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Patent #:
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Issue Dt:
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02/17/2004
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Application #:
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09992810
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Filing Dt:
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11/19/2001
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Publication #:
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Pub Dt:
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10/03/2002
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Title:
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PCB EMBEDDED AND SURFACE MOUNTED OPTICAL DISTRIBUTION SYSTEMS
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Patent #:
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Issue Dt:
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02/01/2005
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Application #:
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10051418
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Filing Dt:
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10/30/2001
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Publication #:
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Pub Dt:
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11/28/2002
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Title:
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FIBER OPTIC CIRCUIT BOARD CONNECTOR
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Patent #:
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Issue Dt:
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03/30/2004
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Application #:
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10060563
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Filing Dt:
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01/30/2002
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Publication #:
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Pub Dt:
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07/31/2003
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Title:
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INTEGRATED CIRCUIT HEAT SINK DEVICE INCLUDING THROUGH HOLE TO FACILITATE COMMUNICATION
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Patent #:
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Issue Dt:
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07/15/2003
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Application #:
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10179756
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Filing Dt:
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06/25/2002
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Publication #:
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Pub Dt:
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12/26/2002
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Title:
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BENDING AN OPTICAL FIBER INTO A BACKPLANE
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Patent #:
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Issue Dt:
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12/21/2004
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Application #:
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10179758
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Filing Dt:
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06/25/2002
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Publication #:
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Pub Dt:
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01/09/2003
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Title:
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SYSTEM AND METHOD FOR INTEGRATING OPTICAL LAYERS IN A PCB FOR INTER-BOARD COMMUNICATIONS
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Patent #:
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Issue Dt:
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08/31/2004
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Application #:
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10207582
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Filing Dt:
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07/29/2002
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Publication #:
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Pub Dt:
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01/29/2004
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Title:
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QUADRIFILAR ANTENNA SERIAL FEED
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Patent #:
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Issue Dt:
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08/31/2004
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Application #:
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10272324
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Filing Dt:
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10/16/2002
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Publication #:
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Pub Dt:
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01/29/2004
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Title:
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MULTIPORT SERIAL FEED DEVICE
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Patent #:
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Issue Dt:
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11/16/2004
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Application #:
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10273820
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Filing Dt:
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10/18/2002
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Publication #:
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Pub Dt:
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10/23/2003
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Title:
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SYSTEM AND METHOD FOR ELECTROLYTIC PLATING
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Patent #:
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Issue Dt:
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10/26/2004
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Application #:
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10322527
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Filing Dt:
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12/19/2002
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Publication #:
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Pub Dt:
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06/24/2004
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Title:
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CIRCUITIZED SUBSTRATE ASSEMBLY AND METHOD OF MAKING SAME
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Patent #:
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Issue Dt:
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03/29/2005
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Application #:
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10379575
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Filing Dt:
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03/06/2003
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Publication #:
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Pub Dt:
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06/24/2004
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Title:
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INFORMATION HANDLING SYSTEM UTILIZING CIRCUITIZED SUBSTRATE
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Patent #:
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Issue Dt:
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11/09/2004
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Application #:
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10423877
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Filing Dt:
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04/28/2003
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Publication #:
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Pub Dt:
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09/23/2004
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Title:
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ELECTRONIC PACKAGE WITH STRENGTHENED CONDUCTIVE PAD
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Patent #:
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Issue Dt:
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08/08/2006
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Application #:
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10423972
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Filing Dt:
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04/28/2003
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Publication #:
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Pub Dt:
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09/23/2004
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Title:
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PINNED ELECTRONIC PACKAGE WITH STRENGTHENED CONDUCTIVE PAD
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Patent #:
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Issue Dt:
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02/28/2006
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Application #:
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10445766
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Filing Dt:
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05/27/2003
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Publication #:
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Pub Dt:
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01/01/2004
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Title:
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CIRCULATOR AND METHOD OF MANUFACTURE
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Patent #:
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Issue Dt:
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07/03/2007
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Application #:
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10609068
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Filing Dt:
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06/27/2003
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Publication #:
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Pub Dt:
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01/13/2005
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Title:
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METHOD FOR ANALYZING MATERIAL DENSITY VARIATIONS ON A MULTI-LAYER PRINTED CIRCUIT BOARD
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Patent #:
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Issue Dt:
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08/24/2004
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Application #:
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10618786
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Filing Dt:
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07/14/2003
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Publication #:
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Pub Dt:
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01/15/2004
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Title:
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BENDING AN OPTICAL FIBER INTO BACKPLANE
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Patent #:
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Issue Dt:
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09/19/2006
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Application #:
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10630722
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Filing Dt:
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07/31/2003
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Publication #:
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Pub Dt:
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02/03/2005
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Title:
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ELECTRONIC COMPONENT TEST APPARATUS
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Patent #:
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Issue Dt:
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01/31/2006
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Application #:
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10661616
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Filing Dt:
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09/15/2003
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Publication #:
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Pub Dt:
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08/05/2004
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Title:
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STACKED CHIP ELECTRONIC PACKAGE HAVING LAMINATE CARRIER AND METHOD OF MAKING SAME
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Patent #:
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Issue Dt:
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02/28/2006
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Application #:
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10719817
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Filing Dt:
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11/21/2003
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Publication #:
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Pub Dt:
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05/26/2005
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Title:
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NON-SWITCHING ADAPTABLE 4-WAY POWER SPLITTER/COMBINER
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Patent #:
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Issue Dt:
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05/01/2007
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Application #:
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10737974
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Filing Dt:
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12/18/2003
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Publication #:
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Pub Dt:
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06/23/2005
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Title:
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Method of making multilayered printed circuit board with filled conductive holes
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Patent #:
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Issue Dt:
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02/13/2007
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Application #:
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10740398
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Filing Dt:
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12/22/2003
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Publication #:
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Pub Dt:
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06/23/2005
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Title:
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PRINTED CIRCUIT BOARD WITH LOW CROSS-TALK NOISE
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Patent #:
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Issue Dt:
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04/24/2007
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Application #:
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10790747
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Filing Dt:
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03/03/2004
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Publication #:
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Pub Dt:
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09/08/2005
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Title:
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CIRCUITIZED SUBSTRATE WITH SIGNAL WIRE SHIELDING, ELECTRICAL ASSEMBLY UTILIZING SAME AND METHOD OF MAKING
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Patent #:
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Issue Dt:
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09/18/2007
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Application #:
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10812889
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Filing Dt:
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03/31/2004
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Publication #:
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Pub Dt:
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10/13/2005
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Title:
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DIELECTRIC COMPOSITION FOR FORMING DIELECTRIC LAYER FOR USE IN CIRCUITIZED SUBSTRATES
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Patent #:
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Issue Dt:
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07/18/2006
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Application #:
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10812890
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Filing Dt:
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03/31/2004
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Publication #:
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Pub Dt:
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10/13/2005
| | | | |
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Title:
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CIRCUITIZED SUBSTRATE
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Patent #:
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Issue Dt:
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12/20/2005
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Application #:
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10825980
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Filing Dt:
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04/16/2004
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Publication #:
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Pub Dt:
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10/07/2004
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Title:
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FIBER OPTIC CIRCUIT CONNECTOR
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Patent #:
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Issue Dt:
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06/13/2006
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Application #:
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10862800
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Filing Dt:
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06/07/2004
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Publication #:
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Pub Dt:
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10/13/2005
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Title:
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AUXILIARY AMPLIFIER NETWORK
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Patent #:
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Issue Dt:
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01/02/2007
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Application #:
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10882167
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Filing Dt:
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07/02/2004
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Publication #:
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Pub Dt:
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01/05/2006
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Title:
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CIRCUITIZED SUBSTRATE WITH SPLIT CONDUCTIVE LAYER, METHOD OF MAKING SAME, ELECTRICAL ASSEMBLY UTILIZING SAME, AND INFORMATION HANDLING SYSTEM UTILIZING SAME
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Patent #:
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Issue Dt:
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01/02/2007
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Application #:
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10882170
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Filing Dt:
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07/02/2004
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Publication #:
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Pub Dt:
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01/05/2006
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Title:
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CIRCUITIZED SUBSTRATE WITH FILLED ISOLATION BORDER, METHOD OF MAKING SAME, ELECTRICAL ASSEMBLY UTILIZING SAME, AND INFORMATION HANDLING SYSTEM UTILIZING SAME
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Patent #:
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Issue Dt:
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07/04/2006
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Application #:
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10915483
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Filing Dt:
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08/11/2004
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Publication #:
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Pub Dt:
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01/20/2005
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Title:
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CIRCUITIZED SUBSTRATE ASSEMBLY AND METHOD OF MAKING SAME
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Patent #:
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Issue Dt:
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12/05/2006
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Application #:
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10920235
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Filing Dt:
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08/18/2004
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Publication #:
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Pub Dt:
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10/13/2005
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Title:
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LOW MOISTURE ABSORPTIVE CIRCUITIZED SUBSTRATE, METHOD OF MAKING SAME, ELECTRICAL ASSEMBLY UTILIZING SAME, AND INFORMATION HANDLING SYSTEM UTILIZING SAME
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Patent #:
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Issue Dt:
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05/31/2005
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Application #:
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10933260
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Filing Dt:
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09/03/2004
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Publication #:
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Pub Dt:
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02/03/2005
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Title:
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INFORMATION HANDLING SYSTEM UTILIZING CIRCUITIZED SUBSTRATE
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Patent #:
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Issue Dt:
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08/08/2006
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Application #:
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10968929
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Filing Dt:
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10/21/2004
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Pub Dt:
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05/11/2006
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Title:
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METHOD OF MAKING A CIRCUITIZED SUBSTRATE HAVING A PLURALITY OF SOLDER CONNECTION SITES THEREON
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Patent #:
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Issue Dt:
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04/11/2006
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Application #:
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11031074
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Filing Dt:
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01/10/2005
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Title:
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CAPACITOR MATERIAL WITH METAL COMPONENT FOR USE IN CIRCUITIZED SUBSTRATES, CIRCUITIZED SUBSTRATE UTILIZING SAME, METHOD OF MAKING SAID CIRCUITIZED SUBSTRATE, AND INFORMATION HANDLING SYSTEM UTILIZING SAID CIRCUITIZED SUBSTRATE
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Patent #:
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12/30/2008
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11086323
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03/23/2005
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Pub Dt:
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10/06/2005
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Title:
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LOW MOISTURE ABSORPTIVE CIRCUITIZED SUBSTRATE WITH REDUCED THERMAL EXPANSION, METHOD OF MAKING SAME, ELECTRICAL ASSEMBLY UTILIZING SAME, AND INFORMATION HANDLING SYSTEM UTILIZING SAME
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Patent #:
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11/06/2007
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11110901
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04/21/2005
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Pub Dt:
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10/26/2006
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Title:
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INTERPOSER FOR USE WITH TEST APPARATUS
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Patent #:
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Issue Dt:
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02/26/2008
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Application #:
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11177413
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07/11/2005
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Publication #:
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Pub Dt:
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01/11/2007
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Title:
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METHOD OF MAKING MULTILAYERED CIRCUITIZED SUBSTRATE ASSEMBLY HAVING SINTERED PASTE CONNECTIONS
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Patent #:
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Issue Dt:
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03/11/2008
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Application #:
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11177442
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07/11/2005
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Publication #:
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Pub Dt:
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01/11/2007
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Title:
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CIRCUITIZED SUBSTRATE WITH SINTERED PASTE CONNECTIONS, MULTILAYERED SUBSTRATE ASSEMBLY, ELECTRICAL ASSEMBLY AND INFORMATION HANDLING SYSTEM UTILIZING SAME
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Patent #:
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Issue Dt:
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04/27/2010
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Application #:
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11183569
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07/18/2005
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Pub Dt:
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12/21/2006
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Title:
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SYSTEM AND METHOD FOR SUPPRESSING IFF RESPONSES IN THE SIDELOBES AND BACKLOBES OF IFF INTERROGATOR ANTENNAS
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Patent #:
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Issue Dt:
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07/31/2012
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Application #:
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11209336
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08/23/2005
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Pub Dt:
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12/13/2007
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Title:
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STEP FREQUENCY HIGH RESOLUTION RADAR
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Patent #:
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Issue Dt:
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05/01/2007
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Application #:
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11216133
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Filing Dt:
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09/01/2005
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Publication #:
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Pub Dt:
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03/01/2007
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Title:
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METHOD AND APPARATUS FOR DEPOSITING CONDUCTIVE PASTE IN CIRCUITIZED SUBSTRATE OPENINGS
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01/09/2007
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11238960
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09/30/2005
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Pub Dt:
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02/02/2006
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Title:
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STACKED CHIP ELECTRONIC PACKAGE HAVING LAMINATE CARRIER AND METHOD OF MAKING SAME
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Patent #:
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10/28/2008
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11244180
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10/06/2005
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Pub Dt:
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01/11/2007
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Title:
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CIRCUITIZED SUBSTRATE WITH SOLER-COATED MICROPARTICLE PASTE CONNECTIONS, MULTILAYERED SUBSTRATE ASSEMBLY, ELECTRICAL ASSEMBLY AND INFORMATION HANDLING SYSTEM UTILIZING SAME AND METHOD OF MAKING SAID SUBSTRATE
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01/05/2010
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11273717
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11/14/2005
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Pub Dt:
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10/19/2006
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Title:
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DUAL CHANNEL SPATIALLY ADAPTIVE CFAR
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10/31/2006
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11281456
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11/18/2005
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Title:
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SUBSTRATE TEST APPARATUS AND METHOD OF TESTING SUBSTRATES
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12/11/2007
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11327493
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01/09/2006
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06/08/2006
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Title:
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METHOD OF TREATING CONDUCTIVE LAYER FOR USE IN A CIRCUITIZED SUBSTRATE AND METHOD OF MAKING SAID SUBSTRATE HAVING SAID CONDUCTIVE LAYER AS PART THEREOF
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08/26/2008
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11349990
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02/09/2006
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06/22/2006
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Title:
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METHOD OF MAKING CIRCUITIZED SUBSTRATE
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03/18/2008
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11349998
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02/09/2006
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06/15/2006
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Title:
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METHOD OF MAKING CIRCUITIZED SUBSTRATE ASSEMBLY
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03/24/2009
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11350777
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02/10/2006
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06/15/2006
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Title:
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INFORMATION HANDLING SYSTEM INCLUDING A CIRCUITIZED SUBSTRATE HAVING A DIELECTRIC LAYER WITHOUT CONTINUOUS FIBERS
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04/20/2010
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11397303
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04/04/2006
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03/08/2007
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Title:
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A METHOD FOR DETECTING A TARGET
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03/25/2008
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11397713
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04/05/2006
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Publication #:
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Pub Dt:
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08/17/2006
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Title:
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METHOD OF PROVIDING PRINTED CIRCUIT BOARD WITH CONDUCTIVE HOLES AND BOARD RESULTING THEREFROM
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Patent #:
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Issue Dt:
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03/16/2010
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Application #:
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11401401
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04/11/2006
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Pub Dt:
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09/28/2006
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Title:
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CIRCUITIZED SUBSTRATE WITH SHIELDED SIGNAL LINES AND PLATED-THRU-HOLES AND METHOD OF MAKING SAME, AND ELECTRICAL ASSEMBLY AND INFORMATION HANDLING SYSTEM UTILIZING SAME
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Patent #:
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01/12/2010
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11419091
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05/18/2006
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05/31/2007
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Title:
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VERTICAL INTER-DIGITAL COUPLER
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02/23/2010
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11455183
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06/19/2006
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Pub Dt:
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10/26/2006
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Title:
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METHOD OF MAKING A MULTI-CHIP ELECTRONIC PACKAGE HAVING LAMINATE CARRIER
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Patent #:
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Issue Dt:
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03/30/2010
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11541776
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10/03/2006
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