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Reel/Frame:044356/0395   Pages: 7
Recorded: 12/11/2017
Attorney Dkt #:YOR920150336US05
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
03/12/2019
Application #:
15837774
Filing Dt:
12/11/2017
Publication #:
Pub Dt:
04/26/2018
Title:
PACKAGING OPTOELECTRONIC COMPONENTS AND CMOS CIRCUITRY USING SILICON-ON-INSULATOR SUBSTRATES FOR PHOTONICS APPLICATIONS
Assignors
1
Exec Dt:
08/13/2015
2
Exec Dt:
08/12/2015
3
Exec Dt:
08/12/2015
4
Exec Dt:
10/14/2015
Assignee
1
NEW ORCHARD ROAD
ARMONK, NEW YORK 10504
Correspondence name and address
WILLIAM E. LEWIS
48 SOUTH SERVICE ROAD, SUITE 100
RYAN, MASON & LEWIS, LLP
MELVILLE, NY 11747

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