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Reel/Frame:051838/0444   Pages: 9
Recorded: 02/18/2020
Attorney Dkt #:PA01GETOIMBERATEK02
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 26
1
Patent #:
7732909
Issue Dt:
06/08/2010
Application #:
11797609
Filing Dt:
05/04/2007
Publication #:
US20070206366
Pub Dt:
09/06/2007
Title:
METHOD FOR EMBEDDING A COMPONENT IN A BASE
2
Patent #:
7989944
Issue Dt:
08/02/2011
Application #:
11878557
Filing Dt:
07/25/2007
Publication #:
US20080036093
Pub Dt:
02/14/2008
Title:
METHOD FOR EMBEDDING A COMPONENT IN A BASE
3
Patent #:
7609527
Issue Dt:
10/27/2009
Application #:
11907795
Filing Dt:
10/17/2007
Publication #:
US20080043441
Pub Dt:
02/21/2008
Title:
ELECTRONIC MODULE
4
Patent #:
8817485
Issue Dt:
08/26/2014
Application #:
12603324
Filing Dt:
10/21/2009
Publication #:
US20100103635
Pub Dt:
04/29/2010
Title:
SINGLE-LAYER COMPONENT PACKAGE
5
Patent #:
8034658
Issue Dt:
10/11/2011
Application #:
12619350
Filing Dt:
11/16/2009
Publication #:
US20100062568
Pub Dt:
03/11/2010
Title:
ELECTRONIC MODULE WITH A CONDUCTIVE-PATTERN LAYER AND A METHOD OF MANUFACTURING SAME
6
Patent #:
8222723
Issue Dt:
07/17/2012
Application #:
12699628
Filing Dt:
02/03/2010
Publication #:
US20100202114
Pub Dt:
08/12/2010
Title:
ELECTRIC MODULE HAVING A CONDUCTIVE PATTERN LAYER
7
Patent #:
8487194
Issue Dt:
07/16/2013
Application #:
12702653
Filing Dt:
02/09/2010
Publication #:
US20100202115
Pub Dt:
08/12/2010
Title:
CIRCUIT BOARD INCLUDING AN EMBEDDED COMPONENT
8
Patent #:
9232658
Issue Dt:
01/05/2016
Application #:
12753329
Filing Dt:
04/02/2010
Publication #:
US20100188823
Pub Dt:
07/29/2010
Title:
METHOD FOR MANUFACTURING AN ELECTRONIC MODULE
9
Patent #:
8351214
Issue Dt:
01/08/2013
Application #:
12773628
Filing Dt:
05/04/2010
Publication #:
US20100214750
Pub Dt:
08/26/2010
Title:
ELECTRONICS MODULE COMPRISING AN EMBEDDED MICROCIRCUIT
10
Patent #:
8455994
Issue Dt:
06/04/2013
Application #:
12842056
Filing Dt:
07/23/2010
Publication #:
US20100308452
Pub Dt:
12/09/2010
Title:
ELECTRONIC MODULE WITH FEED THROUGH CONDUCTOR BETWEEN WIRING PATTERNS
11
Patent #:
8368201
Issue Dt:
02/05/2013
Application #:
13185165
Filing Dt:
07/18/2011
Publication #:
US20110266041
Pub Dt:
11/03/2011
Title:
METHOD FOR EMBEDDING A COMPONENT IN A BASE
12
Patent #:
9622354
Issue Dt:
04/11/2017
Application #:
14076292
Filing Dt:
11/11/2013
Publication #:
US20140059851
Pub Dt:
03/06/2014
Title:
Method for Manufacturing a Circuit Board Structure
13
Patent #:
9691724
Issue Dt:
06/27/2017
Application #:
14161735
Filing Dt:
01/23/2014
Publication #:
US20140131870
Pub Dt:
05/15/2014
Title:
MULTI-CHIP PACKAGE AND MANUFACTURING METHOD
14
Patent #:
9107324
Issue Dt:
08/11/2015
Application #:
14231758
Filing Dt:
04/01/2014
Publication #:
US20140210090
Pub Dt:
07/31/2014
Title:
CIRCUIT MODULE AND METHOD OF MANUFACTURING THE SAME
15
Patent #:
10231335
Issue Dt:
03/12/2019
Application #:
14285710
Filing Dt:
05/23/2014
Publication #:
US20140254107
Pub Dt:
09/11/2014
Title:
Electronic module with embedded jumper conductor
16
Patent #:
10085345
Issue Dt:
09/25/2018
Application #:
14467079
Filing Dt:
08/25/2014
Publication #:
US20150043177
Pub Dt:
02/12/2015
Title:
ELECTRONIC MODULE
17
Patent #:
10798823
Issue Dt:
10/06/2020
Application #:
14580257
Filing Dt:
12/23/2014
Publication #:
US20150124411
Pub Dt:
05/07/2015
Title:
METHOD FOR MANUFACTURING AN ELECTRONIC MODULE AND ELECTRONIC MODULE
18
Patent #:
10010019
Issue Dt:
06/26/2018
Application #:
14622954
Filing Dt:
02/16/2015
Publication #:
US20150163966
Pub Dt:
06/11/2015
Title:
Electronic module with EMI protection
19
Patent #:
10085347
Issue Dt:
09/25/2018
Application #:
14660991
Filing Dt:
03/18/2015
Publication #:
US20150289379
Pub Dt:
10/08/2015
Title:
Manufacture of a circuit board and circuit board containing a component
20
Patent #:
9324647
Issue Dt:
04/26/2016
Application #:
14821818
Filing Dt:
08/10/2015
Publication #:
US20150348878
Pub Dt:
12/03/2015
Title:
Circuit module and method of manufacturing the same
21
Patent #:
9883587
Issue Dt:
01/30/2018
Application #:
15084530
Filing Dt:
03/30/2016
Publication #:
US20160212855
Pub Dt:
07/21/2016
Title:
Circuit module and method of manufacturing the same
22
Patent #:
9674948
Issue Dt:
06/06/2017
Application #:
15211051
Filing Dt:
07/15/2016
Publication #:
US20160330830
Pub Dt:
11/10/2016
Title:
RIGID-FLEX ELECTRONIC MODULE
23
Patent #:
11134572
Issue Dt:
09/28/2021
Application #:
15355096
Filing Dt:
11/18/2016
Publication #:
US20170071061
Pub Dt:
03/09/2017
Title:
Circuit board structure and method for manufacturing a circuit board structure
24
Patent #:
9820375
Issue Dt:
11/14/2017
Application #:
15407273
Filing Dt:
01/17/2017
Publication #:
US20170127508
Pub Dt:
05/04/2017
Title:
RIGID-FLEX MODULE AND MANUFACTURING METHOD
25
Patent #:
10470346
Issue Dt:
11/05/2019
Application #:
15990712
Filing Dt:
05/28/2018
Publication #:
US20180352689
Pub Dt:
12/06/2018
Title:
Electronic module with EMI protection
26
Patent #:
10765006
Issue Dt:
09/01/2020
Application #:
16104979
Filing Dt:
08/20/2018
Publication #:
US20180376597
Pub Dt:
12/27/2018
Title:
Electronic module
Assignor
1
GE EMBEDDED ELECTRONICS OY
Exec Dt:
01/13/2020
Assignee
1
IMBERATEK, LLC
13921 PARK CENTER RD, SUITE 380
HERNDON, VIRGINIA 20171
Correspondence name and address
YEASUN YOON
20319 KIAWAH ISLAND DR
ASHBURN, VA 20147

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