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Patent Assignment Details

NOTE:Results display only for issued patents and published applications. For pending or abandoned applications please consult USPTO staff.

Reel/Frame:	043144/0364			Pages:	3
		Recorded:	07/31/2017
Conveyance:	ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Total properties: 11

Patent #:	5988487	Issue Dt:	11/23/1999	Application #:	08863800	Filing Dt:	05/27/1997
Title:	CAPTURED-CELL SOLDER PRINTING AND REFLOW METHODS

Patent #:	6293456	Issue Dt:	09/25/2001	Application #:	09273517	Filing Dt:	03/22/1999
Title:	METHODS AND APPARATUSES FOR FORMING SOLDER BALLS ON SUBSTRATES

Patent #:	6609652	Issue Dt:	08/26/2003	Application #:	09962007	Filing Dt:	09/24/2001
Publication #:	US20020084315	Pub Dt:	07/04/2002
Title:	BALL BUMPING SUBSTRATES, PARTICUARLY WAFERS

Patent #:	7288471	Issue Dt:	10/30/2007	Application #:	10989107	Filing Dt:	11/15/2004
Publication #:	US20050150936	Pub Dt:	07/14/2005
Title:	BUMPING ELECTRONIC COMPONENTS USING TRANSFER SUBSTRATES

Patent #:	7087833	Issue Dt:	08/08/2006	Application #:	11008315	Filing Dt:	12/09/2004
Publication #:	US20050214967	Pub Dt:	09/29/2005
Title:	NANOSTRUCTURE AND NANOCOMPOSITE BASED COMPOSITIONS AND PHOTOVOLTAIC DEVICES

Patent #:	7604153	Issue Dt:	10/20/2009	Application #:	11370500	Filing Dt:	03/07/2006
Publication #:	US20060208041	Pub Dt:	09/21/2006
Title:	FORMING SOLDER BALLS ON SUBSTRATES

Patent #:	7842599	Issue Dt:	11/30/2010	Application #:	11873396	Filing Dt:	10/16/2007
Publication #:	US20080176393	Pub Dt:	07/24/2008
Title:	BUMPING ELECTRONIC COMPONENTS USING TRANSFER SUBSTRATES

Patent #:	7819301	Issue Dt:	10/26/2010	Application #:	11925493	Filing Dt:	10/26/2007
Publication #:	US20080087709	Pub Dt:	04/17/2008
Title:	BUMPING ELECTRONIC COMPONENTS USING TRANSFER SUBSTRATES

Patent #:	7654432	Issue Dt:	02/02/2010	Application #:	12323772	Filing Dt:	11/26/2008
Publication #:	US20090159641	Pub Dt:	06/25/2009
Title:	FORMING SOLDER BALLS ON SUBSTRATES

Patent #:	NONE	Issue Dt:		Application #:	12473530	Filing Dt:	05/28/2009
Publication #:	US20090298277	Pub Dt:	12/03/2009
Title:	Maskless Process for Solder Bumps Production

Patent #:	7837083	Issue Dt:	11/23/2010	Application #:	12639782	Filing Dt:	12/16/2009
Publication #:	US20100089983	Pub Dt:	04/15/2010
Title:	FORMING SOLDER BALLS ON SUBSTRATES

Assignor

Exec Dt:

07/01/2017

Assignee

1206F MOUNTAINVIEW-ALVISO RD.

SUNNYVALE, CALIFORNIA 94089

Correspondence name and address
	DANIEL W LOYER
	946 CALLE AMANECER
	STE E
	SAN CLEMENTE, CA 92673

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