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Patent #:
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Issue Dt:
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07/12/1988
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Application #:
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07045605
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Filing Dt:
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05/01/1987
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Title:
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HIGH DENSITY PROBE CARD
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Patent #:
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Issue Dt:
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06/06/1989
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Application #:
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07209915
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Filing Dt:
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06/22/1988
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Title:
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HIGH DENSITY PROBE CARD
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Patent #:
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Issue Dt:
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07/14/1992
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Application #:
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07649389
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Filing Dt:
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02/01/1991
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Title:
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NON-CORROSIVE COMPOSITIONS AND METHODS USEFUL FOR THE EXTRACTION OF NUCLEIC ACIDS
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Patent #:
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Issue Dt:
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11/12/1996
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Application #:
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07991199
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Filing Dt:
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12/15/1992
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Title:
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PEPTIDE LINKERS FOR IMPROVED OLIGONUCLEOTIDE DELIVERY
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Patent #:
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Issue Dt:
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12/19/1995
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Application #:
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08152812
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Filing Dt:
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11/16/1993
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Title:
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METHOD FOR MANUFACTURING ELECTRICAL CONTACTS, USING A SACRIFICIAL MEMBER
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Patent #:
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Issue Dt:
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06/29/1999
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Application #:
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08340144
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Filing Dt:
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11/15/1994
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Title:
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FLEXIBLE CONTACT STRUCTURE WITH AN ELECTRICALLY CONDUCTIVE SHELL
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Patent #:
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Issue Dt:
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04/18/2000
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Application #:
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08457479
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Filing Dt:
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06/01/1995
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Title:
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METHOD OF MOUNTING FREE-STANDING RESILIENT ELECTRICAL CONTACT STRUCTURES TO ELECTRONIC COMPONENTS
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Patent #:
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Issue Dt:
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06/30/1998
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Application #:
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08533584
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Filing Dt:
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10/18/1995
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Title:
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SOCKETS FOR ELECTRONIC COMPONENTS AND METHOD OF CONNECTING TO ELECTRONICS COMPONENTS
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Patent #:
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Issue Dt:
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11/02/1999
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Application #:
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08554902
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Filing Dt:
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11/09/1995
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Title:
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PROBE CARD ASSEMBLY
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Patent #:
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Issue Dt:
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11/03/1998
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Application #:
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08558332
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Filing Dt:
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11/15/1995
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Title:
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METHOD OF MOUNTING RESILIENT CONTACT STRUCTURES TO SEMICONDUCTOR DEVICES
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Patent #:
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Issue Dt:
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12/29/1998
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Application #:
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08570230
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Filing Dt:
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12/11/1995
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Title:
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METHOD OF MAKING RAISED CONTACTS ON ELETRONIC COMPONENTS
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Patent #:
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Issue Dt:
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02/11/1997
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Application #:
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08573945
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Filing Dt:
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12/18/1995
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Title:
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METHOD AND APPARATUS FOR WIREBONDING, FOR SEVERING BOND WIRES, AND FOR FORMING BALLS ON THE ENDS OF BOND WIRES
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Patent #:
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Issue Dt:
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10/13/1998
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Application #:
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08584981
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Filing Dt:
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01/11/1996
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Title:
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SOLDER PREFORMS
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Patent #:
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Issue Dt:
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08/01/2000
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Application #:
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08725935
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Filing Dt:
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10/07/1996
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Title:
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MODULAR SEMICONDUCTOR RELIABILITY TEST SYSTEM
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Patent #:
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Issue Dt:
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06/05/2001
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Application #:
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08735810
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Filing Dt:
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10/21/1996
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Title:
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SEMICONDUCTOR DEVICES WITH INTEGRAL CONTACT STRUCTURES
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Patent #:
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Issue Dt:
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05/04/1999
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Application #:
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08735811
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Filing Dt:
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10/21/1996
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Title:
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CONTACT STRUCTURE DEVICE FOR INTERCONNECTIONS, INTERPOSER, SEMICONDUCTOR ASSEMBLY AND PACKAGE USING THE SAME AND METHOD
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Patent #:
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Issue Dt:
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08/14/2001
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Application #:
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08735812
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Filing Dt:
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10/21/1996
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Title:
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INTERCONNECTION SUBSTRATES WITH RESILIENT CONTACT STRUCTURES ON BOTH SIDES
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Patent #:
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Issue Dt:
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07/27/1999
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Application #:
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08735813
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Filing Dt:
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10/21/1996
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Title:
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METHOD OF STACKING ELECTRONIC COMPONENTS
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Patent #:
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Issue Dt:
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02/06/2001
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Application #:
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08735815
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Filing Dt:
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10/21/1996
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Title:
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RESILIENT CONTACT STRUCTURES, ELECTRONIC INTERCONNECTION COMPONENT, AND METHOD OF MOUNTING RESLITENT CONTACT STRUCTURES TO ELECTRONIC COMPONENTS
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Patent #:
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Issue Dt:
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08/01/2006
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Application #:
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08735816
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Filing Dt:
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10/21/1996
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Title:
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PROBE FOR SEMICONDUCTOR DEVICES
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Patent #:
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Issue Dt:
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11/05/2002
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Application #:
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08735817
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Filing Dt:
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10/21/1996
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Title:
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CONTACT STRUCTURE DEVICE FOR INTERCONNECTIONS, INTERPOSER, SEMICONDUCTOR ASSEMBLY AND PACKAGE USING THE SAME AND METHOD
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Patent #:
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Issue Dt:
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05/16/2000
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Application #:
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08784862
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Filing Dt:
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01/15/1997
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Title:
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WAFER-LEVEL BURN-IN AND TEST
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Patent #:
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Issue Dt:
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11/30/1999
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Application #:
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08788740
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Filing Dt:
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01/24/1997
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Title:
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FABRICATING INTERCONNECTS AND TIPS USING SACRIFICIAL SUBSTRATES
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Patent #:
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Issue Dt:
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09/15/1998
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Application #:
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08789147
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Filing Dt:
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01/24/1997
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Title:
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CONTACT CARRIERS (TILES) FOR POPULATING LARGER SUBSTRATES WITH SPRING CONTACTS
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Patent #:
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Issue Dt:
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09/03/2002
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Application #:
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08794202
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Filing Dt:
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01/24/1997
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Title:
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METHOD FOR SHAPING SPRING ELEMENTS
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Patent #:
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Issue Dt:
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06/30/1998
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Application #:
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08797023
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Filing Dt:
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02/07/1996
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Title:
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METHOD OF SEVERING BOND WIRES AND FORMING BALLS AT THEIR ENDS
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Patent #:
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Issue Dt:
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11/19/2002
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Application #:
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08802054
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Filing Dt:
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02/18/1997
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Publication #:
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Pub Dt:
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02/14/2002
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Title:
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MICROELECTRIC CONTACT SPRING STRUCTURE, AND METHOD OF MAKING SAME
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Patent #:
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Issue Dt:
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02/02/1999
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Application #:
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08839758
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Filing Dt:
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04/15/1997
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Title:
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METHOD OF MAKING CONTACT TIP STRUCTURES
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Patent #:
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Issue Dt:
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12/07/1999
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Application #:
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08839759
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Filing Dt:
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04/15/1997
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Title:
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METHOD OF TESTING SEMICONDUCTOR DEVICES
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Patent #:
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Issue Dt:
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03/23/1999
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Application #:
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08839760
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Filing Dt:
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04/15/1997
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Title:
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MOUNTING SPRING ELEMENTS ON SEMICONDUCTOR DEVICES
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Patent #:
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Issue Dt:
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11/10/1998
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Application #:
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08839762
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Filing Dt:
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04/15/1997
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Title:
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METHOD OF MAKING TEMPORARY CONNECTIONS BETWEEN ELECTRONIC COMPONENTS
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Patent #:
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Issue Dt:
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11/16/1999
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Application #:
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08839763
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Filing Dt:
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04/15/1997
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Title:
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METHOD OF TEMPORARILY THEN PERMANENTLY CONNECTING TO A SEMICONDUCTOR DEVICE
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Patent #:
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Issue Dt:
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03/07/2000
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Application #:
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08839771
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Filing Dt:
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04/15/1997
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Title:
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WAFER-LEVEL TEST AND BURN-IN, AND SEMICONDUCTOR PROCESS
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Patent #:
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Issue Dt:
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03/09/1999
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Application #:
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08839772
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Filing Dt:
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04/15/1997
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Title:
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METHOD OF BURNING-IN SEMICONDUCTOR DEVICES
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Patent #:
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Issue Dt:
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02/06/2001
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Application #:
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08852152
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Filing Dt:
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05/06/1997
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Title:
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METHOD OF MAKING MICROELECTRONIC SPRING CONTACT ELEMENTS
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Patent #:
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Issue Dt:
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06/15/1999
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Application #:
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08854203
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Filing Dt:
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05/09/1997
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Title:
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METHOD AND APPARATUS FOR APPLYING A LAYER OF FLOWABLE COATING MATERIAL TO A SURFACE OF AN ELECTRONIC COMPONENT
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Patent #:
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Issue Dt:
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12/07/1999
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Application #:
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08863511
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Filing Dt:
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05/27/1997
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Title:
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STACKING SEMICONDUCTOR DEVICES, PARTICULARLY MEMORY CHIPS
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Patent #:
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Issue Dt:
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12/14/1999
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Application #:
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08870335
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Filing Dt:
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06/06/1997
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Title:
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PROBE STATION HAVING INNER AND OUTER SHIELDING
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Patent #:
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Issue Dt:
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10/05/1999
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Application #:
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08870397
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Filing Dt:
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06/06/1997
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Title:
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PROBE STATION HAVING ENVIRONMENT CONTROL CHAMBER WITH ORTHOGONALLY FLEXIBLE LATERAL WALL ASSEMBLY
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Patent #:
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Issue Dt:
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03/07/2000
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Application #:
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08871609
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Filing Dt:
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06/10/1997
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Title:
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LOW-CURRENT POGO PROBE CARD
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Patent #:
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Issue Dt:
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04/18/2000
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Application #:
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08920255
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Filing Dt:
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08/28/1997
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Title:
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MAKING DISCRETE POWER CONNECTIONS TO A SPACE TRANSFORMER OF A PROBE CARD ASSEMBLY
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Patent #:
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Issue Dt:
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10/23/2001
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Application #:
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08926898
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Filing Dt:
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09/10/1997
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Title:
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PARTIALLY-OVERCOATED ELONGATE CONTACT STRUCTURES
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Patent #:
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Issue Dt:
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03/28/2000
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Application #:
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08955001
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Filing Dt:
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10/20/1997
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Title:
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ELECTRONIC COMPONENT WITH TERMINALS AND SPRING CONTACT ELEMENTS EXTENDING FROM AREAS WHICH ARE REMOTE FROM THE TERMINALS
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Patent #:
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Issue Dt:
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05/25/2004
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Application #:
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08994799
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Filing Dt:
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12/19/1997
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Title:
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CONTACT CARRIERS (TILES) FOR POPULATING LARGER SUBSTRATES WITH SPRING CONTACTS
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Patent #:
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Issue Dt:
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02/18/2003
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Application #:
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09023859
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Filing Dt:
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02/13/1998
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Title:
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MICROELECTRONIC CONTACT STRUCTURES, AND METHODS OF MAKING SAME
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Patent #:
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Issue Dt:
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06/20/2006
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Application #:
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09042606
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Filing Dt:
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03/16/1998
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Publication #:
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Pub Dt:
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12/27/2001
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Title:
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PROBE CARD ASSEMBLY AND KIT
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Patent #:
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Issue Dt:
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04/13/2004
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Application #:
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09060308
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Filing Dt:
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04/14/1998
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Title:
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PC BOARD HAVING CLUSTERED BLIND VIAS
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Patent #:
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Issue Dt:
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07/18/2000
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Application #:
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09083206
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Filing Dt:
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05/21/1998
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Title:
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METHOD AND APPARATUS FOR CONTROLLING PLATING OVER A FACE OF A SUBSTRATE
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Patent #:
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Issue Dt:
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03/28/2000
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Application #:
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09083328
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Filing Dt:
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05/21/1998
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Title:
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APPARATUS FOR CONTROLLING PLATING OVER A FACE OF A SUBSTRATE
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Patent #:
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Issue Dt:
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08/29/2000
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Application #:
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09089817
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Filing Dt:
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06/03/1998
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Title:
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A METHOD OF MODIFYING THE THICKNESS OF A PLATING ON A MEMBER BY CREATING A TEMPERATURE GRADIENT ON THE MEMBER, APPLICATIONS FOR EMPLOYING SUCH A METHOD, AND STRUCTURES RESULTING FROM SUCH A METHOD
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Patent #:
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Issue Dt:
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02/08/2000
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Application #:
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09106943
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Filing Dt:
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06/30/1998
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Title:
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CHIP-SCALE CARRIER FOR SEMICONDUCTOR DEVICES INCLUDING MOUNTED SPRING CONTACTS
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Patent #:
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Issue Dt:
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12/30/2003
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Application #:
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09107924
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Filing Dt:
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06/30/1998
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Title:
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INTERPOSER, SOCKET AND ASSEMBLY FOR SOCKETING AN ELECTRONIC COMPONENT AND METHOD OF MAKING AND USING SAME
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Patent #:
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Issue Dt:
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03/07/2000
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Application #:
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09108163
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Filing Dt:
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06/30/1998
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Title:
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SOCKETS FOR "SPRINGED" SEMICONDUCTOR DEVICES
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Patent #:
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Issue Dt:
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03/16/2004
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Application #:
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09114586
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Filing Dt:
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07/13/1998
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Publication #:
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Pub Dt:
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08/09/2001
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Title:
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ELECTRICAL INTERCONNECT ASSEMBLIES AND METHODS
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Patent #:
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Issue Dt:
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12/11/2001
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Application #:
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09114589
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Filing Dt:
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07/13/1998
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Title:
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INTERCONNECT ASSEMBLIES AND METHODS INCLUDING ANCILLARY ELECTRONIC COMPONENT CONNECTED IN IMMEDIATE PROXIMITY OF SEMICONDUCTOR DEVICE
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Patent #:
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Issue Dt:
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07/10/2001
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Application #:
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09115571
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Filing Dt:
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07/14/1998
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Title:
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MEMBRANE PROBING SYSTEM
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Patent #:
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Issue Dt:
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02/29/2000
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Application #:
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09132843
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Filing Dt:
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08/12/1998
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Title:
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COMPOSITE INTERCONNECTION ELEMENTS FOR MICROELECTRONIC COMPONENTS, METHODS OF MAKING SAME
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Patent #:
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Issue Dt:
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06/12/2001
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Application #:
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09156957
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Filing Dt:
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09/18/1998
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Title:
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PROBE CARD ASSEMBLY AND KIT, AND METHODS OF USING SAME
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Patent #:
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Issue Dt:
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08/27/2002
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Application #:
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09189761
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Filing Dt:
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11/10/1998
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Title:
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CONTACT STRUCTURES WITH BLADES HAVING A WIPING MOTION
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Patent #:
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Issue Dt:
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02/10/2004
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Application #:
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09196924
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Filing Dt:
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11/19/1998
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Title:
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LARGE CONTACTOR WITH MULTIPLE, ALIGNED CONTACTOR UNITS
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Patent #:
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Issue Dt:
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11/19/2002
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Application #:
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09204740
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Filing Dt:
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12/02/1998
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Title:
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PROBE CARD FOR PROBING WAFERS WITH RAISED CONTACT ELEMENTS
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Patent #:
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Issue Dt:
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07/31/2001
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Application #:
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09205022
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Filing Dt:
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12/02/1998
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Title:
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METHOD OF MAKING AND USING LITHOGRAPHIC CONTACT SPRINGS
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Patent #:
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Issue Dt:
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07/03/2001
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Application #:
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09205023
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Filing Dt:
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12/02/1998
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Title:
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LITHOGRAPHIC CONTACT ELEMENTS
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Patent #:
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Issue Dt:
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11/21/2000
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Application #:
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09217589
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Filing Dt:
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12/22/1998
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Title:
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METHOD OF MAKING A PRODUCT WITH IMPROVED MATERIAL PROPERTIES BY MODERATE HEAT-TREATMENT OF A METAL INCORPORATING A DILUTE ADDITIVE
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Patent #:
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Issue Dt:
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08/06/2002
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Application #:
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09224166
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Filing Dt:
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12/31/1998
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Title:
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CONCURRENT DESIGN AND SUBSEQUENT PARTITIONING OF PRODUCT AND TEST DIE
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Patent #:
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Issue Dt:
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09/24/2002
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Application #:
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09224169
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Filing Dt:
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12/31/1998
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Title:
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SPECIAL CONTACT POINTS FOR ACCESSING INTERNAL CIRCUITRY OF AN INTEGRATED CIRCUIT
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Patent #:
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Issue Dt:
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04/22/2003
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Application #:
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09224673
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Filing Dt:
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12/31/1998
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Title:
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TEST ASSEMBLY INCLUDING A TEST DIE FOR TESTING A SEMICONDUCTOR PRODUCT DIE
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Patent #:
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Issue Dt:
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04/10/2001
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Application #:
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09245779
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Filing Dt:
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02/05/1999
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Title:
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An electronic assembly having at least two substrates with a
plurality of elongate springable interconnection elements between the substrates
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Patent #:
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Issue Dt:
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03/27/2001
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Application #:
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09258184
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Filing Dt:
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02/25/1999
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Title:
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FILTER STRUCTURES FOR INTEGRATED CIRCUIT INTERFACES
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Patent #:
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Issue Dt:
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09/10/2002
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Application #:
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09258185
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Filing Dt:
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02/25/1999
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Title:
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INTEGRATED CIRCUIT INTERCONNECT SYSTEM
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Patent #:
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Issue Dt:
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04/17/2001
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Application #:
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09258186
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Filing Dt:
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02/25/1999
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Title:
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HIGH BANDWIDTH PASSIVE INTEGRATED CIRCUIT TESTER PROBE CARD ASSEMBLY
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Patent #:
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Issue Dt:
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11/12/2002
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Application #:
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09260459
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Filing Dt:
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03/01/1999
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Title:
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PARALLEL TESTING OF INTEGRATED CIRCUIT DEVICES USING CROSS-DUT AND WITHIN-DUT COMPARISONS
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Patent #:
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Issue Dt:
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09/17/2002
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Application #:
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09260460
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Filing Dt:
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03/01/1999
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Title:
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EFFICIENT PARALLEL TESTING OF INTEGRATED CIRCUIT DEVICES USING A KNOWN GOOD DEVICE TO GENERATE EXPECTED RESPONSES
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Patent #:
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Issue Dt:
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12/24/2002
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Application #:
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09260463
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Filing Dt:
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03/01/1999
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Title:
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DISTRIBUTED INTERFACE FOR PARALLEL TESTING OF MULTIPLE DEVICES USING A SINGLE TESTER CHANNEL
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Issue Dt:
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11/11/2003
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09260466
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Filing Dt:
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03/01/1999
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Title:
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METHOD AND APPARATUS FOR THE TRANSPORT AND TRACKING OF AN ELECTRONIC COMPONENT
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Patent #:
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Issue Dt:
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05/03/2005
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09260794
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Filing Dt:
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03/01/1999
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Title:
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METHOD FOR PROCESSING AN INTEGRATED CIRCUIT INCLUDING PLACING DICE INTO A CARRIER AND TESTING
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Patent #:
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09/30/2003
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09260795
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03/01/1999
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02/28/2002
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Title:
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METHOD FOR MOUNTING AN ELECTRONIC COMPONENT
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Patent #:
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10/18/2005
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09295269
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04/20/1999
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06/07/2001
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Title:
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TIP STRUCTURES.
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Patent #:
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05/08/2007
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09327116
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06/07/1999
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Title:
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SEGMENTED CONTACTOR
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Patent #:
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10/14/2008
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09364788
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07/30/1999
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Title:
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VARIABLE WIDTH RESILIENT CONDUCTIVE CONTACT STRUCTURES
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Patent #:
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10/22/2002
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09376759
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08/17/1999
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Title:
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ELECTRICAL CONTACTOR ESPECIALLY WAFER LEVEL CONTACTOR USING FLUID PRESSURE
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Patent #:
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12/02/2003
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09468620
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12/21/1999
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Title:
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METHOD AND APPARATUS FOR BURNING-IN SEMICONDUCTOR DEVICES IN WAFER FORM
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Patent #:
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12/07/2004
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09473414
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12/28/1999
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Pub Dt:
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11/07/2002
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Title:
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INTERCONNECT FOR MICROELECTRONIC STRUCTURES WITH ENHANCED SPRING CHARACTERISTICS
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01/06/2004
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09474788
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12/29/1999
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Title:
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SPRING INTERCONNECT STRUCTURES
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Patent #:
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12/10/2002
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09474789
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12/29/1999
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Title:
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METHODS FOR MAKING SPRING INTERCONNECT STRUCTURES
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Patent #:
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01/15/2002
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09484600
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01/18/2000
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Title:
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Apparatus For Reducing Power Supply Noise In An Integrated Circuit
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01/02/2001
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09499963
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02/08/2000
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Title:
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PROCESS OF MOUNTING SPRING CONTACTS TO SEMICONDUCTOR DEVICES
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Patent #:
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10/01/2002
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09510657
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02/22/2000
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Title:
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INTEGRATED CIRCUIT INTERCONNECT SYSTEM FORMING A MULTI-POLE FILTER
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Patent #:
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05/15/2001
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09519279
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03/07/2000
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Title:
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Sockets for "springed" semiconductor devices
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01/21/2003
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09528064
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03/17/2000
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Title:
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PLANARIZER FOR A SEMICONDUCTOR CONTACTOR
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Patent #:
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04/10/2001
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09536223
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Filing Dt:
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03/27/2000
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Title:
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Electronic component with terminals and spring contct elements extwnding from areas which are remote from the terminals
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Patent #:
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05/11/2010
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09539287
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03/30/2000
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Title:
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LITHOGRAPHICALLY DEFINED MICROELECTRONIC CONTACT STRUCTURES
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Patent #:
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06/17/2003
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09546927
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04/11/2000
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Title:
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A METHOD FOR CONCTRUCTING A MEMBRANE PROBE USING A DEPRESSION
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Patent #:
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11/04/2003
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09547560
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04/12/2000
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Title:
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METHOD OF FABRICATING SHAPED SPRINGS
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Patent #:
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12/02/2008
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09547561
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Filing Dt:
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04/12/2000
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Title:
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SHAPED SPRING
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Patent #:
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Issue Dt:
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01/13/2004
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09548886
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04/13/2000
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Title:
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SYSTEM FOR MEASURING SIGNAL PATH RESISTANCE FOR AN INTEGRATED CIRCUIT TESTER INTERCONNECT STRUCTURE
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11/05/2002
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Application #:
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09568460
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05/09/2000
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Title:
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METHOD FOR TESTING SIGNAL PATHS BETWEEN AN INTEGRATED CIRCUIT WAFER AND A WAFER TESTER
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Patent #:
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02/25/2003
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09573489
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05/16/2000
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Title:
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WAFER-LEVEL BURN-IN AND TEST
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02/03/2004
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09591107
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06/09/2000
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Title:
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METHOD AND APPARATUS FOR CONTROLLING PLATING OVER A FACE OF A SUBSTRATE
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04/27/2004
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09592487
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06/08/2000
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Title:
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ELECTRICAL CONTACT STRUCTURES FORMED BY CONFIGURING A FLEXIBLE WIRE TO HAVE A SPRINGABLE SHAPE AND OVERCOATING THE WIRE WITH AT LEAST ONE LAYER OF A RESILIENT CONDUCTIVE MATERIAL, METHODS OF MOUNTING THE CONTACT STRUCTURES TO ELECTRONIC COMPONENTS, AND APPLICATIONS
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