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Patent Assignment Details
NOTE:Results display only for issued patents and published applications. For pending or abandoned applications please consult USPTO staff.

Reel/Frame:054134/0172   Pages: 5
Recorded: 10/20/2020
Attorney Dkt #:400084-169461
Conveyance: STATEMENT REGARDING SECURITY INTEREST INCORRECTLY RECORDED AGAINST PATENTS
Total properties: 42
1
Patent #:
7294529
Issue Dt:
11/13/2007
Application #:
10502336
Filing Dt:
09/23/2004
Publication #:
US20050224988
Pub Dt:
10/13/2005
Title:
METHOD FOR EMBEDDING A COMPONENT IN A BASE
2
Patent #:
6991966
Issue Dt:
01/31/2006
Application #:
10502340
Filing Dt:
09/23/2004
Publication #:
US20050124148
Pub Dt:
06/09/2005
Title:
METHOD FOR EMBEDDING A COMPONENT IN A BASE AND FORMING A CONTACT
3
Patent #:
7299546
Issue Dt:
11/27/2007
Application #:
10546820
Filing Dt:
08/25/2005
Publication #:
US20060218782
Pub Dt:
10/05/2006
Title:
METHOD FOR MANUFACTURING AN ELECTRONIC MODULE
4
Patent #:
7696005
Issue Dt:
04/13/2010
Application #:
10572340
Filing Dt:
11/14/2006
Publication #:
US20070166886
Pub Dt:
07/19/2007
Title:
METHOD FOR MANUFACTURING AN ELECTRONIC MODULE IN AN INSTALLATION BASE
5
Patent #:
8240032
Issue Dt:
08/14/2012
Application #:
11570673
Filing Dt:
06/30/2008
Publication #:
US20080261338
Pub Dt:
10/23/2008
Title:
METHOD FOR MANUFACTURING AN ELECTRONICS MODULE COMPRISING A COMPONENT ELECTRICALLY CONNECTED TO A CONDUCTOR-PATTERN LAYER
6
Patent #:
8076586
Issue Dt:
12/13/2011
Application #:
11587694
Filing Dt:
02/09/2007
Publication #:
US20070227761
Pub Dt:
10/04/2007
Title:
HEAT CONDUCTION FROM AN EMBEDDED COMPONENT
7
Patent #:
7673387
Issue Dt:
03/09/2010
Application #:
11659190
Filing Dt:
02/02/2007
Publication #:
US20080295326
Pub Dt:
12/04/2008
Title:
MANUFACTURE OF A LAYER INCLUDING A COMPONENT
8
Patent #:
8062537
Issue Dt:
11/22/2011
Application #:
11667429
Filing Dt:
05/09/2007
Publication #:
US20070267136
Pub Dt:
11/22/2007
Title:
METHOD FOR MANUFACTURING AN ELECTRONICS MODULE
9
Patent #:
8547701
Issue Dt:
10/01/2013
Application #:
11791547
Filing Dt:
09/28/2007
Publication #:
US20080094805
Pub Dt:
04/24/2008
Title:
ELECTRONICS MODULE AND METHOD FOR MANUFACTURING THE SAME
10
Patent #:
7732909
Issue Dt:
06/08/2010
Application #:
11797609
Filing Dt:
05/04/2007
Publication #:
US20070206366
Pub Dt:
09/06/2007
Title:
METHOD FOR EMBEDDING A COMPONENT IN A BASE
11
Patent #:
7989944
Issue Dt:
08/02/2011
Application #:
11878557
Filing Dt:
07/25/2007
Publication #:
US20080036093
Pub Dt:
02/14/2008
Title:
METHOD FOR EMBEDDING A COMPONENT IN A BASE
12
Patent #:
7609527
Issue Dt:
10/27/2009
Application #:
11907795
Filing Dt:
10/17/2007
Publication #:
US20080043441
Pub Dt:
02/21/2008
Title:
ELECTRONIC MODULE
13
Patent #:
8240033
Issue Dt:
08/14/2012
Application #:
11917711
Filing Dt:
04/28/2008
Publication #:
US20080196930
Pub Dt:
08/21/2008
Title:
METHOD FOR MANUFACTURING A CIRCUIT BOARD
14
Patent #:
8225499
Issue Dt:
07/24/2012
Application #:
11917724
Filing Dt:
04/28/2008
Publication #:
US20090014872
Pub Dt:
01/15/2009
Title:
METHOD FOR MANUFACTURING A CIRCUIT BOARD STRUCTURE, AND A CIRCUIT BOARD STRUCTURE
15
Patent #:
8581109
Issue Dt:
11/12/2013
Application #:
11917737
Filing Dt:
04/28/2008
Publication #:
US20080202801
Pub Dt:
08/28/2008
Title:
METHOD FOR MANUFACTURING A CIRCUIT BOARD STRUCTURE
16
Patent #:
8984746
Issue Dt:
03/24/2015
Application #:
12293412
Filing Dt:
09/17/2008
Publication #:
US20090133251
Pub Dt:
05/28/2009
Title:
MANUFACTURE OF A CIRCUIT BOARD CONTAINING A COMPONENT
17
Patent #:
8286341
Issue Dt:
10/16/2012
Application #:
12420617
Filing Dt:
04/08/2009
Publication #:
US20090260866
Pub Dt:
10/22/2009
Title:
METHOD OF MANUFACTURING A WIRING BOARD
18
Patent #:
8659134
Issue Dt:
02/25/2014
Application #:
12506519
Filing Dt:
07/21/2009
Publication #:
US20100052129
Pub Dt:
03/04/2010
Title:
MULTI-CHIP PACKAGE AND MANUFACTURING METHOD
19
Patent #:
8631566
Issue Dt:
01/21/2014
Application #:
12546454
Filing Dt:
08/24/2009
Publication #:
US20100046186
Pub Dt:
02/25/2010
Title:
CIRCUIT BOARD STRUCTURE COMPRISING AN ELECTRICAL COMPONENT AND A METHOD FOR MANUFACTURING A CIRCUIT BOARD STRUCTURE COMPRISING AN ELECTRICAL COMPONENT
20
Patent #:
8817485
Issue Dt:
08/26/2014
Application #:
12603324
Filing Dt:
10/21/2009
Publication #:
US20100103635
Pub Dt:
04/29/2010
Title:
SINGLE-LAYER COMPONENT PACKAGE
21
Patent #:
8034658
Issue Dt:
10/11/2011
Application #:
12619350
Filing Dt:
11/16/2009
Publication #:
US20100062568
Pub Dt:
03/11/2010
Title:
ELECTRONIC MODULE WITH A CONDUCTIVE-PATTERN LAYER AND A METHOD OF MANUFACTURING SAME
22
Patent #:
8222723
Issue Dt:
07/17/2012
Application #:
12699628
Filing Dt:
02/03/2010
Publication #:
US20100202114
Pub Dt:
08/12/2010
Title:
ELECTRIC MODULE HAVING A CONDUCTIVE PATTERN LAYER
23
Patent #:
8487194
Issue Dt:
07/16/2013
Application #:
12702653
Filing Dt:
02/09/2010
Publication #:
US20100202115
Pub Dt:
08/12/2010
Title:
CIRCUIT BOARD INCLUDING AN EMBEDDED COMPONENT
24
Patent #:
9232658
Issue Dt:
01/05/2016
Application #:
12753329
Filing Dt:
04/02/2010
Publication #:
US20100188823
Pub Dt:
07/29/2010
Title:
METHOD FOR MANUFACTURING AN ELECTRONIC MODULE
25
Patent #:
8351214
Issue Dt:
01/08/2013
Application #:
12773628
Filing Dt:
05/04/2010
Publication #:
US20100214750
Pub Dt:
08/26/2010
Title:
ELECTRONICS MODULE COMPRISING AN EMBEDDED MICROCIRCUIT
26
Patent #:
8238113
Issue Dt:
08/07/2012
Application #:
12842052
Filing Dt:
07/23/2010
Publication #:
US20120020044
Pub Dt:
01/26/2012
Title:
ELECTRONIC MODULE WITH VERTICAL CONNECTOR BETWEEN CONDUCTOR PATTERNS
27
Patent #:
8735735
Issue Dt:
05/27/2014
Application #:
12842055
Filing Dt:
07/23/2010
Publication #:
US20120018203
Pub Dt:
01/26/2012
Title:
ELECTRONIC MODULE WITH EMBEDDED JUMPER CONDUCTOR
28
Patent #:
8455994
Issue Dt:
06/04/2013
Application #:
12842056
Filing Dt:
07/23/2010
Publication #:
US20100308452
Pub Dt:
12/09/2010
Title:
ELECTRONIC MODULE WITH FEED THROUGH CONDUCTOR BETWEEN WIRING PATTERNS
29
Patent #:
9420694
Issue Dt:
08/16/2016
Application #:
12872538
Filing Dt:
08/31/2010
Publication #:
US20120048605
Pub Dt:
03/01/2012
Title:
METHOD FOR CONTROLLING WARPAGE WITHIN ELECTRONIC PRODUCTS AND AN ELECTRONIC PRODUCT
30
Patent #:
8699233
Issue Dt:
04/15/2014
Application #:
12990785
Filing Dt:
11/03/2010
Publication #:
US20110061909
Pub Dt:
03/17/2011
Title:
CIRCUIT MODULE AND METHOD OF MANUFACTURING THE SAME
31
Patent #:
8704359
Issue Dt:
04/22/2014
Application #:
13118650
Filing Dt:
05/31/2011
Publication #:
US20110291293
Pub Dt:
12/01/2011
Title:
METHOD FOR MANUFACTURING AN ELECTRONIC MODULE AND AN ELECTRONIC MODULE
32
Patent #:
8368201
Issue Dt:
02/05/2013
Application #:
13185165
Filing Dt:
07/18/2011
Publication #:
US20110266041
Pub Dt:
11/03/2011
Title:
METHOD FOR EMBEDDING A COMPONENT IN A BASE
33
Patent #:
9301394
Issue Dt:
03/29/2016
Application #:
13698670
Filing Dt:
03/25/2013
Publication #:
US20130175075
Pub Dt:
07/11/2013
Title:
MANUFACTURING METHOD AND ELECTRONIC MODULE WITH NEW ROUTING POSSIBILITIES
34
Patent #:
9622354
Issue Dt:
04/11/2017
Application #:
14076292
Filing Dt:
11/11/2013
Publication #:
US20140059851
Pub Dt:
03/06/2014
Title:
Method for Manufacturing a Circuit Board Structure
35
Patent #:
9107324
Issue Dt:
08/11/2015
Application #:
14231758
Filing Dt:
04/01/2014
Publication #:
US20140210090
Pub Dt:
07/31/2014
Title:
CIRCUIT MODULE AND METHOD OF MANUFACTURING THE SAME
36
Patent #:
10085345
Issue Dt:
09/25/2018
Application #:
14467079
Filing Dt:
08/25/2014
Publication #:
US20150043177
Pub Dt:
02/12/2015
Title:
ELECTRONIC MODULE
37
Patent #:
9999136
Issue Dt:
06/12/2018
Application #:
14569900
Filing Dt:
12/15/2014
Publication #:
US20160174387
Pub Dt:
06/16/2016
Title:
METHOD FOR FABRICATION OF AN ELECTRONIC MODULE AND ELECTRONIC MODULE
38
Patent #:
10010019
Issue Dt:
06/26/2018
Application #:
14622954
Filing Dt:
02/16/2015
Publication #:
US20150163966
Pub Dt:
06/11/2015
Title:
Electronic module with EMI protection
39
Patent #:
9363898
Issue Dt:
06/07/2016
Application #:
14623569
Filing Dt:
02/17/2015
Publication #:
US20150163920
Pub Dt:
06/11/2015
Title:
METHOD FOR MANUFACTURING AN ELECTRONIC MODULE AND AN ELECTRONIC MODULE
40
Patent #:
10085347
Issue Dt:
09/25/2018
Application #:
14660991
Filing Dt:
03/18/2015
Publication #:
US20150289379
Pub Dt:
10/08/2015
Title:
Manufacture of a circuit board and circuit board containing a component
41
Patent #:
9324647
Issue Dt:
04/26/2016
Application #:
14821818
Filing Dt:
08/10/2015
Publication #:
US20150348878
Pub Dt:
12/03/2015
Title:
Circuit module and method of manufacturing the same
42
Patent #:
9883587
Issue Dt:
01/30/2018
Application #:
15084530
Filing Dt:
03/30/2016
Publication #:
US20160212855
Pub Dt:
07/21/2016
Title:
Circuit module and method of manufacturing the same
Assignors
1
ACACIA RESEARCH GROUP LLC
Exec Dt:
10/19/2020
2
R2 SOLUTIONS LLC
Exec Dt:
10/19/2020
Assignee
1
IMBERATEK, LLC
13921 PARK CENTER RD, SUITE 380
HERNDON, VIRGINIA 20171
Correspondence name and address
DECHERT LLP
THREE BRYANT PARK
1095 AVENUE OF THE AMERICAS
NEW YORK, NY 10036

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