:
PITCH CHANGE AND CHIP SCALE STACKING SYSTEM
50
Patent #:
7606048
Issue Dt:
10/20/2009
Application #:
10958584
Filing Dt:
10/05/2004
Publication #:
US20050041402
Pub Dt:
02/24/2005
Title:
INTEGRATED CIRCUIT STACKING SYSTEM
51
Patent #:
7586758
Issue Dt:
09/08/2009
Application #:
10958924
Filing Dt:
10/05/2004
Publication #:
US20050041403
Pub Dt:
02/24/2005
Title:
INTEGRATED CIRCUIT STACKING SYSTEM
52
Patent #:
7335975
Issue Dt:
02/26/2008
Application #:
10958934
Filing Dt:
10/05/2004
Publication #:
US20050041404
Pub Dt:
02/24/2005
Title:
INTEGRATED CIRCUIT STACKING SYSTEM AND METHOD
53
Patent #:
RE41039
Issue Dt:
12/15/2009
Application #:
10974046
Filing Dt:
10/26/2004
Title:
STACKABLE CHIP PACKAGE WITH FLEX CARRIER
54
Patent #:
7480152
Issue Dt:
01/20/2009
Application #:
11005992
Filing Dt:
12/07/2004
Publication #:
US20060050496
Pub Dt:
03/09/2006
Title:
THIN MODULE SYSTEM AND METHOD
55
Patent #:
7511968
Issue Dt:
03/31/2009
Application #:
11007551
Filing Dt:
12/08/2004
Publication #:
US20060050497
Pub Dt:
03/09/2006
Title:
BUFFERED THIN MODULE SYSTEM AND METHOD
56
Patent #:
7309914
Issue Dt:
12/18/2007
Application #:
11039615
Filing Dt:
01/20/2005
Publication #:
US20060157842
Pub Dt:
07/20/2006
Title:
INVERTED CSP STACKING SYSTEM AND METHOD
57
Patent #:
7468893
Issue Dt:
12/23/2008
Application #:
11058979
Filing Dt:
02/16/2005
Publication #:
US20060049500
Pub Dt:
03/09/2006
Title:
THIN MODULE SYSTEM AND METHOD
58
Patent #:
7202555
Issue Dt:
04/10/2007
Application #:
11074026
Filing Dt:
03/08/2005
Publication #:
US20050146011
Pub Dt:
07/07/2005
Title:
PITCH CHANGE AND CHIP SCALE STACKING SYSTEM AND METHOD
59
Patent #:
7606040
Issue Dt:
10/20/2009
Application #:
11077952
Filing Dt:
03/11/2005
Publication #:
US20080278901
Pub Dt:
11/13/2008
Title:
MEMORY MODULE SYSTEM AND METHOD
60
Patent #:
7606049
Issue Dt:
10/20/2009
Application #:
11125018
Filing Dt:
05/09/2005
Publication #:
US20060049502
Pub Dt:
03/09/2006
Title:
MODULE THERMAL MANAGEMENT SYSTEM AND METHOD
61
Patent #:
7033861
Issue Dt:
04/25/2006
Application #:
11131812
Filing Dt:
05/18/2005
Title:
STACKED MODULE SYSTEMS AND METHOD
62
Patent #:
7423885
Issue Dt:
09/09/2008
Application #:
11157565
Filing Dt:
06/21/2005
Publication #:
US20060050498
Pub Dt:
03/09/2006
Title:
DIE MODULE SYSTEM
63
Patent #:
7595550
Issue Dt:
09/29/2009
Application #:
11173445
Filing Dt:
07/01/2005
Publication #:
US20050263872
Pub Dt:
12/01/2005
Title:
FLEX-BASED CIRCUIT MODULE
64
Patent #:
7606050
Issue Dt:
10/20/2009
Application #:
11187269
Filing Dt:
07/22/2005
Publication #:
US20060050592
Pub Dt:
03/09/2006
Title:
COMPACT MODULE SYSTEM AND METHOD
65
Patent #:
7495334
Issue Dt:
02/24/2009
Application #:
11197267
Filing Dt:
08/04/2005
Publication #:
US20050280135
Pub Dt:
12/22/2005
Title:
STACKING SYSTEM AND METHOD
66
Patent #:
7524703
Issue Dt:
04/28/2009
Application #:
11221597
Filing Dt:
09/07/2005
Publication #:
US20060008945
Pub Dt:
01/12/2006
Title:
INTEGRATED CIRCUIT STACKING SYSTEM AND METHOD
67
Patent #:
7443023
Issue Dt:
10/28/2008
Application #:
11231418
Filing Dt:
09/21/2005
Publication #:
US20060091529
Pub Dt:
05/04/2006
Title:
HIGH CAPACITY THIN MODULE SYSTEM
68
Patent #:
7259452
Issue Dt:
08/21/2007
Application #:
11248662
Filing Dt:
10/11/2005
Publication #:
US20070080470
Pub Dt:
04/12/2007
Title:
LEADED PACKAGE INTEGRATED CIRCUIT STACKING
69
Patent #:
7542297
Issue Dt:
06/02/2009
Application #:
11255061
Filing Dt:
10/19/2005
Publication #:
US20060050489
Pub Dt:
03/09/2006
Title:
OPTIMIZED MOUNTING AREA CIRCUIT MODULE SYSTEM AND METHOD
70
Patent #:
7310458
Issue Dt:
12/18/2007
Application #:
11258438
Filing Dt:
10/25/2005
Publication #:
US20060108572
Pub Dt:
05/25/2006
Title:
STACKED MODULE SYSTEMS AND METHODS
71
Patent #:
7656678
Issue Dt:
02/02/2010
Application #:
11263627
Filing Dt:
10/31/2005
Publication #:
US20060092614
Pub Dt:
05/04/2006
Title:
STACKED MODULE SYSTEMS
72
Patent #:
7576995
Issue Dt:
08/18/2009
Application #:
11267476
Filing Dt:
11/04/2005
Publication #:
US20070103877
Pub Dt:
05/10/2007
Title:
FLEX CIRCUIT APPARATUS AND METHOD FOR ADDING CAPACITANCE WHILE CONSERVING CIRCUIT BOARD SURFACE AREA
73
Patent #:
7446410
Issue Dt:
11/04/2008
Application #:
11283355
Filing Dt:
11/18/2005
Publication #:
US20060090102
Pub Dt:
04/27/2006
Title:
CIRCUIT MODULE WITH THERMAL CASING SYSTEMS
74
Patent #:
7508058
Issue Dt:
03/24/2009
Application #:
11330307
Filing Dt:
01/11/2006
Publication #:
US20070170561
Pub Dt:
07/26/2007
Title:
STACKED INTEGRATED CIRCUIT MODULE
75
Patent #:
7616452
Issue Dt:
11/10/2009
Application #:
11331969
Filing Dt:
01/13/2006
Publication #:
US20060125067
Pub Dt:
06/15/2006
Title:
FLEX CIRCUIT CONSTRUCTIONS FOR HIGH CAPACITY CIRCUIT MODULE SYSTEMS AND METHODS
76
Patent #:
7579687
Issue Dt:
08/25/2009
Application #:
11332740
Filing Dt:
01/13/2006
Publication #:
US20060129888
Pub Dt:
06/15/2006
Title:
CIRCUIT MODULE TURBULENCE ENHACEMENT SYSTEMS AND METHODS
77
Patent #:
7511969
Issue Dt:
03/31/2009
Application #:
11345910
Filing Dt:
02/02/2006
Publication #:
US20070176286
Pub Dt:
08/02/2007
Title:
COMPOSITE CORE CIRCUIT MODULE SYSTEM AND METHOD
78
Patent #:
7760513
Issue Dt:
07/20/2010
Application #:
11397597
Filing Dt:
04/03/2006
Publication #:
US20060198238
Pub Dt:
09/07/2006
Title:
MODIFIED CORE FOR CIRCUIT MODULE SYSTEM AND METHOD
79
Patent #:
7323364
Issue Dt:
01/29/2008
Application #:
11411185
Filing Dt:
04/25/2006
Publication #:
US20060263938
Pub Dt:
11/23/2006
Title:
STACKED MODULE SYSTEMS AND METHOD
80
Patent #:
7608920
Issue Dt:
10/27/2009
Application #:
11434964
Filing Dt:
05/16/2006
Publication #:
US20070158802
Pub Dt:
07/12/2007
Title:
MEMORY CARD AND METHOD FOR DEVISING
81
Patent #:
7508069
Issue Dt:
03/24/2009
Application #:
11436946
Filing Dt:
05/18/2006
Publication #:
US20070159545
Pub Dt:
07/12/2007
Title:
MANAGED MEMORY COMPONENT
82
Patent #:
7304382
Issue Dt:
12/04/2007
Application #:
11436957
Filing Dt:
05/18/2006
Publication #:
US20070158800
Pub Dt:
07/12/2007
Title:
MANAGED MEMORY COMPONENT
83
Patent #:
7446403
Issue Dt:
11/04/2008
Application #:
11452531
Filing Dt:
06/14/2006
Publication #:
US20070290312
Pub Dt:
12/20/2007
Title:
CARRIER STRUCTURE STACKING SYSTEM AND METHOD
84
Patent #:
7375418
Issue Dt:
05/20/2008
Application #:
11452532
Filing Dt:
06/14/2006
Publication #:
US20070290313
Pub Dt:
12/20/2007
Title:
INTERPOSER STACKING SYSTEM AND METHOD
85
Patent #:
7193310
Issue Dt:
03/20/2007
Application #:
11489956
Filing Dt:
07/20/2006
Publication #:
US20060261461
Pub Dt:
11/23/2006
Title:
STACKING SYSTEM AND METHOD
86
Patent #:
7573129
Issue Dt:
08/11/2009
Application #:
11533743
Filing Dt:
09/20/2006
Publication #:
US20070290314
Pub Dt:
12/20/2007
Title:
CONTRAST INTERPOSER STACKING SYSTEM AND METHOD
87
Patent #:
7417310
Issue Dt:
08/26/2008
Application #:
11556124
Filing Dt:
11/02/2006
Publication #:
US20080122054
Pub Dt:
05/29/2008
Title:
CIRCUIT MODULE HAVING FORCE RESISTANT CONSTRUCTION
88
Patent #:
7602613
Issue Dt:
10/13/2009
Application #:
11624608
Filing Dt:
01/18/2007
Publication #:
US20070115017
Pub Dt:
05/24/2007
Title:
THIN MODULE SYSTEM AND METHOD
89
Patent #:
7605454
Issue Dt:
10/20/2009
Application #:
11670396
Filing Dt:
02/01/2007
Publication #:
US20070158795
Pub Dt:
07/12/2007
Title:
MEMORY CARD AND METHOD FOR DEVISING
90
Patent #:
7468553
Issue Dt:
12/23/2008
Application #:
11682643
Filing Dt:
03/06/2007
Publication #:
US20080093724
Pub Dt:
04/24/2008
Title:
STACKABLE MICROPACKAGES AND STACKED MODULES
91
Patent #:
7759791
Issue Dt:
07/20/2010
Application #:
11738330
Filing Dt:
04/20/2007
Publication #:
US20080093734
Pub Dt:
04/24/2008
Title:
HIGH DENSITY IC MODULE
92
Patent #:
7508723
Issue Dt:
03/24/2009
Application #:
11753460
Filing Dt:
05/24/2007
Publication #:
US20080291747
Pub Dt:
11/27/2008
Title:
BUFFERED MEMORY DEVICE
93
Patent #:
7522421
Issue Dt:
04/21/2009
Application #:
11777925
Filing Dt:
07/13/2007
Publication #:
US20070258217
Pub Dt:
11/08/2007
Title:
SPLIT CORE CIRCUIT MODULE
94
Patent #:
7572671
Issue Dt:
08/11/2009
Application #:
11867534
Filing Dt:
10/04/2007
Publication #:
US20080036068
Pub Dt:
02/14/2008
Title:
STACKED MODULE SYSTEMS AND METHODS
95
Patent #:
7606042
Issue Dt:
10/20/2009
Application #:
11869644
Filing Dt:
10/09/2007
Publication #:
US20080030966
Pub Dt:
02/07/2008
Title:
HIGH CAPACITY THIN MODULE SYSTEM AND METHOD
96
Patent #:
7522425
Issue Dt:
04/21/2009
Application #:
11869687
Filing Dt:
10/09/2007
Publication #:
US20080030972
Pub Dt:
02/07/2008
Title:
HIGH CAPACITY THIN MODULE SYSTEM AND METHOD
97
Patent #:
7719098
Issue Dt:
05/18/2010
Application #:
11873351
Filing Dt:
10/16/2007
Publication #:
US20080088003
Pub Dt:
04/17/2008
Title:
STACKED MODULES AND METHOD
98
Patent #:
7459784
Issue Dt:
12/02/2008
Application #:
11961477
Filing Dt:
12/20/2007
Publication #:
US20080094803
Pub Dt:
04/24/2008
Title:
HIGH CAPACITY THIN MODULE SYSTEM
99
Patent #:
7768796
Issue Dt:
08/03/2010
Application #:
12147218
Filing Dt:
06/26/2008
Publication #:
US20080278924
Pub Dt:
11/13/2008
Title:
DIE MODULE SYSTEM
100
Patent #:
7804985
Issue Dt:
09/28/2010
Application #:
12197674
Filing Dt:
08/25/2008
Publication #:
US20080308924
Pub Dt:
12/18/2008
Title:
CIRCUIT MODULE HAVING FORCE RESISTANT CONSTRUCTION
Assignor
1
OVID DATA CO. LLC
Exec Dt:
09/03/2015
Assignee
1
TAMIRAS PER PTE. LTD., LLC
160 GREENTREE DRIVE
SUITE 101
DOVER, DELAWARE 19904
Correspondence name and address
MEYERTONS HOOD KIVLIN KOWERT&GOETZEL PC
1120 S. CAPITAL OF TEXAS HWY.
BUILDING 2, SUITE 300
AUSTIN, TX 78746

Search Results as of: 05/12/2024 06:38 AM
If you have any comments or questions concerning the data displayed, contact PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified: August 25, 2017 v.2.6
| .HOME | INDEX| SEARCH | eBUSINESS | CONTACT US | PRIVACY STATEMENT