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96
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Patent #:
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Issue Dt:
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10/26/2004
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Application #:
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10322527
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Filing Dt:
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12/19/2002
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Publication #:
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Pub Dt:
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06/24/2004
| | | | |
Title:
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CIRCUITIZED SUBSTRATE ASSEMBLY AND METHOD OF MAKING SAME
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Patent #:
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Issue Dt:
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06/14/2005
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Application #:
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10370529
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Filing Dt:
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02/24/2003
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Publication #:
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Pub Dt:
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08/26/2004
| | | | |
Title:
|
CIRCUITIZED SUBSTRATE AND METHOD OF MAKING SAME
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Patent #:
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Issue Dt:
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03/29/2005
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Application #:
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10379575
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Filing Dt:
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03/06/2003
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Publication #:
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Pub Dt:
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06/24/2004
| | | | |
Title:
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INFORMATION HANDLING SYSTEM UTILIZING CIRCUITIZED SUBSTRATE
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Patent #:
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Issue Dt:
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10/25/2005
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Application #:
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10409066
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Filing Dt:
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04/09/2003
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Publication #:
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Pub Dt:
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10/14/2004
| | | | |
Title:
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MATERIAL SEPARATION TO FORM SEGMENTED PRODUCT
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Patent #:
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Issue Dt:
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11/09/2004
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Application #:
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10423877
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Filing Dt:
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04/28/2003
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Publication #:
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Pub Dt:
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09/23/2004
| | | | |
Title:
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ELECTRONIC PACKAGE WITH STRENGTHENED CONDUCTIVE PAD
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Patent #:
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Issue Dt:
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03/21/2006
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10616932
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Filing Dt:
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07/11/2003
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Publication #:
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Pub Dt:
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01/13/2005
| | | | |
Title:
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Method of testing spacings in pattern of openings in PCB conductive layer
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Patent #:
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Issue Dt:
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09/19/2006
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Application #:
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10630722
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Filing Dt:
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07/31/2003
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Publication #:
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Pub Dt:
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02/03/2005
| | | | |
Title:
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ELECTRONIC COMPONENT TEST APPARATUS
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Patent #:
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Issue Dt:
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06/20/2006
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Application #:
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10643909
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Filing Dt:
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08/20/2003
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Publication #:
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Pub Dt:
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02/24/2005
| | | | |
Title:
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CIRCUITIZED SUBSTRATE AND METHOD OF MAKING SAME
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Patent #:
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Issue Dt:
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01/31/2006
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Application #:
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10661616
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Filing Dt:
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09/15/2003
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Publication #:
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Pub Dt:
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08/05/2004
| | | | |
Title:
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STACKED CHIP ELECTRONIC PACKAGE HAVING LAMINATE CARRIER AND METHOD OF MAKING SAME
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Patent #:
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Issue Dt:
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05/01/2007
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10737974
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Filing Dt:
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12/18/2003
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Publication #:
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Pub Dt:
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06/23/2005
| | | | |
Title:
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Method of making multilayered printed circuit board with filled conductive holes
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Patent #:
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Issue Dt:
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02/13/2007
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Application #:
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10740398
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Filing Dt:
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12/22/2003
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Publication #:
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Pub Dt:
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06/23/2005
| | | | |
Title:
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PRINTED CIRCUIT BOARD WITH LOW CROSS-TALK NOISE
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Patent #:
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Issue Dt:
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04/24/2007
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10790747
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Filing Dt:
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03/03/2004
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Publication #:
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Pub Dt:
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09/08/2005
| | | | |
Title:
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CIRCUITIZED SUBSTRATE WITH SIGNAL WIRE SHIELDING, ELECTRICAL ASSEMBLY UTILIZING SAME AND METHOD OF MAKING
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Patent #:
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09/18/2007
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Application #:
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10812889
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Filing Dt:
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03/31/2004
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Publication #:
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Pub Dt:
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10/13/2005
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Title:
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DIELECTRIC COMPOSITION FOR FORMING DIELECTRIC LAYER FOR USE IN CIRCUITIZED SUBSTRATES
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Patent #:
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Issue Dt:
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07/18/2006
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Application #:
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10812890
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Filing Dt:
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03/31/2004
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Pub Dt:
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10/13/2005
| | | | |
Title:
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CIRCUITIZED SUBSTRATE
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Patent #:
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Issue Dt:
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08/08/2006
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10828061
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Filing Dt:
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04/20/2004
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Publication #:
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Pub Dt:
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10/20/2005
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Title:
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SWITCH DEVICE AND METHOD FOR CONTROLLING A SPRAYER
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Patent #:
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Issue Dt:
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06/23/2009
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10860067
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Filing Dt:
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06/04/2004
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Pub Dt:
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12/29/2005
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Title:
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METHOD AND SYSTEM FOR TRACKING GOODS
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Patent #:
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01/02/2007
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10882167
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07/02/2004
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Pub Dt:
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01/05/2006
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Title:
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CIRCUITIZED SUBSTRATE WITH SPLIT CONDUCTIVE LAYER, METHOD OF MAKING SAME, ELECTRICAL ASSEMBLY UTILIZING SAME, AND INFORMATION HANDLING SYSTEM UTILIZING SAME
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01/02/2007
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10882170
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07/02/2004
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Pub Dt:
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01/05/2006
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Title:
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CIRCUITIZED SUBSTRATE WITH FILLED ISOLATION BORDER, METHOD OF MAKING SAME, ELECTRICAL ASSEMBLY UTILIZING SAME, AND INFORMATION HANDLING SYSTEM UTILIZING SAME
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05/16/2006
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10900386
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07/28/2004
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Pub Dt:
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02/02/2006
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Title:
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ELECTRICAL ASSEMBLY WITH INTERNAL MEMORY CIRCUITIZED SUBSTRATE HAVING ELECTRONIC COMPONENTS POSITIONED THEREON, METHOD OF MAKING SAME, AND INFORMATION HANDLING SYSTEM UTILIZING SAME
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07/04/2006
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10915483
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08/11/2004
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Pub Dt:
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01/20/2005
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Title:
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CIRCUITIZED SUBSTRATE ASSEMBLY AND METHOD OF MAKING SAME
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Patent #:
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12/05/2006
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10920235
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08/18/2004
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Pub Dt:
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10/13/2005
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Title:
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LOW MOISTURE ABSORPTIVE CIRCUITIZED SUBSTRATE, METHOD OF MAKING SAME, ELECTRICAL ASSEMBLY UTILIZING SAME, AND INFORMATION HANDLING SYSTEM UTILIZING SAME
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05/31/2005
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10933260
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09/03/2004
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02/03/2005
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Title:
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INFORMATION HANDLING SYSTEM UTILIZING CIRCUITIZED SUBSTRATE
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02/07/2006
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10955741
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09/30/2004
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02/24/2005
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Title:
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HIGH SPEED CIRCUITIZED SUBSTRATE WITH REDUCED THRU-HOLE STUB, METHOD FOR FABRICATION AND INFORMATION HANDLING SYSTEM UTILIZING SAME
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08/08/2006
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10968929
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10/21/2004
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05/11/2006
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Title:
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METHOD OF MAKING A CIRCUITIZED SUBSTRATE HAVING A PLURALITY OF SOLDER CONNECTION SITES THEREON
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04/11/2006
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11031074
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01/10/2005
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Title:
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CAPACITOR MATERIAL WITH METAL COMPONENT FOR USE IN CIRCUITIZED SUBSTRATES, CIRCUITIZED SUBSTRATE UTILIZING SAME, METHOD OF MAKING SAID CIRCUITIZED SUBSTRATE, AND INFORMATION HANDLING SYSTEM UTILIZING SAID CIRCUITIZED SUBSTRATE
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06/02/2009
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11031085
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01/10/2005
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Pub Dt:
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07/13/2006
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Title:
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CAPACITOR MATERIAL FOR USE IN CIRCUITIZED SUBSTRATES, CIRCUITIZED SUBSTRATE UTILIZING SAME, METHOD OF MAKING SAID CIRCUITIZED SUBSTRATE, AND INFORMATION HANDLING SYSTEM UTILIZING SAID CIRCUITIZED SUBSTRATE
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12/30/2008
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11086323
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03/23/2005
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10/06/2005
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Title:
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LOW MOISTURE ABSORPTIVE CIRCUITIZED SUBSTRATE WITH REDUCED THERMAL EXPANSION, METHOD OF MAKING SAME, ELECTRICAL ASSEMBLY UTILIZING SAME, AND INFORMATION HANDLING SYSTEM UTILIZING SAME
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10/28/2008
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11086324
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03/23/2005
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09/28/2006
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ELECTRONIC CARD ASSEMBLY
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11/06/2007
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11110901
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04/21/2005
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10/26/2006
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INTERPOSER FOR USE WITH TEST APPARATUS
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06/10/2008
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11172794
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07/05/2005
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07/13/2006
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Title:
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02/26/2008
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11177413
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07/11/2005
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01/11/2007
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03/11/2008
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11177442
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07/11/2005
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01/11/2007
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Title:
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CIRCUITIZED SUBSTRATE WITH SINTERED PASTE CONNECTIONS, MULTILAYERED SUBSTRATE ASSEMBLY, ELECTRICAL ASSEMBLY AND INFORMATION HANDLING SYSTEM UTILIZING SAME
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05/01/2007
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11216133
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09/01/2005
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03/01/2007
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01/09/2007
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11238960
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09/30/2005
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02/02/2006
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STACKED CHIP ELECTRONIC PACKAGE HAVING LAMINATE CARRIER AND METHOD OF MAKING SAME
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10/28/2008
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11244180
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10/06/2005
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01/11/2007
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Title:
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CIRCUITIZED SUBSTRATE WITH SOLER-COATED MICROPARTICLE PASTE CONNECTIONS, MULTILAYERED SUBSTRATE ASSEMBLY, ELECTRICAL ASSEMBLY AND INFORMATION HANDLING SYSTEM UTILIZING SAME AND METHOD OF MAKING SAID SUBSTRATE
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10/31/2006
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11281456
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11/18/2005
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Title:
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SUBSTRATE TEST APPARATUS AND METHOD OF TESTING SUBSTRATES
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12/08/2009
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11305073
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12/19/2005
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06/21/2007
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METHOD OF IMPROVING ELECTRICAL CONNECTIONS IN CIRCUITIZED SUBSTRATES
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06/03/2008
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11324432
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01/04/2006
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07/19/2007
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METHOD OF MAKING CIRCUITIZED SUBSTRATE
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12/11/2007
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11327493
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01/09/2006
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06/08/2006
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METHOD OF TREATING CONDUCTIVE LAYER FOR USE IN A CIRCUITIZED SUBSTRATE AND METHOD OF MAKING SAID SUBSTRATE HAVING SAID CONDUCTIVE LAYER AS PART THEREOF
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08/26/2008
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11349990
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02/09/2006
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06/22/2006
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METHOD OF MAKING CIRCUITIZED SUBSTRATE
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03/18/2008
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11349998
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02/09/2006
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06/15/2006
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Title:
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METHOD OF MAKING CIRCUITIZED SUBSTRATE ASSEMBLY
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03/24/2009
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11350777
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02/10/2006
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06/15/2006
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11/11/2008
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02/13/2006
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01/11/2007
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09/30/2008
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03/28/2006
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08/17/2006
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03/25/2008
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04/05/2006
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08/17/2006
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03/16/2010
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04/11/2006
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09/28/2006
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01/20/2009
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05/09/2006
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09/14/2006
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03/01/2011
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05/23/2006
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11/29/2007
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CAPACITIVE SUBSTRATE
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12/08/2009
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06/19/2006
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12/20/2007
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02/23/2010
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06/19/2006
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10/26/2006
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METHOD OF MAKING A MULTI-CHIP ELECTRONIC PACKAGE HAVING LAMINATE CARRIER
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10/16/2012
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08/08/2006
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02/14/2008
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03/30/2010
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10/03/2006
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04/03/2008
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HALOGEN-FREE CIRCUITIZED SUBSTRATE WITH REDUCED THERMAL EXPANSION, METHOD OF MAKING SAME, MULTILAYERED SUBSTRATE STRUCTURE UTILIZING SAME, AND INFORMATION HANDLING SYSTEM UTILIZING
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09/29/2009
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05/01/2008
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06/16/2009
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11/14/2006
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05/15/2008
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03/10/2009
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12/04/2006
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04/05/2007
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05/27/2008
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12/20/2006
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06/28/2007
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Title:
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METHOD OF MAKING CIRCUITIZED SUBSTRATE WITH SPLIT CONDUCTIVE LAYER AND INFORMATION HANDLING SYSTEM UTILIZING SAME
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Patent #:
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Issue Dt:
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10/06/2009
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Application #:
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11652633
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Filing Dt:
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01/12/2007
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Publication #:
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Pub Dt:
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07/17/2008
| | | | |
Title:
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METHOD OF PROVIDING A PRINTED CIRCUIT BOARD WITH AN EDGE CONNECTION PORTION AND/OR A PLURALITY OF CAVITIES THEREIN
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Patent #:
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Issue Dt:
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03/22/2011
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Application #:
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11730212
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Filing Dt:
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03/30/2007
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Publication #:
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Pub Dt:
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10/02/2008
| | | | |
Title:
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METHOD OF MAKING CIRCUITIZED SUBSTRATE WITH SELECTED CONDUCTORS HAVING SOLDER THEREON
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Patent #:
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Issue Dt:
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11/30/2010
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Application #:
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11730404
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Filing Dt:
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04/02/2007
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Publication #:
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Pub Dt:
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10/02/2008
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Title:
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LED LIGHTING ASSEMBLY AND LAMP UTILIZING SAME
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Patent #:
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Issue Dt:
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08/26/2008
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Application #:
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11730942
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Filing Dt:
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04/05/2007
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Publication #:
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Pub Dt:
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08/09/2007
| | | | |
Title:
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METHOD OF MAKING SAME LOW MOISTURE ABSORPTIVE CIRCUITIZED SUBSTRAVE WITH REDUCED THERMAL EXPANSION
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Patent #:
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Issue Dt:
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09/21/2010
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Application #:
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11783306
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Filing Dt:
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04/09/2007
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Publication #:
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Pub Dt:
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10/09/2008
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Title:
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CIRCUITIZED SUBSTRATE WITH INTERNAL STACKED SEMICONDUCTOR CHIPS, METHOD OF MAKING SAME, ELECTRICAL ASSEMBLY UTILIZING SAME AND INFORMATION HANDLING SYSTEM UTILIZING SAME
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Patent #:
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Issue Dt:
|
11/22/2011
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Application #:
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11802434
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Filing Dt:
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05/23/2007
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Publication #:
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Pub Dt:
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09/27/2007
| | | | |
Title:
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CIRCUITIZED SUBSTRATE WITH CONDUCTIVE PASTE, ELECTRICAL ASSEMBLY INCLUDING SAID CIRCUITIZED SUBSTRATE AND METHOD OF MAKING SAID SUBSTRATE
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Patent #:
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Issue Dt:
|
03/30/2010
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Application #:
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11806685
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Filing Dt:
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06/04/2007
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Publication #:
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Pub Dt:
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04/17/2008
| | | | |
Title:
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CIRCUITIZED SUBSTRATE WITH INTERNAL RESISTOR, METHOD OF MAKING SAID CIRCUITIZED SUBSTRATE, AND ELECTRICAL ASSEMBLY UTILIZING SAID CIRCUITIZED SUBSTRATE
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Patent #:
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Issue Dt:
|
05/11/2010
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Application #:
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11808140
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Filing Dt:
|
06/07/2007
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Publication #:
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Pub Dt:
|
12/11/2008
| | | | |
Title:
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METHOD OF PROVIDING A PRINTED CIRCUIT BOARD WITH AN EDGE CONNECTION PORTION
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Patent #:
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Issue Dt:
|
05/21/2013
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Application #:
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11896786
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Filing Dt:
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09/06/2007
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Publication #:
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Pub Dt:
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01/03/2008
| | | | |
Title:
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Circuitized substrate with dielectric layer having dielectric composition not including continuous or semi-continuous fibers
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Patent #:
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Issue Dt:
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03/31/2009
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Application #:
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11902976
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Filing Dt:
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09/27/2007
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Publication #:
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Pub Dt:
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01/24/2008
| | | | |
Title:
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METHOD OF MAKING AN INTERPOSER
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Patent #:
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Issue Dt:
|
11/02/2010
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Application #:
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11905188
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Filing Dt:
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09/28/2007
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Publication #:
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Pub Dt:
|
01/31/2008
| | | | |
Title:
|
METHOD OF MAKING MULTILAYERED CIRCUITIZED SUBSTRATE ASSEMBLY
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Patent #:
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Issue Dt:
|
05/11/2010
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Application #:
|
11907004
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Filing Dt:
|
10/09/2007
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Publication #:
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Pub Dt:
|
04/09/2009
| | | | |
Title:
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METHOD OF MAKING CIRCUITIZED SUBSTRATE WITH INTERNAL OPTICAL PATHWAY USING PHOTOLITHOGRAPHY
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Patent #:
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Issue Dt:
|
06/02/2009
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Application #:
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11907006
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Filing Dt:
|
10/09/2007
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Publication #:
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|
Pub Dt:
|
04/09/2009
| | | | |
Title:
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METHOD OF MAKING CIRCUITIZED SUBSTRATE WITH INTERNAL OPTICAL PATHWAY
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Patent #:
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Issue Dt:
|
06/15/2010
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Application #:
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11976468
|
Filing Dt:
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10/25/2007
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Publication #:
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Pub Dt:
|
04/30/2009
| | | | |
Title:
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CIRCUITIZED SUBSTRATE WITH INTERNAL COOLING STRUCTURE AND ELECTRICAL ASSEMBLY UTILIZING SAME
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Patent #:
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Issue Dt:
|
02/17/2009
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Application #:
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12010004
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Filing Dt:
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01/18/2008
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Publication #:
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Pub Dt:
|
05/22/2008
| | | | |
Title:
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INFORMATION HANDLING SYSTEM UTILIZING CIRCUITIZED SUBSTRATE WITH SPLIT CONDUCTIVE LAYER
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Patent #:
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Issue Dt:
|
01/25/2011
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Application #:
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12010335
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Filing Dt:
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01/24/2008
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Publication #:
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Pub Dt:
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06/19/2008
| | | | |
Title:
|
HIGH SPEED INTERPOSER
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Patent #:
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Issue Dt:
|
01/12/2010
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Application #:
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12081042
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Filing Dt:
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04/10/2008
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Publication #:
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Pub Dt:
|
08/14/2008
| | | | |
Title:
|
MULTILAYERED CIRCUITIZED SUBSTRATE WITH P-ARAMID DIELECTRIC LAYERS AND METHOD OF MAKING SAME
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Patent #:
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Issue Dt:
|
12/27/2011
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Application #:
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12081051
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Filing Dt:
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04/10/2008
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Publication #:
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Pub Dt:
|
08/14/2008
| | | | |
Title:
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CIRCUITIZED SUBSTRATE WITH CONTINUOUS THERMOPLASTIC SUPPORT FILM DIELECTRIC LAYERS
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Patent #:
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Issue Dt:
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09/07/2010
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Application #:
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12283146
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Filing Dt:
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09/09/2008
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Publication #:
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Pub Dt:
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03/11/2010
| | | | |
Title:
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MULTI-LAYER EMBEDDED CAPACITANCE AND RESISTANCE SUBSTRATE CORE
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Patent #:
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Issue Dt:
|
09/28/2010
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Application #:
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12380616
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Filing Dt:
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03/02/2009
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Publication #:
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Pub Dt:
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08/20/2009
| | | | |
Title:
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CAPACITIVE SUBSTRATE AND METHOD OF MAKING SAME
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Patent #:
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Issue Dt:
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08/06/2013
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Application #:
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12380618
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Filing Dt:
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03/02/2009
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Publication #:
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Pub Dt:
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07/09/2009
| | | | |
Title:
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METHOD OF MAKING HALOGEN-FREE CIRCUITIZED SUBSTRATE WITH REDUCED THERMAL EXPANSION
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Patent #:
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Issue Dt:
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08/16/2016
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Application #:
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12589239
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Filing Dt:
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10/20/2009
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Publication #:
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Pub Dt:
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02/17/2011
| | | | |
Title:
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Method of making a circuitized substrate
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Patent #:
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Issue Dt:
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03/26/2013
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Application #:
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12592682
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Filing Dt:
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11/30/2009
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Publication #:
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Pub Dt:
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06/02/2011
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Title:
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ELECTRONIC PACKAGE INCLUDING HIGH DENSITY INTERPOSER AND CIRCUITIZED SUBSTRATE ASSEMBLY UTILIZING SAME
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Patent #:
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Issue Dt:
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08/21/2012
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Application #:
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12592734
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Filing Dt:
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12/01/2009
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Publication #:
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Pub Dt:
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06/02/2011
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Title:
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METHOD OF MAKING HIGH DENSITY INTERPOSER AND ELECTRONIC PACKAGE UTILIZING SAME
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Patent #:
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Issue Dt:
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03/27/2012
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Application #:
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12720849
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Filing Dt:
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03/10/2010
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Publication #:
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Pub Dt:
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07/01/2010
| | | | |
Title:
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MULTI-LAYER EMBEDDED CAPACITANCE AND RESISTANCE SUBSTRATE CORE
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Patent #:
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Issue Dt:
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09/24/2013
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Application #:
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12764993
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Filing Dt:
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04/22/2010
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Publication #:
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Pub Dt:
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06/28/2012
| | | | |
Title:
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CORELESS LAYER BUILDUP STRUCTURE
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Patent #:
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Issue Dt:
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09/17/2013
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Application #:
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12764994
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Filing Dt:
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04/22/2010
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Publication #:
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Pub Dt:
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06/28/2012
| | | | |
Title:
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CORELESS LAYER BUILDUP STRUCTURE WITH LGA
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Patent #:
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Issue Dt:
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05/24/2016
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Application #:
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12764997
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Filing Dt:
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04/22/2010
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Publication #:
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Pub Dt:
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02/09/2012
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Title:
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CORELESS LAYER BUILDUP STRUCTURE WITH LGA AND JOINING LAYER
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Patent #:
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Issue Dt:
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06/12/2012
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Application #:
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12782187
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Filing Dt:
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05/18/2010
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Publication #:
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Pub Dt:
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11/24/2011
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Title:
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POWER CORE FOR USE IN CIRCUITIZED SUBSTRATE AND METHOD OF MAKING SAME
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Patent #:
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Issue Dt:
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06/12/2012
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Application #:
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12836612
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08/13/2010
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Publication #:
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Pub Dt:
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02/16/2012
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Title:
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SEMI-CONDUCTOR CHIP WITH COMPRESSIBLE CONTACT STRUCTURE AND ELECTRONIC PACKAGE UTILIZING SAME
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Patent #:
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08/14/2012
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12837640
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07/16/2010
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Pub Dt:
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01/19/2012
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Title:
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A METHOD OF JOINING A SEMICONDUCTOR DEVICE/CHIP TO A PRINTED WIRING BOARD
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Patent #:
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04/01/2014
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12884657
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09/17/2010
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03/22/2012
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Title:
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CONDUCTING PASTE FOR DEVICE LEVEL INTERCONNECTS
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08/06/2013
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12909983
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10/22/2010
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09/06/2012
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Title:
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METHOD OF FORMING MULTILAYER CAPACITORS IN A PRINTED CIRCUIT SUBSTRATE
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10/30/2012
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12972700
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12/20/2010
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06/21/2012
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Title:
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CIRCUITIZED SUBSTRATE WITH DIELECTRIC INTERPOSER ASSEMBLY AND METHOD
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08/06/2013
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13184699
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07/18/2011
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Title:
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A METHOD OF FORMING AN ELECTRICALLY CONDUCTIVE PRINTED LINE
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Patent #:
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Issue Dt:
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09/20/2016
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13198756
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08/05/2011
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02/07/2013
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Title:
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ELECTRICALLY CONDUCTIVE ADHESIVE (ECA) FOR MULTILAYER DEVICE INTERCONNECTS
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Patent #:
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09/05/2017
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13252256
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10/04/2011
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Pub Dt:
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01/26/2012
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Title:
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METHOD OF MAKING A CIRCUITIZED SUBSTRATE
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05/21/2013
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13269770
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10/10/2011
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Title:
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CIRCUITIZED SUBSTRATE WITH LOW LOSS CAPACITIVE MATERIAL AND METHOD OF MAKING SAME
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Issue Dt:
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11/26/2013
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13358716
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01/26/2012
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Title:
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SOLDER AND ELECTRICALLY CONDUCTIVE ADHESIVE BASED INTERCONNECTION FOR CZT CRYSTAL ATTACH
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Issue Dt:
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12/17/2013
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13517776
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06/14/2012
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Title:
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SUBSTRATE HAVING INTERNAL CAPACITOR AND METHOD OF MAKING SAME
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