|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/21/1990
|
Application #:
|
07227347
|
Filing Dt:
|
08/02/1988
|
|
Title:
|
METHOD OF BUILDING SOLDER BUMPS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/16/1993
|
Application #:
|
07609163
|
Filing Dt:
|
11/02/1990
|
|
Title:
|
THERMOPLASTIC SEMICONDUCTOR PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/02/1993
|
Application #:
|
07629440
|
Filing Dt:
|
12/18/1990
|
|
Title:
|
METHOD OF PRODUCING A STRIP OF LEAD FRAMES FOR INTEGRATED CIRCUIT DIES IN A CONTINUOUS SYSTEM
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/22/1992
|
Application #:
|
07680340
|
Filing Dt:
|
04/04/1991
|
|
Title:
|
LEAD FRAME WORKHOLDER AND TRANSPORT APPARATUS AND METHOD
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/12/1993
|
Application #:
|
07700670
|
Filing Dt:
|
05/15/1991
|
|
Title:
|
METHOD OF MAKING A RESIN ENCAPSULATED PIN GRID ARRAY WITH INTEGRAL HEATSINK
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/10/1992
|
Application #:
|
07759450
|
Filing Dt:
|
09/13/1991
|
|
Title:
|
SOLDER BUMP FABRICATION METHOD AND SOLDER BUMPS FORMED THEREBY
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/14/1993
|
Application #:
|
07763806
|
Filing Dt:
|
09/23/1991
|
|
Title:
|
SLITTER MACHINE FOR USE IN MANUFACTURING SEMICONDUCTOR DEVICES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/01/1993
|
Application #:
|
07841765
|
Filing Dt:
|
03/02/1992
|
|
Title:
|
SEMICONDUCTOR DEVICE HAVING A PAD ARRAY CARRIER PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/01/1994
|
Application #:
|
07845996
|
Filing Dt:
|
03/04/1992
|
|
Title:
|
METHOD FOR TESTING, BURN-IN, AND/OR PROGRAMMING OF INTEGRATED CIRCUIT CHIPS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/09/1996
|
Application #:
|
07893518
|
Filing Dt:
|
06/02/1992
|
|
Title:
|
INTEGRATED CIRCUIT PACKAGE WITH VIA INTERCONNECTIONS FORMED IN A SUBSTRATE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/22/1994
|
Application #:
|
07912065
|
Filing Dt:
|
07/07/1992
|
|
Title:
|
RESIN ENCAPSULATED SEMICONDUCTOR DEVICE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/08/1994
|
Application #:
|
07927069
|
Filing Dt:
|
08/07/1992
|
|
Title:
|
SOLDER BUMP INCLUDING CIRCULAR LIP
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/19/1994
|
Application #:
|
07936927
|
Filing Dt:
|
08/27/1992
|
|
Title:
|
METHOD OF AND APPARATUS FOR PRODUCING A STRIP OF LEAD FRAMES FOR INTEGRATED CIRCUIT DIES IN A CONTINUOUS SYSTEM
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/18/1995
|
Application #:
|
07962190
|
Filing Dt:
|
12/22/1992
|
|
Title:
|
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE WITH COPPER CORE BUMPS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/12/1994
|
Application #:
|
07973354
|
Filing Dt:
|
11/09/1992
|
|
Title:
|
METHOD FOR FORMING PLASTIC MOLDED PACKAGE WITH HEAT SINK FOR INTEGRATEDCIRCUIT DEVICES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/31/1993
|
Application #:
|
07976720
|
Filing Dt:
|
11/16/1992
|
|
Title:
|
LEADLESS PAD ARRAY CHIP CARRIER
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/31/1993
|
Application #:
|
07977523
|
Filing Dt:
|
11/17/1992
|
|
Title:
|
THERMOPLASTIC SEMICONDUCTOR PACKAGE AND METHOD OF PRODUCING IT
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/03/1995
|
Application #:
|
08037209
|
Filing Dt:
|
03/26/1993
|
|
Title:
|
INTEGRATED CIRCUIT PACKAGE WITH VIA INTERCONNECTION TECHNIQUES AND METHOD FOR FORMING SUCH A PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/11/1994
|
Application #:
|
08047721
|
Filing Dt:
|
04/14/1993
|
|
Title:
|
BALL GRID ARRAY WITH VIA INTERCONNECTION
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/20/1994
|
Application #:
|
08127784
|
Filing Dt:
|
09/27/1993
|
|
Title:
|
METHOD AND APPARATUS FOR TESTING, BURN-IN, AND/OR PROGRAMMING OF INTEGRATED CIRCUIT CHIPS, AND FOR PLACING SOLDER BUMPS THEREON
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/17/1995
|
Application #:
|
08127785
|
Filing Dt:
|
09/27/1993
|
|
Title:
|
METHOD OF FORMING DIFFERING VOLUME SOLDER BUMPS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/03/1995
|
Application #:
|
08152935
|
Filing Dt:
|
11/15/1993
|
|
Title:
|
PLASTIC MOLDED PACKAGE WITH HEAT SINK FOR INTEGRATED CIRCUIT DEVICES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/03/1997
|
Application #:
|
08214339
|
Filing Dt:
|
03/16/1994
|
|
Title:
|
MOLD RUNNER REMOVAL FROM A SUBSTRATE-BASED PACKAGED ELECTRONIC DEVICE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/10/1995
|
Application #:
|
08231341
|
Filing Dt:
|
04/19/1994
|
|
Title:
|
PACKAGED INTEGRATED CIRCUIT INCLUDING HEAT SLUG HAVING AN EXPOSED SURFACE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/23/1997
|
Application #:
|
08237709
|
Filing Dt:
|
05/03/1994
|
|
Title:
|
PACKAGED SEMICONDUCTOR DIE INCLUDING HEAT SINK WITH LOCKING FEATURE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/26/1995
|
Application #:
|
08241427
|
Filing Dt:
|
05/11/1994
|
|
Title:
|
METHOD FOR INTERCONNECTION OF INTEGRATED CIRCUIT CHIP AND SUBSTRATE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/10/1996
|
Application #:
|
08245146
|
Filing Dt:
|
05/16/1994
|
|
Title:
|
BALL GRID ARRAY INTEGRATED CIRCUIT PACKAGE WITH THERMAL CONDUCTOR
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/28/1995
|
Application #:
|
08250153
|
Filing Dt:
|
05/26/1994
|
|
Title:
|
HOMOGENEOUS THERMOPLASTIC SEMI-CONDUCTOR CHIP CARRIER PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/05/1995
|
Application #:
|
08270166
|
Filing Dt:
|
07/01/1994
|
|
Title:
|
RECESSED VIA APPARATUS FOR TESTING, BURN-IN, AND/OR PROGRAMMING OF INTEGRATED CIRCUIT CHIPS, AND FOR PLACING SOLDER BUMPS THEREON
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/09/1996
|
Application #:
|
08286153
|
Filing Dt:
|
08/04/1994
|
|
Title:
|
METHOD AND APPARATUS FOR APPLYING FLUX TO BALL GRID ARRAY PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/27/1998
|
Application #:
|
08339329
|
Filing Dt:
|
11/14/1994
|
|
Title:
|
HOMOGENEOUS CHIP CARRIER PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/16/1996
|
Application #:
|
08345573
|
Filing Dt:
|
11/28/1994
|
|
Title:
|
METHOD OF MAKING HOMOGENEOUS THERMOPLASTIC SEMI-CONDUCTOR CHIP CARRIER PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/22/1997
|
Application #:
|
08383966
|
Filing Dt:
|
02/06/1995
|
|
Title:
|
THERMALLY ENHANCED CHIP CARRIER PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/21/1997
|
Application #:
|
08405462
|
Filing Dt:
|
03/16/1995
|
|
Title:
|
PLASTIC PACKAGED INTEGRATED CIRCUIT WITH HEAT SPREADER
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/16/1996
|
Application #:
|
08410381
|
Filing Dt:
|
03/27/1995
|
|
Title:
|
SEMICONDUCTOR DEVICE HAVING A THERMAL DISSIPATOR AND ELECTROMAGNETIC SHIELDING
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/09/1996
|
Application #:
|
08411010
|
Filing Dt:
|
03/27/1995
|
|
Title:
|
METHOD FOR FORMING A SEMICONDUCTOR DEVICE HAVING A THERMAL DISSIPATOR AND ELECTROMAGNETIC SHIELDING
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/24/1997
|
Application #:
|
08479885
|
Filing Dt:
|
06/07/1995
|
|
Title:
|
HEAT SPREADER SUITABLE FOR USE IN SEMICONDUCTOR PACKAGES HAVING DIFFERENT PAD SIZES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/10/1996
|
Application #:
|
08485936
|
Filing Dt:
|
06/07/1995
|
|
Title:
|
COPPER OXIDE-FILLED POLYMER DIE ATTACH ADHESIVE COMPOSITION FOR SEMICONDUCTOR PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/03/1998
|
Application #:
|
08520429
|
Filing Dt:
|
08/29/1995
|
|
Title:
|
SEMICONDUCTOR LEAD FRAME HAVING CONNECTION BAR AND GUIDE RINGS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/27/1998
|
Application #:
|
08530558
|
Filing Dt:
|
09/19/1995
|
|
Title:
|
METHOD FOR CHECKING A WIRE BOND OF A SEMICONDUCTOR PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/13/1997
|
Application #:
|
08570794
|
Filing Dt:
|
12/12/1995
|
|
Title:
|
SEMICONDUCTOR PACKAGE WITH INTEGRAL HEAT DISSIPATOR
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/21/1998
|
Application #:
|
08570849
|
Filing Dt:
|
12/12/1995
|
|
Title:
|
BONDING METHOD FOR SEMICONDUCTOR CHIPS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/26/1997
|
Application #:
|
08571316
|
Filing Dt:
|
12/12/1995
|
|
Title:
|
CHIP MOUNTING PLATE CONSTRUCTION OF LEAD FRAME FOR SEMICONDUCTOR PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/17/1998
|
Application #:
|
08588172
|
Filing Dt:
|
01/18/1996
|
|
Title:
|
BALL GRID ARRAY SEMICONDUCTOR PACKAGE WITH IMPROVED HEAT DISSIPATION AND DEHUMIDIFICATION EFFECT
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/24/1997
|
Application #:
|
08588482
|
Filing Dt:
|
01/18/1996
|
|
Title:
|
METHOD AND CIRCUIT BOARD STRUCTURE FOR LEVELING SOLDER BALLS IN BALL GRID ARRAY SEMICONDUCTOR PACKAGES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/14/1998
|
Application #:
|
08624496
|
Filing Dt:
|
04/05/1996
|
|
Title:
|
SEMICONDUCTOR DEVICE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/12/1999
|
Application #:
|
08637578
|
Filing Dt:
|
04/24/1996
|
|
Title:
|
CARRIER STRIP AND MOLDED FLEX CIRCUIT BALL GRID ARRAY
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/29/1998
|
Application #:
|
08637877
|
Filing Dt:
|
04/24/1996
|
|
Title:
|
METHOD OF MAKING GRID ARRAY ASSEMBLY
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/03/1998
|
Application #:
|
08641603
|
Filing Dt:
|
05/01/1996
|
|
Title:
|
METHOD OF MAKING A PACKAGED SEMICONDUCTOR DIE INCLUDING HEAT SINK WITH LOCKING FEATURE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/29/1998
|
Application #:
|
08651200
|
Filing Dt:
|
05/17/1996
|
|
Title:
|
UNIT PRINTED CIRCUIT BOARD CARRIER FRAME FOR BALL GRID ARRAY SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING BALL GRID ARRAY SEMICONDUCTOR PACKAGES USING THE SAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/11/1998
|
Application #:
|
08654539
|
Filing Dt:
|
05/29/1996
|
|
Title:
|
MICROELECTRONIC PACKAGING USING ARCHED SOLDER COLUMNS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/30/1997
|
Application #:
|
08688083
|
Filing Dt:
|
07/29/1996
|
|
Title:
|
INTERDIGITATED WIREBOND PROGRAMMABLE FIXED VOLTAGE PLANES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/17/1998
|
Application #:
|
08704477
|
Filing Dt:
|
08/28/1996
|
|
Title:
|
WAFER MAP CONVERSION METHOD
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/15/1998
|
Application #:
|
08707381
|
Filing Dt:
|
09/04/1996
|
|
Title:
|
METHOD FOR FABRICATING A HEAT SINK-INTEGRATED SEMICONDUCTOR PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/10/1997
|
Application #:
|
08729540
|
Filing Dt:
|
10/11/1996
|
|
Title:
|
METHOD FOR MOLDING OF INTEGRATED CIRCUIT PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/16/1998
|
Application #:
|
08736107
|
Filing Dt:
|
10/24/1996
|
|
Title:
|
PRINTED CIRCUIT BOARD HAVING EPOXY BARRIER AROUND A THROUGHOUT SLOT AND BALL GRID ARRAY SEMICONDUCTOR PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/09/1999
|
Application #:
|
08741797
|
Filing Dt:
|
10/31/1996
|
|
Title:
|
NEAR CHIP SIZE INTEGRATED CIRCUIT PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/16/1998
|
Application #:
|
08744122
|
Filing Dt:
|
11/05/1996
|
|
Title:
|
SOLDER BUMP FABRICATION METHODS AND STRUCTURE INCLUDING A TITANIUM BARRIER LAYER
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/03/1998
|
Application #:
|
08748752
|
Filing Dt:
|
11/14/1996
|
|
Title:
|
SOCKET ASSEMBLY FOR INTEGRATED CIRCUIT CHIP CARRIER PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/13/1998
|
Application #:
|
08748937
|
Filing Dt:
|
11/13/1996
|
|
Title:
|
BALL GRID ARRAY SEMICONDUCTOR PACKAGE WITH RING-TYPE HEAT SINK
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/29/1998
|
Application #:
|
08749450
|
Filing Dt:
|
11/15/1996
|
|
Title:
|
SEMICONDUCTOR PACKAGE INCLUDING HEAT SINK WITH LAYERED CONDUCTIVE PLATE AND NON-CONDUCTIVE TAPE BONDING TO LEADS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/12/1999
|
Application #:
|
08749578
|
Filing Dt:
|
11/14/1996
|
|
Title:
|
PROCESS FOR BONDING SEMICONDUCTOR CHIP
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/11/1999
|
Application #:
|
08754637
|
Filing Dt:
|
11/21/1996
|
|
Title:
|
METHODS FOR FORMING AN INTERMETALLIC REGION BETWEEN A SOLDER BUMP AND AN UNDER BUMP METALLURGY LAYER AND RELATED STRUCTURES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/18/1998
|
Application #:
|
08761472
|
Filing Dt:
|
12/06/1996
|
|
Title:
|
INTEGRATED CIRCUIT CHIP TO SUBSTRATE INTERCONNECTION AND METHOD
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/12/1999
|
Application #:
|
08763605
|
Filing Dt:
|
12/11/1996
|
|
Title:
|
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/18/1999
|
Application #:
|
08775212
|
Filing Dt:
|
12/31/1996
|
|
Title:
|
BALL GIRD ARRAY SEMICONDUCTOR PACKAGE USING A METAL CARRIER RING AS A HEAT SPREADER
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/02/1999
|
Application #:
|
08775839
|
Filing Dt:
|
12/31/1996
|
|
Title:
|
GRID ARRAY TYPE LEAD FRAME AND LEAD END GRID ARRAY SEMICONDUCTOR PACKAGE EMPLOYING THE SAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/22/1999
|
Application #:
|
08777927
|
Filing Dt:
|
12/23/1996
|
|
Title:
|
SEMICONDUCTOR CHIP SCALE PACKAGE AND METHOD OF PRODUCING SUCH
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/01/1999
|
Application #:
|
08813725
|
Filing Dt:
|
03/07/1997
|
|
Title:
|
METHOD OF FORMING CHIP BUMPS OF BUMP CHIP SCALE SEMICONDUCTOR PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/16/1999
|
Application #:
|
08825945
|
Filing Dt:
|
04/01/1997
|
|
Title:
|
SOLDER BALL LAND METAL STRUCTURE OF BALL GRID SEMICONDUCTOR PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/07/2000
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Application #:
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08844536
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Filing Dt:
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04/18/1997
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Title:
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INTEGRATED CIRCUIT PACKAGE
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Patent #:
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Issue Dt:
|
09/12/2000
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Application #:
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08854075
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Filing Dt:
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05/09/1997
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Title:
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METHODS OF ELECTROPLATING SOLDER BUMPS OF UNIFORM HEIGHT ON INTEGRATED CIRCUIT SUBSTRATES
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Patent #:
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Issue Dt:
|
08/18/1998
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Application #:
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08862687
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Filing Dt:
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05/23/1997
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Title:
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SOLDER BALL JOINT
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Patent #:
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Issue Dt:
|
11/09/1999
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Application #:
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08882248
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Filing Dt:
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06/25/1997
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Title:
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PRINTED CIRCUIT BOARD FOR BALL GRID ARRAY SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
|
02/08/2000
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Application #:
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08882687
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Filing Dt:
|
06/25/1997
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Title:
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MARKING BAD PRINTED CIRCUIT BOARDS FOR SEMICONDUCTOR PACKAGES
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Patent #:
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Issue Dt:
|
01/26/1999
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Application #:
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08883541
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Filing Dt:
|
06/25/1997
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Title:
|
FLEXIBLE CIRCUIT BOARD FOR BALL GRID ARRAY SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
|
09/14/1999
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Application #:
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08915077
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Filing Dt:
|
08/20/1997
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Title:
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BALL GRID ARRAY SEMICONDUCTOR PACKAGE WITH SOLDER BALLS FUSED ON PRINTED CIRCUIT BOARD AND METHOD FOR FABRICATING THE SAME
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Patent #:
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Issue Dt:
|
08/17/1999
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Application #:
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08925915
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Filing Dt:
|
09/09/1997
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Title:
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SHIELDED SURFACE ACOUSTICAL WAVE PACKAGE
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|
|
|
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Patent #:
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Issue Dt:
|
02/02/1999
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Application #:
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08926495
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Filing Dt:
|
09/09/1997
|
|
Title:
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MOUNTING FOR A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
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|
|
|
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Patent #:
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|
Issue Dt:
|
10/05/1999
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Application #:
|
08926507
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Filing Dt:
|
09/09/1997
|
|
Title:
|
INTEGRATED CIRCUIT PACKAGE EMPLOYING A TRANSPARENT ENCAPSULANT
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|
|
|
|
Patent #:
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|
Issue Dt:
|
10/26/1999
|
Application #:
|
08934315
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Filing Dt:
|
09/19/1997
|
|
Title:
|
MOLD FOR BALL GRID ARRAY SEMICONDUCTOR PACKAGE
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|
|
|
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Patent #:
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|
Issue Dt:
|
11/16/1999
|
Application #:
|
08942784
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Filing Dt:
|
10/02/1997
|
|
Title:
|
SEMICONDUCTOR PACKAGE HAVING LIGHT, THIN, SIMPLE AND COMPACT STRUCTURE
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|
|
|
|
Patent #:
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|
Issue Dt:
|
02/22/2000
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Application #:
|
08949585
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Filing Dt:
|
10/14/1997
|
|
Title:
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A MICROELECTRONIC DEVICE PACKAGE HAVING A HEAT SINK STRUCTURE FOR INCREASING THE THERMAL CONDUCTIVITY OF THE PACKAGE
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|
|
|
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Patent #:
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|
Issue Dt:
|
04/27/1999
|
Application #:
|
08951062
|
Filing Dt:
|
10/15/1997
|
|
Title:
|
METHOD FOR REPRODUCING PRINTED CIRCUIT BOARDS FOR SEMICONDUCTOR PACKAGES INCLUDING POOR QUALITY PRINTED CIRCUIT BOARD UNITS AND METHOD FOR FABRICATING SEMICONDUCTOR PACKAGES USING THE REPRODUCED PRINTED CIRCUIT BOARDS
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|
|
|
|
Patent #:
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|
Issue Dt:
|
04/13/1999
|
Application #:
|
08951890
|
Filing Dt:
|
10/16/1997
|
|
Title:
|
A METHOD FOR MANUFACTURING AN ALUMINA-SILICON CARBIDE NANOCOMPOSITE
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/06/1999
|
Application #:
|
08977258
|
Filing Dt:
|
11/24/1997
|
|
Title:
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METHODS FOR FORMING INTEGRATED REDISTRIBUTION ROUTING CONDUCTORS AND STRUCTURES FORMED THEREBY
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/02/1999
|
Application #:
|
09008552
|
Filing Dt:
|
01/16/1998
|
|
Title:
|
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/01/2000
|
Application #:
|
09013330
|
Filing Dt:
|
01/26/1998
|
|
Title:
|
METHOD OF MANUFACTURING BALL GRID ARRAY SEMICONDUCTOR PACKAGE
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/21/2002
|
Application #:
|
09024940
|
Filing Dt:
|
02/17/1998
|
|
Publication #:
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|
Pub Dt:
|
08/23/2001
| | | | |
|
Title:
|
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/12/2000
|
Application #:
|
09050666
|
Filing Dt:
|
03/30/1998
|
|
Title:
|
METHOD OF MAKING INTEGRATED CIRCUIT PACKAGE HAVING ADHESIVE BEAD SUPPORTING PLANAR LID ABOVE PLANAR SUBSTRATE
|
|
|
|
|
Patent #:
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|
Issue Dt:
|
04/24/2001
|
Application #:
|
09063422
|
Filing Dt:
|
04/20/1998
|
|
Title:
|
SOLDER BUMP FABRICATION METHODS AND STRUCTURES INCLUDING A TITANIUM BARRIER LAYER
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/19/2000
|
Application #:
|
09078377
|
Filing Dt:
|
05/13/1998
|
|
Title:
|
INTEGRATED CIRCUIT CHIP TO SUBSTRATE INTERCONNECTION
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/21/2000
|
Application #:
|
09083524
|
Filing Dt:
|
05/22/1998
|
|
Title:
|
RF SHIELDED DEVICE
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/07/1999
|
Application #:
|
09085136
|
Filing Dt:
|
05/26/1998
|
|
Title:
|
METHOD OF MAKING AN INTEGRATED CIRCUIT PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/08/2000
|
Application #:
|
09085447
|
Filing Dt:
|
05/28/1998
|
|
Title:
|
UNIVERSAL LEADFRAME FOR SEMICONDUCTOR DEVICES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/05/1999
|
Application #:
|
09096754
|
Filing Dt:
|
06/12/1998
|
|
Title:
|
MICROELECTRONIC PACKAGING USING ARCHED SOLDER COLUMNS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/07/2000
|
Application #:
|
09103760
|
Filing Dt:
|
06/24/1998
|
|
Title:
|
PLASTIC INTEGRATED CIRCUIT PACKAGE AND METHOD AND LEADFRAME FOR MAKING THE PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/07/1999
|
Application #:
|
09118197
|
Filing Dt:
|
07/17/1998
|
|
Title:
|
MOUNTING HAVING AN APERTURE COVER WITH ADHESIVE LOCKING FEATURE FOR FLIP CHIP OPTICAL INTEGRATED CIRCUIT DEVICE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/26/1999
|
Application #:
|
09120794
|
Filing Dt:
|
07/23/1998
|
|
Title:
|
INTEGRAL HEAT SPREADER FOR SEMICONDUCTOR PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/14/2002
|
Application #:
|
09122285
|
Filing Dt:
|
07/24/1998
|
|
Title:
|
CONTROLLED-SHAPED SOLDER RESERVOIRS FOR INCREASING THE VOLUME OF SOLDER BUMPS, AND STRUCTURES FORMED THEREBY
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|
